公开(公告)号：US20090301763A1

公开(公告)日：2009-12-10

申请号：US12331481

申请日：2008-12-10

Applicant: CHENG-HSIEN LIN ,  RUI ZHANG ,  YAO-WEN BAI

Inventor： CHENG-HSIEN LIN ,  RUI ZHANG ,  YAO-WEN BAI

IPC: B05D3/06 ,  C09D11/00 ,  H05K1/00

CPC classification number: H05K3/105 ,  C09D11/52 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/32 ,  C23C18/40 ,  C23C18/405 ,  H05K3/185 ,  H05K2203/013

Abstract: An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles.

Abstract translation: 用于形成电迹线的示例性油墨包括通过将含贵金属离子的水溶液与各自包含亲水基团和亲油基团的二乙炔单体组合而形成的多个贵金属涂覆的二乙炔泡沫。 贵金属离子被吸引到每个二乙炔泡的外表面。

公开(公告)号：US20090291230A1

公开(公告)日：2009-11-26

申请号：US12468066

申请日：2009-05-19

Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

IPC: B05D3/06 ,  C09D11/02 ,  C08K3/10

CPC classification number: C09D11/102 ,  C09D11/52 ,  C23C18/06 ,  C23C18/08 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/204 ,  C23C18/405 ,  H05K3/105 ,  H05K3/182 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1157 ,  H05K2203/125

Abstract: A silver-containing ink includes an aqueous carrier medium having both a silver salt and an amine sensitizer for the silver salt dissolved therein, and a light sensitive reducing agent dispersed in the aqueous carrier medium. The amine sensitizer includes at one or more amine group; and the light sensitive reducing agent is capable of reducing the silver in the silver-containing ink to silver particles when irradiated.

Abstract translation: 含银油墨包括具有溶解银盐的银盐和胺敏化剂的水性载体介质和分散在载体介质中的光敏还原剂​​。 胺敏化剂包括一个或多个胺基团; 并且光敏还原剂​​能够在照射时将含银墨水中的银还原成银颗粒。

公开(公告)号：US20090175713A1

公开(公告)日：2009-07-09

申请号：US12202551

申请日：2008-09-02

Applicant: YA-LING FAN ,  CHING-HUNG PI ,  CHENG-TA TU ,  CHIH-YI TU ,  CHENG-HSIEN LIN

Inventor： YA-LING FAN ,  CHING-HUNG PI ,  CHENG-TA TU ,  CHIH-YI TU ,  CHENG-HSIEN LIN

IPC: B65G47/248

CPC classification number: B65G47/252 ,  H05K13/0061

Abstract: The present invention relates to a board inverter and a boarding inverting system. The board inverter includes a support, a first board picking device, an second board picking device and a controller. Each of the first board picking device and the second board picking device includes a driving mechanism and a first board picking device. The driving mechanism comprises a first linear driving means mounted on the support, a second linear driving means mechanically coupled to the first linear driving means, and a rotary driving means attached to the second linear driving means. The controller is connected to all the power supply members. The controller controls the motion of the first board picking device and the second board picking device such that the first board picking device and the second board picking device cooperatively inverting workpieces transmitted on a production line. The board inverter can be installed on a production line without altering the arrangement of existing production line.

Abstract translation: 本发明涉及一种电路板逆变器和一个登机翻转系统。 板式逆变器包括支撑件，第一板拾取装置，第二板拾取装置和控制器。 第一板拾取装置和第二板拾取装置中的每一个包括驱动机构和第一板拾取装置。 所述驱动机构包括安装在所述支撑件上的第一线性驱动装置，机械地联接到所述第一线性驱动装置的第二线性驱动装置和附接到所述第二线性驱动装置的旋转驱动装置。 控制器连接到所有电源部件。 控制器控制第一板拾取装置和第二板拾取装置的运动，使得第一板拾取装置和第二板拾取装置协同地转换在生产线上传送的工件。 板式变频器可以安装在生产线上，而不改变现有生产线的布置。

