公开(公告)号：US09179248B2

公开(公告)日：2015-11-03

申请号：US13846917

申请日：2013-03-18

Applicant: MCUBE, INC.

Inventor： Joseph M. Kelly ,  John E. Acheson

IPC: H04W4/02 ,  H04W64/00 ,  G01S5/14

CPC classification number: H04W4/02 ,  G01S5/14 ,  H04W64/00 ,  Y02D70/1246 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164

Abstract: A computer-implemented method and device for determining a user position, implemented in a user handheld computing device programmed to perform the method. The method includes solving for the position of a user based on ranges, which are computed by estimating power loss between a user and a number of Wi-Fi Access Points. Embodiments of the present invention includes a method that is designed to accommodate the non-linear nature of solving a position solution using power estimates. This method includes solving a two-dimensional solution grid of position residuals, or magnitudes of error between true and computed ranges, using signal strength measurements from multiple Wi-Fi access points in order to determine local minima of the position residuals indicating a user position. Standard approaches in the area such as a Least Squares Solution overly simplify the non-linear components resulting in poor performance.

Abstract translation: 一种用于确定用户位置的计算机实现的方法和装置，其在被​​编程为执行所述方法的用户手持计算设备中实现。 该方法包括基于通过估计用户与多个Wi-Fi接入点之间的功率损耗来计算的范围来解决用户的位置。 本发明的实施例包括一种被设计为适应使用功率估计求解位置解的非线性特性的方法。 该方法包括使用来自多个Wi-Fi接入点的信号强度测量来求解位置残差的二维解网格或真实和计算范围之间的误差大小，以便确定指示用户位置的位置残差的局部最小值。 最小二乘解决方案中的标准方法过度简化了非线性元件，导致性能不佳。

公开(公告)号：US20150285637A1

公开(公告)日：2015-10-08

申请号：US14152890

申请日：2014-01-10

Applicant: mCube Inc.

Inventor： Joseph M. Kelly

IPC: G01C21/12 ,  H04W4/00

CPC classification number: G01C21/12 ,  G01C21/165 ,  H04W4/80

Abstract: A method and system for operating a hand-held computer system for navigation. Embodiments of the present invention includes novel improvements to a navigation method and implementation through a device, which can include inertial and/or magnetic field sensors integrated within a hand held device. The method can include using a single-fix method or a dual-fix method. The single fix method includes monitoring travel distance or time for a pre-specified condition and updating the heading from a dead reckoning process based on a first position fix by using a map. The dual-fix method includes obtaining a second position fix and updating the heading based on the difference in displacement vectors from the dead reckoning process based on the first position fix.

Abstract translation: 一种用于操作用于导航的手持计算机系统的方法和系统。 本发明的实施例包括对通过装置的导航方法和实现的新颖改进，其可以包括集成在手持装置内的惯性和/或磁场传感器。 该方法可以包括使用单一修复方法或双重修复方法。 单一修复方法包括监视预定条件的行驶距离或时间，并且基于通过使用地图的第一位置定位来更新来自航位推算过程的航向。 双重定位方法包括：基于第一位置锁定，基于来自航位推算过程的位移矢量的差异来获得第二定位并更新标题。

公开(公告)号：US20150284245A1

公开(公告)日：2015-10-08

申请号：US14267864

申请日：2014-05-01

Applicant: mCube Inc.

Inventor： RAYMOND MERRILL, JR. ,  DAVE PAUL JENSEN ,  YUAN-CHUN LIU

IPC: B81C99/00

CPC classification number: B81C99/004 ,  B81C99/0035 ,  B81C99/005

Abstract: A centrifuge screening system and method of testing MEMS devices using the system. The wafer level centrifuge screening system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to one or more MEMS components via the base centrifuge system. Each of the one or more MEMS components can have one or more MEMS devices formed thereon. The one or more MEMS components can be provided in one or more cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS components, which can include identifying stiction in one or more MEMS devices on the one or more MEMS components.

Abstract translation: 使用该系统的离心机筛选系统和测试MEMS装置的方法。 晶片级离心机筛选系统可以包括底座离心机系统和联接到基础离心机系统的盒安装毂。 该方法可以包括通过基本离心机系统向一个或多个MEMS组件施加平滑且连续的加速度曲线。 所述一个或多个MEMS组件中的每一个可以具有形成在其上的一个或多个MEMS器件。 一个或多个MEMS组件可以设置在配置在盒安装毂上的一个或多个盒中。 该方法还可以包括识别一个或多个目标MEMS组件，其可以包括识别一个或多个MEMS组件上的一个或多个MEMS装置中的静摩擦。

公开(公告)号：US20150276407A1

公开(公告)日：2015-10-01

申请号：US14160549

申请日：2014-01-21

Applicant: mCube Inc.

