公开(公告)号：US20240075583A1

公开(公告)日：2024-03-07

申请号：US18505871

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US11897079B2

公开(公告)日：2024-02-13

申请号：US16831436

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B55/03 ,  B24B37/10 ,  H01L21/306 ,  B24B49/14 ,  B24B37/04

CPC classification number: B24B37/015 ,  B24B37/105 ,  B24B55/03 ,  B24B37/042 ,  B24B49/14 ,  H01L21/30625

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

公开(公告)号：US20240017376A1

公开(公告)日：2024-01-18

申请号：US18352446

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B49/04 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

CPC classification number: B24B49/045 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US20230390894A1

公开(公告)日：2023-12-07

申请号：US17963099

申请日：2022-10-10

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Steven M. Zuniga ,  Brian J. Brown

IPC: B24B53/017 ,  B24B41/00 ,  B24B57/04 ,  B24B37/04 ,  B24B53/00 ,  B24B55/02

CPC classification number: B24B53/017 ,  B24B41/005 ,  B24B57/04 ,  B24B37/042 ,  B24B53/003 ,  B24B55/02

Abstract: A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a compressed gas stream, a mixer coupled to the source and the compressor to mix the dry ice particles with the compressed gas stream to form a stream of compressed gas with entrained dry ice particles, and a nozzle coupled to the mixer to direct the stream of compressed gas with entrained dry ice particles onto a polishing surface of the polishing pad at sufficient velocity to condition the polishing pad.

公开(公告)号：US11823916B2

公开(公告)日：2023-11-21

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/67248 ,  H01L21/68721

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20230356355A1

公开(公告)日：2023-11-09

申请号：US17735674

申请日：2022-05-03

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Brian J. Brown ,  Huanbo Zhang ,  Andrew Nagengast ,  Steven M. Zuniga ,  Ekaterina A. Mikhaylichenko ,  Eric L. Lau ,  Jay Gurusamy ,  David J. Lischka

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/042

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first surface that faces the carrier body and a second surface opposite the first surface. The carrier heads may include at least one downforce control actuator disposed above the first surface of the inner ring at a discrete position about a circumference of the inner ring.

公开(公告)号：US20220359219A1

公开(公告)日：2022-11-10

申请号：US17735021

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Brian J. Brown ,  Alexander John Fisher ,  Hari Soundararajan ,  Mayu Felicia Yamamura

IPC: H01L21/306

Abstract: A method of processing a substrate includes selectively dispensing a treatment fluid on a die-by-die basis to onto a substrate, and chemical mechanical polishing the substrate after dispensing the treatment fluid. The treatment fluid modifies a polishing rate of the chemical mechanical polishing at one or more selected die(s) to which the treatment fluid is applied in comparison to one or more remaining die(s) to which the treatment fluid is not applied.

公开(公告)号：US20220148892A1

公开(公告)日：2022-05-12

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US10256120B2

公开(公告)日：2019-04-09

申请号：US14523827

申请日：2014-10-24

Applicant: Applied Materials, Inc.

Inventor： Clinton P. Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Brian J. Brown ,  Jianshe Tang ,  Yufei Chen ,  Yunshuang Ding

IPC: H01L21/00 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04

Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

公开(公告)号：US09486893B2

公开(公告)日：2016-11-08

申请号：US14285545

申请日：2014-05-22

Applicant: Applied Materials, Inc.

Inventor： Hung Chen ,  Rajeev Bajaj ,  Brian J. Brown ,  Robert T. Lum ,  Fred C. Redeker

IPC: H01L21/302 ,  B24B53/017 ,  B24B37/26 ,  B26F3/00 ,  B23K26/36 ,  B26D3/06

CPC classification number: B24B53/017 ,  B23K26/36 ,  B24B37/26 ,  B26D3/06 ,  B26F3/004

Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.

Abstract translation: 除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。 抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。 一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。 该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。