公开(公告)号：US20230238769A1

公开(公告)日：2023-07-27

申请号：US17999508

申请日：2021-05-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Tobias Gebuhr ,  Jan Seidenfaden

IPC: H01S5/02255 ,  H01S5/02234 ,  H01S5/02208 ,  H01S5/0232 ,  H01S5/068

CPC classification number: H01S5/02255 ,  H01S5/02234 ,  H01S5/02208 ,  H01S5/0232 ,  H01S5/06825

Abstract: In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.

公开(公告)号：US11705695B2

公开(公告)日：2023-07-18

申请号：US17528177

申请日：2021-11-16

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/02257 ,  H01S5/02345 ,  H01S5/42 ,  H01S5/183 ,  H01S5/068 ,  G02B5/02 ,  G06V20/64 ,  G06V10/145 ,  G06V40/16 ,  H01S5/0687 ,  G02B27/42 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/042 ,  H01S5/02 ,  H01S5/30 ,  H01S5/343 ,  H01S5/20

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/0687 ,  H01S5/06804 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20230216270A1

公开(公告)日：2023-07-06

申请号：US18183506

申请日：2023-03-14

Applicant: NICHIA CORPORATION

Inventor： Kiyoshi ENOMOTO

IPC: H01S5/02216 ,  H01S5/02315 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/02255 ,  H01S5/40

CPC classification number: H01S5/02216 ,  H01S5/02315 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/02255 ,  H01S5/4031 ,  H01S5/4093

Abstract: A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

公开(公告)号：US11658453B2

公开(公告)日：2023-05-23

申请号：US17103470

申请日：2020-11-24

Applicant: Ronald LaComb ,  Kevin LaComb

Inventor： Ronald LaComb ,  Kevin LaComb

IPC: H01S3/083 ,  H01S3/06 ,  H01S3/067 ,  H01S3/0941 ,  H01S5/40 ,  H01S5/10 ,  H01S5/02255 ,  H01S5/042 ,  H01S5/22 ,  H01S5/12 ,  H01S5/20 ,  H01S5/42 ,  H01S5/185

CPC classification number: H01S3/083 ,  H01S3/0627 ,  H01S3/0675 ,  H01S3/0941 ,  H01S5/1075 ,  H01S5/4056 ,  H01S5/02255 ,  H01S5/04254 ,  H01S5/04256 ,  H01S5/12 ,  H01S5/185 ,  H01S5/204 ,  H01S5/2219 ,  H01S5/4075 ,  H01S5/42

Abstract: The present disclosure relates to a three-dimensional cylindrical cavity-type laser system capable of supporting circumferential radial emission. A cylindrical ring waveguide provides optical confinement in the radial and axial dimensions thereby supporting a plurality of radial modes, one of a plurality of axial modes and a plurality of degenerate azimuthal modes. These modes constitute a set of traveling wave modes which propagate around the cylindrical ring waveguide possessing various degrees of optical confinement as quantified by their respective Q-factors. Index tailoring is used to tailor the radial refractive index profile and geometry of the waveguide to support radial modes possessing Q-factors capable of producing efficient radial emission, while gain tailoring is used to define a gain confining region which offsets modal gain factors of the modal constituency to favor a preferred set of modes supporting efficient radial emission out of the total modal constituency supported by the resonator. Under appropriate pump actuation the selected modes produce circumferential laser radiation with the output surface comprising of the entire outer perimeter of the cylindrical ring waveguide. The design is applicable toward both micro-resonators and resonators much larger than the optical wavelength, enabling high output powers and scalability. The circumferential radial laser emission can be concentrated by positioning the cylindrical ring laser inside a three-dimensional conical mirror thereby forming a laser ring of light propagating in the axial dimension away from the surface of the laser, which can be subsequently collimated for focused using conventional optics.

公开(公告)号：US11616345B2

公开(公告)日：2023-03-28

申请号：US16886170

申请日：2020-05-28

Applicant: NICHIA CORPORATION

Inventor： Takuya Hashimoto

IPC: H01S5/02253 ,  H01S5/40 ,  H01S5/024 ,  H01S5/323 ,  H01S5/32 ,  H01S5/02255 ,  H01S5/02345

Abstract: A light emitting device includes: a substrate including a main surface; a first projection positioned on the main surface, the first projection including an upper surface and first and second lateral surfaces, wherein the first lateral surface of the first projection comprises a first reflective part, and the second lateral surface of the first projection comprises a second reflective part; a first laser element configured to irradiate laser light to the first reflective part; a second laser element configured to irradiate laser light to the second reflective part; and a first optical member fixed to the upper surface of the first projection, wherein the first optical member comprises a first lens part positioned above the first reflective part, and a second lens part positioned above the second reflective part.

公开(公告)号：US11552445B2

公开(公告)日：2023-01-10

申请号：US16884532

申请日：2020-05-27

Applicant: Lumentum Operations LLC

Inventor： Albert Yuen

IPC: H01S5/02255 ,  H01S5/42 ,  H01S5/183 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02

Abstract: A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

Applicant: STMicroelectronics PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

Abstract: An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US11476638B2

公开(公告)日：2022-10-18

申请号：US16748246

申请日：2020-01-21

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Ryota Okuno

IPC: H01S5/02345 ,  H01S5/02255 ,  H01S5/40 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/042 ,  H01S5/00

Abstract: A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.

公开(公告)号：US20220329039A1

公开(公告)日：2022-10-13

申请号：US17761999

申请日：2020-07-28

Applicant: Robert Bosch GmbH

Inventor： Stefan Pinter

IPC: H01S5/02257 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02326 ,  H01S5/024

Abstract: A micromechanical optical component having a substrate, a spacer, and a cover, which are positioned one above the other and delimit a hermetically sealed cavity. A semiconductor laser is situated in the cavity, on the substrate. An optical element, which is attached to the spacer, is positioned in a beam path of the semiconductor laser. A method for manufacturing a micromechanical optical component is also described.

公开(公告)号：US11469573B2

公开(公告)日：2022-10-11

申请号：US16779609

申请日：2020-02-02

Applicant: Apple Inc.

Inventor： Keith Lyon ,  Arnaud Laflaquiere

IPC: H01S5/00 ,  H01S5/183 ,  H01S5/02 ,  H01S5/30 ,  H01S5/42 ,  H01S5/02255 ,  H01S5/026 ,  G02B27/42 ,  H01S5/02253 ,  H01S5/02326

Abstract: An optoelectronic device includes a semiconductor substrate having first and second faces. A first array of emitters are formed on the first face of the semiconductor substrate and are configured to emit respective beams of radiation through the substrate. Electrical connections are coupled to actuate selectively first and second sets of the emitters in the first array. A second array of microlenses are formed on the second face of the semiconductor substrate in respective alignment with the emitters in at least one of the first and second sets and are configured to focus the beams emitted from the emitters in the at least one of the first and second sets so that the beams are transmitted from the second face with different, respective first and second focal properties.