Inventor： SANJAY BHANDARI

IPC: G01C19/5712 ,  B81B7/02 ,  B81B7/00

CPC classification number: G01C19/5776 ,  G01C19/5783 ,  G01P15/18

Abstract: A system comprising an integrated multi-axis MEMS inertial sensor architecture. The system can include a MEMS gyroscope having a MEMS resonator and a MEMS accelerometer overlying a CMOS IC substrate. The CMOS IC substrate can include low noise Charge Sense amplifiers to process the sensed signals, programmable gain amplifiers, a demodulator, mixer, an AGC loop circuit coupled to the MEMS gyroscope to drive MEMS resonator. The CMOS IC also includes programmable Quadrature cancellation, Analog and digital phase shifters are implemented in the architecture to ensure quadrature cancellation and demodulation to achieve optimal performance. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude while consuming low power. The MEMS gyroscope and accelerometer can be coupled to an input multiplexer configured to operate in a time-multiplexed manner.

Abstract translation: 包括集成的多轴MEMS惯性传感器架构的系统。 该系统可以包括具有MEMS谐振器的MEMS陀螺仪和覆盖在CMOS IC衬底上的MEMS加速度计。 CMOS IC衬底可以包括用于处理感测信号的低噪声Charge Sense放大器，可编程增益放大器，解调器，混频器，耦合到MEMS陀螺仪的AGC环路以驱动MEMS谐振器。 CMOS IC还包括可编程正交取消，模拟和数字移相器在架构中实现，以确保正交消除和解调以实现最佳性能。 AGC环路的作用方式使得驱动信号中产生的期望信号幅度在消耗低功率的同时将MEMS谐振器速度保持在期望的频率和幅度。 MEMS陀螺仪和加速度计可以耦合到配置为以时间复用方式操作的输入多路复用器。

公开(公告)号：US08981560B2

公开(公告)日：2015-03-17

申请号：US13923011

申请日：2013-06-20

Applicant: mCube, Inc.

Inventor： Dave Paul Jensen ,  Hong Wan ,  Jon Ewanich

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B81B3/00

CPC classification number: H01L24/05 ,  B81B3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/1145 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01047

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Abstract translation: 用于使用具有互连的垂直安装来制造传感器或电子设备的方法和结构。 该方法包括提供所形成的装置，其包括形成在模具构件上的至少一个传感器或电子装置，其具有在其上形成有一个或多个导电材料的接触区域。 所得到的器件然后可以在接触区域的附近被单个化，以形成一个或多个单个模具，每一个具有单个的表面区域。 单个模具可以耦合到具有第一表面区域的衬底构件，使得单个模具的单个表面区域耦合到第一表面区域的一部分。 可以使用导电粘合剂，焊接工艺或其它导电接合工艺在管芯和衬底构件之间形成互连。

公开(公告)号：US20140370638A1

公开(公告)日：2014-12-18

申请号：US14302385

申请日：2014-06-11

Applicant: mCube Inc.

Inventor： TE-HSI "TERRENCE" LEE ,  Sudheer S. Sridharamurthy ,  Shingo Yoneoka ,  Wenhua Zhang

IPC: B81C1/00

CPC classification number: B81B7/0022 ,  B81B3/0086 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2207/11 ,  B81C1/00246 ,  B81C1/0038 ,  B81C1/00531 ,  B81C1/00801 ,  B81C2201/053

Abstract: A method for fabricating an integrated MEMS-CMOS device. The method can include providing a substrate member having a surface region and forming a CMOS IC layer having at least one CMOS device overlying the surface region. A bottom isolation layer can be formed overlying the CMOS IC layer and a shielding layer and a top isolation layer can be formed overlying a portion of bottom isolation layer. The bottom isolation layer can include an isolation region between the top isolation layer and the shielding layer. A MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer, and can be etched to form at least one MEMS structure having at least one movable structure and at least one anchored structure.

Abstract translation: 一种用于制造集成MEMS-CMOS器件的方法。 该方法可以包括提供具有表面区域的衬底构件，并形成具有覆盖在表面区域上的至少一个CMOS器件的CMOS IC层。 可以形成覆盖CMOS IC层的底部隔离层，并且可以形成覆盖在底部隔离层的一部分上的屏蔽层和顶部隔离层。 底部隔离层可以包括顶部隔离层和屏蔽层之间的隔离区域。 覆盖顶部隔离层，屏蔽层和底部隔离层的MEMS层，并且可被蚀刻以形成具有至少一个可移动结构和至少一个锚定结构的至少一个MEMS结构。

公开(公告)号：US20140290331A1

公开(公告)日：2014-10-02

申请号：US14222575

申请日：2014-03-21

Applicant: mCube Inc.

