公开(公告)号：US20130148311A1

公开(公告)日：2013-06-13

申请号：US13523558

申请日：2012-06-14

Applicant: Chia-Chi CHANG ,  Jang Ping Sheu

Inventor： Chia-Chi CHANG ,  Jang Ping Sheu

IPC: H05K7/02 ,  H05K3/30 ,  H05K3/36 ,  H04B7/00

CPC classification number: H01Q1/2275 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/09972 ,  H05K2201/10098 ,  H05K2201/10159 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: The invention discloses a double-layer PCB of a low power wireless sensing system and a manufacturing method thereof. The low power wireless sensing system includes a first layer and a second layer. The first layer comprises a wireless communication module, a power amplifying module, a USB module, a balun module, an antenna module, a low-frequency oscillator and a high-frequency oscillator. According to the double-layer PCB of the low power wireless sensing system and the manufacturing method thereof, a circuit layout can be performed on the double-layer PCB to reduce volume of the PCB.

Abstract translation: 本发明公开了一种低功率无线传感系统的双层PCB及其制造方法。 低功率无线传感系统包括第一层和第二层。 第一层包括无线通信模块，功率放大模块，USB模块，平衡 - 不平衡变压器模块，天线模块，低频振荡器和高频振荡器。 根据低功率无线传感系统的双层PCB及其制造方法，可以在双层PCB上执行电路布局以减少PCB的体积。

公开(公告)号：US20130140071A1

公开(公告)日：2013-06-06

申请号：US13816690

申请日：2011-07-20

Applicant: Hiroshi Toyao ,  Toru Taura

Inventor： Hiroshi Toyao ,  Toru Taura

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/18 ,  H01P1/047 ,  H05K1/0236 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

Abstract: A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.

Abstract translation: 结构体包括具有第一开口的第一导体; 第二导体，具有与所述第一导体的至少一部分相对的第二开口; 导体通孔，穿过与第一导体和第二导体绝缘的第一开口和第二开口; 第一互连件，设置在第一开口的内部，其一端连接到导体通孔，另一端形成为开口端，并与第二导体相对; 以及第二互连件，设置在第二开口的内部，其一端连接到导体通孔，并且其另一端形成为开口端，并且与第一导体相对。

公开(公告)号：US20130126225A1

公开(公告)日：2013-05-23

申请号：US13813632

申请日：2011-08-26

Applicant: Hiroshi Toyao

Inventor： Hiroshi Toyao

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H01P1/2005 ,  H01P3/085 ,  H01Q15/006 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

Abstract: A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.

Abstract translation: 结构体包括：至少部分彼此相对的第一导体和第二导体; 第三导体，插入在第一导体和第二导体之间，其中至少一部分与第一导体和第二导体相对，并具有第一开口; 设置在所述第一开口的内部的互连; 以及导体，其经由其电连接到第一导体和第二导体并与第三导体电绝缘，其中互连与第一导体和第二导体相对，其一端与第三导体电连接 第一开口的边缘和其另一端形成为开口端。

公开(公告)号：US20130092427A1

公开(公告)日：2013-04-18

申请号：US13479300

申请日：2012-05-24

Applicant: CHENG-SUNG WANG

Inventor： CHENG-SUNG WANG

IPC: H05K1/16

CPC classification number: H05K1/0227 ,  H05K1/0225 ,  H05K1/0243 ,  H05K2201/09972 ,  H05K2201/10015

Abstract: A printed circuit board (PCB) includes a first wiring layer, a second wring layer, a power layer, a grounded layer, dielectric layers between every two active layers, a capacitor, and two through holes. A first portion of the power layer corresponding to the electromagnetic interference source is isolated from the power layer to form an independent power area. A first through hole connects the independent power area to an end of the capacitor, the second through hole connects a second portion of the power area to the other end of the capacitor. When the interference source produces interference, the interference is conducted to the independent power area and conducted to the second portion of the power area via the through holes and the capacitor.

