Abstract:
A working fluid pipe for a temperature control system includes an inner tube unit for a working fluid to flow therethrough, an outer tube unit surrounding the inner tube unit, an air chamber between the inner tube unit and the outer tube unit, and an air inlet and at least one air outlet, which are in communication with the air chamber, for allowing a dry air to enter the air chamber through the air inlet and be vented out of the air chamber from the air outlet. As a result, the working fluid pipe is prevented from frosting and dewing.
Abstract:
A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
Abstract:
A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.
Abstract:
A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
Abstract:
A temperature controlling equipment includes a connection head of a fluid output device, an isolation hood, a drying chamber and a dry air source. The connection head of the fluid output device has an output nozzle and a first fluid output pipe. The isolation hood has a hood body and a second fluid output pipe. The hood body defines a working space. The output nozzle is communicated with the working space. The second fluid output pipe is communicated with the working space and the first fluid output pipe. The first fluid output pipe and the second fluid output pipe have a connection interface in between. The connection interface is at least partially located in the drying chamber. The dry air source is communicated with the drying chamber and is configured to provide a dry air to the drying chamber.
Abstract:
A cooling system includes a cooling device, a controller and a defrosting unit. The cooling device has a compressor, a condenser, an expander, an evaporator, a cooling channel and a coolant. The coolant is functioned in the evaporator to thermally exchange with a working fluid in a pipe. The controller is adapted for controlling the temperature of the working fluid by controlling the cooling device. The defrosting unit has a switch disposed on the cooling channel and located between the compressor and the condenser, and a defrosting channel connected with the switch. After passing through the switch, the coolant is optionally fed to anyone of the cooling channel and the defrosting channel. After flowing through the defrosting channel, the coolant passes through the evaporator and then flows back to the compressor. As a result, the cooling system is capable of fast defrosting without using a heater.
Abstract:
An adaptive temperature control system for cooling a working fluid at a target temperature includes a cooling device and a controller. The cooling device includes a compressor having a motor, a condenser having a fan, an expander, an evaporator, a coolant, and an inverter electrically connected with the motor of the compressor. The coolant in the evaporator is functioned to thermally exchange with the working fluid, thereby cooling the working fluid passing by the evaporator. The controller controls the rotary speeds of the motor and the fan according to a plurality of system parameters, optionally including the target temperature, a temperature in the evaporator, a mass flow of the working fluid, inlet and outlet pressures of compressor, and a temperature of the working fluid obtained at a sense position where the working fluid has passed by the evaporator.
Abstract:
A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
Abstract:
A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.
Abstract:
An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.