Inventor： Raymond Merrill, JR. ,  David Paul Jensen

IPC: B81C99/00 ,  G01N19/02 ,  G01P13/00

CPC classification number: G01N19/02 ,  B81C99/005

Abstract: A wafer level centrifuge (WLC) system and method of testing MEMS devices using the system. The wafer level centrifuge (WLC) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to two or more MEMS wafers via the base centrifuge system. Each of the two or more MEMS wafers can have one or more MEMS devices formed thereon. The two or more MEMS wafers can be provided in two or more wafer holding cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS wafers, which can include identifying stiction in one or more MEMS devices on the one or more MEMS wafers.

Abstract translation: 晶圆级离心机（WLC）系统和使用该系统测试MEMS器件的方法。 晶片级离心机（WLC）系统可以包括基础离心机系统和联接到基础离心机系统的盒式安装毂。 该方法可以包括通过基本离心机系统向两个或更多个MEMS晶片施加平滑且连续的加速度曲线。 两个或更多个MEMS晶片中的每一个可以具有形成在其上的一个或多个MEMS器件。 两个或更多个MEMS晶片可以设置在配置在盒安装毂上的两个或更多个晶片保持盒中。 该方法还可以包括识别一个或多个目标MEMS晶片，其可以包括识别一个或多个MEMS晶片上的一个或多个MEMS器件中的静摩擦。

公开(公告)号：US08592993B2

公开(公告)日：2013-11-26

申请号：US13751014

申请日：2013-01-25

Applicant: MCube Inc.

Inventor： Xiao (Charles) Yang

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L23/488 ,  B81B2207/015 ,  B81B2207/098 ,  B81C1/00246 ,  H01L24/03 ,  H01L24/05 ,  H01L29/0657 ,  H01L2224/0556 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A monolithic integrated electronic device includes a substrate having a surface region and one or more integrated micro electro-mechanical systems and electronic devices provided on a first region overlying the surface region. Each of the integrated micro electro-mechanical systems and electronic devices has one or more contact regions. The first region has a first surface region. One or more trench structures are disposed within one or more portions of the first region. A passivation material overlies the first region and the one or more trench structures. A conduction material overlies the passivation material, the one or more trench structures, and one or more of the contact regions. The device also has one or more edge bond pad structures within a vicinity of the one or more bond pad structures, which are formed by a singulation process within a vicinity of the one or more bond pad structures.

Abstract translation: 单片集成电子设备包括具有表面区域的基板和设置在覆盖表面区域的第一区域上的一个或多个集成微电子机械系统和电子设备。 集成微电子机械系统和电子设备中的每一个具有一个或多个接触区域。 第一区域具有第一表面区域。 一个或多个沟槽结构设置在第一区域的一个或多个部分内。 钝化材料覆盖在第一区域和一个或多个沟槽结构之间。 导电材料覆盖钝化材料，一个或多个沟槽结构以及一个或多个接触区域。 该装置还在一个或多个接合焊盘结构的附近具有一个或多个边缘焊接结构，其通过在一个或多个接合焊盘结构附近的单一化工艺形成。

公开(公告)号：US20130277836A1

公开(公告)日：2013-10-24

申请号：US13923011

申请日：2013-06-20

Applicant: MCube, Inc.

Inventor： DAVE PAUL JENSEN ,  HONG WAN ,  JON EWANICH

IPC: H01L23/00

CPC classification number: H01L24/05 ,  B81B3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/1145 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01047

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Abstract translation: 用于使用具有互连的垂直安装来制造传感器或电子设备的方法和结构。 该方法包括提供所形成的装置，其包括形成在模具构件上的至少一个传感器或电子装置，其具有在其上形成有一个或多个导电材料的接触区域。 所得到的器件然后可以在接触区域的附近被单个化，以形成一个或多个单个模具，每一个具有单个的表面区域。 单个模具可以耦合到具有第一表面区域的衬底构件，使得单个模具的单个表面区域耦合到第一表面区域的一部分。 可以使用导电粘合剂，焊接工艺或其它导电接合工艺在管芯和衬底构件之间形成互连。

公开(公告)号：US11255871B1

公开(公告)日：2022-02-22

申请号：US16530923

申请日：2019-08-02

Applicant: mCube, Inc.

Inventor： Sanjay Bhandari ,  Giovanni Bellusci

IPC: G01P15/08 ,  G01P21/00 ,  B81B7/00 ,  G01P15/18

Abstract: A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.