Abstract translation: 印刷电路板（PCB）包括第一布线层，第二布线层，功率层，接地层，每两个有源层之间的电介质层，电容器和两个通孔。 对应于电磁干扰源的功率层的第一部分与功率层隔离以形成独立的功率区。 第一通孔将独立功率区域连接到电容器的一端，第二通孔将电源区域的第二部分连接到电容器的另一端。 当干扰源产生干扰时，干扰被传导到独立的功率区域，并且经由通孔和电容器传导到功率区域的第二部分。

公开(公告)号：US08415002B2

公开(公告)日：2013-04-09

申请号：US12723949

申请日：2010-03-15

Applicant: James A. McCall ,  David Shykind

Inventor： James A. McCall ,  David Shykind

IPC: B32B3/00 ,  H05K1/00

CPC classification number: H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

Abstract: A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

Abstract translation: 一种制造电路板的方法，其可以包括以下步骤：形成具有水平和垂直玻璃纤维的电路板，旋转电路板和切割电路板，使得水平和垂直玻璃纤维与...形成非直角 切割电路板的线。 电路板可以具有位于其上的多个导电迹线，其通过较高玻璃纤维 - 树脂材料的区域和较低的玻璃纤维 - 树脂材料，以帮助减少在多个导电迹线中的信号之间的共模转换的差异。

公开(公告)号：US20130052099A1

公开(公告)日：2013-02-28

申请号：US13572001

申请日：2012-08-10

Applicant: Burkhardt REICHMUTH

Inventor： Burkhardt REICHMUTH

IPC: B01L3/02

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument with a cable holding space in which a printed circuit board cable device is arranged. The printed circuit board cable device has at least one printed circuit board with first and second sides and, arranged in succession, at least one first circuit board section, at least one second circuit board section and at least one third circuit board section, and with the circuit board having a number of conductor tracks arranged in parallel with respect to one another and extending from a first track section arranged in the first circuit board section, via the second circuit board section to the third circuit board section, in which a second track section is arranged, wherein, in the second circuit board section, at least one conductor track is arranged on the first side of the board and at least one track is arranged on the second side.

Abstract translation: 本发明涉及具有电缆保持空间的实验室样品仪器，其中布置有印刷电路板电缆装置。 印刷电路板电缆装置具有至少一个具有第一和第二侧面的印刷电路板，并且连续地布置有至少一个第一电路板部分，至少一个第二电路板部分和至少一个第三电路板部分，并且具有 所述电路板具有相对于彼此并联布置并从布置在所述第一电路板部分中的第一轨道部分经由所述第二电路板部分延伸到所述第三电路板部分的多个导体轨迹，所述第二轨道 其中，在第二电路板部分中，至少一个导体轨道布置在板的第一侧上，并且至少一个轨道布置在第二侧上。

公开(公告)号：US20130044447A1

公开(公告)日：2013-02-21

申请号：US13589668

申请日：2012-08-20

Applicant: Hirotomo Shiozaki ,  Ryusuke Kakoi ,  Toshitaka Kobayashi ,  Kengo Kimura ,  Shin Hasegawa

Inventor： Hirotomo Shiozaki ,  Ryusuke Kakoi ,  Toshitaka Kobayashi ,  Kengo Kimura ,  Shin Hasegawa

IPC: H05K7/02 ,  H05K5/02 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H05K1/05 ,  H05K3/202 ,  H05K2201/09972

Abstract: A circuit member for a vehicle-mountable junction box is accommodated in the vehicle-mountable junction box. The circuit member is a metal core board including a metal core plate as a core. The core plate includes a separated part which is separated from a main part by a separating groove filled with an insulating material. Electronic components are mounted on both of a part including the main part and a part including the separated part.

Abstract translation: 用于车载接线盒的电路部件容纳在车载接线盒中。 电路部件是以金属芯板为核心的金属芯板。 芯板包括分离部分，其通过填充有绝缘材料的分离槽与主要部分分离。 电子部件安装在包括主要部分的部分和包括分离部分的部分的两者上。

公开(公告)号：US20120307468A1

公开(公告)日：2012-12-06

申请号：US13485980

申请日：2012-06-01

Applicant: Tomotaka Suzuki ,  Tsuneo Maebara

Inventor： Tomotaka Suzuki ,  Tsuneo Maebara

IPC: H05K1/18

CPC classification number: H05K1/0256 ,  H02M7/003 ,  H05K1/0216 ,  H05K1/115 ,  H05K7/1432 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2045

Abstract: An electronic apparatus includes a circuit board on which a plurality of electronic components are mounted, and a housing that is provided on the circuit board. The housing includes a mounting member that mounts the housing on the circuit board. The circuit board includes a plurality of circuit regions, an insulating region, and a mounting region. The plurality of electronic components is included in the plurality of circuit regions. The plurality of circuit regions are spaced from one another. The insulating region is located between adjacent circuit regions of the plurality of circuit regions to insulate between the adjacent circuit regions. In the mounting region, the mounting member is mounted on the circuit board. The mounting region is provided in the insulating region located between the adjacent circuit regions in a state where the housing is mounted on the circuit board.

Abstract translation: 电子设备包括其上安装有多个电子部件的电路板和设置在电路板上的壳体。 壳体包括将壳体安装在电路板上的安装构件。 电路板包括多个电路区域，绝缘区域和安装区域。 多个电子部件被包括在多个电路区域中。 多个电路区域彼此间隔开。 绝缘区域位于多个电路区域的相邻电路区域之间，以在相邻电路区域之间绝缘。 在安装区域中，安装构件安装在电路板上。 在壳体安装在电路板上的状态下，安装区域设置在位于相邻电路区域之间的绝缘区域中。

公开(公告)号：US08292488B2

公开(公告)日：2012-10-23

申请号：US12523235

申请日：2007-10-24

Applicant: Kazuki Ohfuku ,  Masashi Miwa ,  Masakazu Takeuchi

Inventor： Kazuki Ohfuku ,  Masashi Miwa ,  Masakazu Takeuchi

IPC: F21V7/04

CPC classification number: H05K1/181 ,  G02B6/0083 ,  G02B6/0091 ,  G02F1/133608 ,  G02F2202/22 ,  H05K1/0259 ,  H05K1/147 ,  H05K2201/09972 ,  H05K2201/10015 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A backlight unit is provided that, for a case where on a mounting board on which a plurality of point light sources are mounted, an electronic component other than those point light sources is mounted, can reduce the occurrence of uneven luminance, with no increase in the size of the backlight unit. This backlight unit (10) is provided with a PWB (6) having at least an LED mounting region (6a) extending along a side surface (3a) of a light guide plate (3). The LED mounting region (6a) of the PWB (6) is, at an end portion thereof on one side, provided with an FPC mounting region (6b) and is, at an end portion thereof on the other side opposite to the one side, provided with a capacitor mounting region (6c) extending along a side surface (3b) perpendicular to the side surface (3a) of the light guide plate (3).

Abstract translation: 提供了一种背光单元，对于安装有多个点光源的安装板上安装除了这些点光源之外的电子部件的情况，可以减少不均匀亮度的发生，而不会增加 背光单元的尺寸。 该背光单元（10）设置有至少具有沿着导光板（3）的侧面（3a）延伸的LED安装区域（6a）的电路板（6）。 PWB（6）的LED安装区域（6a）在其一侧的端部设置有FPC安装区域（6b），并且在其一侧的与该一侧相反的另一侧的端部 设置有沿着垂直于导光板（3）的侧表面（3a）的侧表面（3b）延伸的电容器安装区域（6c）。

公开(公告)号：US20120243255A1

公开(公告)日：2012-09-27

申请号：US13421110

申请日：2012-03-15

Applicant: Koichi YAMAMOTO

Inventor： Koichi YAMAMOTO

IPC: F21V8/00

CPC classification number: G02B6/0083 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/009 ,  G02F1/133615 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0296 ,  H05K3/0061 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: An illumination device including: a support member accommodating therein a light guiding plate, and having a board placement space in a region where being along a longitudinal direction of an end surface of the light guiding plate, and extending from the end surface side of the light guiding plate to a back surface side thereof; and a light source circuit unit including a bendable circuit board including first and second regions, the first region including light emitting chips, and the second region being formed with a densely-packed portion of a wiring pattern of the light emitting chips. The light source circuit unit is placed in the board placement space after being bent to allow the light emitting chips to face the end surface of the light guiding plate, and to allow the densely-packed portion of the wiring pattern to come on the back surface side of the light guiding plate.

Abstract translation: 一种照明装置，包括：支撑部件，其容纳有导光板，并且在沿着所述导光板的端面的长度方向的区域中具有基板放置空间，并且从所述光的端面侧延伸 引导板到其背面侧; 以及光源电路单元，其包括具有第一和第二区域的可弯曲电路板，所述第一区域包括发光芯片，并且所述第二区域形成有所述发光芯片的布线图案的密集部分。 光源电路单元弯曲后放置在板放置空间中，以使发光芯片面对导光板的端面，并且允许布线图案的密集部分进入背面 一侧的导光板。