公开(公告)号：US20090014204A1

公开(公告)日：2009-01-15

申请号：US12106513

申请日：2008-04-21

Applicant: MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

Inventor： MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K3/281 ,  H05K2201/09145

Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Abstract translation: 柔性印刷电路板包括基底和覆盖物。 基部包括与主要部分连接的主要部分和远端部分。 远侧部分具有第一部分和第二暴露部分。 覆盖层形成在基部上并覆盖远端部分的主要部分和第一部分。 远端部分的第二暴露部分被覆盖物覆盖。 覆盖物包括用作远端部分的第一部分和第二部分之间的界面的弯曲边缘。

公开(公告)号：US20100139966A1

公开(公告)日：2010-06-10

申请号：US12702439

申请日：2010-02-09

Applicant: CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K1/11

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T428/15

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.

Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。

公开(公告)号：US20100129532A1

公开(公告)日：2010-05-27

申请号：US12570040

申请日：2009-09-30

Applicant: YAO-WEN BAI ,  CHENG-HSIEN LIN

Inventor： YAO-WEN BAI ,  CHENG-HSIEN LIN

IPC: B05D5/12

CPC classification number: H05K3/105 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/44 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125

Abstract: A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.

Abstract translation: 在衬底上形成电迹线的方法包括以下步骤：提供衬底; 在基板上使用油墨印刷油墨图案，所述油墨包括含有银离子的水性介质和热敏还原剂; 加热油墨图案以将银离子还原成银颗粒，从而形成半成品痕迹; 并通过化学镀在半成品迹线上形成金属外涂层，从而获得图案化的电迹线。

公开(公告)号：US20100044237A1

公开(公告)日：2010-02-25

申请号：US12426276

申请日：2009-04-19

Applicant: CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

IPC: C25D5/02 ,  C25D7/00

CPC classification number: H05K3/427 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0346

Abstract: A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled.

Abstract translation: 涉及PCB的制造方法。 该方法包括向基板提供两个相对的导电层并限定穿过两个导电层的通孔; 使用无电镀工艺在所述通孔中的所述基板的内表面上形成第一导电金属层; 在所述第一导电金属层上使用电镀工艺形成第二导电金属层，直到所述通孔被填充。

公开(公告)号：US20090260867A1

公开(公告)日：2009-10-22

申请号：US12332321

申请日：2008-12-10

Applicant: PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/0097 ,  H05K3/0082 ,  H05K3/064 ,  H05K2203/1554 ,  Y10T29/49162

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract translation: 印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板绕等角度地布置在 圆圈和每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

公开(公告)号：US20090014031A1

公开(公告)日：2009-01-15

申请号：US11967006

申请日：2007-12-29

Applicant: TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIH-LUNG HSIAO ,  CHENG-HSIEN LIN

Inventor： TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIH-LUNG HSIAO ,  CHENG-HSIEN LIN

IPC: B08B1/02

CPC classification number: H05K3/26 ,  H05K2203/0143 ,  H05K2203/0191 ,  H05K2203/1545

Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.

Abstract translation: 本发明涉及一种用于印刷电路板的清洁装置。 清洁装置包括基座，固定到基座的夹板，至少一个保持构件，至少一个清洁辊和驱动机构。 保持构件弹性地支撑在基座上。 所述至少一个清洁辊分别枢转地设置在所述至少一个保持构件上。 清洁辊包括附接到清洁辊的表面的清洁层。 夹紧板与清洁辊相对并离开一段距离。 所述驱动机构与所述清洁辊连接并构造成驱动所述清洁辊旋转。 清洁装置可以高效地清洁印刷电路板。

公开(公告)号：US20090007421A1

公开(公告)日：2009-01-08

申请号：US11959194

申请日：2007-12-18

Applicant: CHIA-CHENG CHEN ,  CHAO-CHING WANG ,  CHIANG-HUA HUANG ,  CHENG-HSIEN LIN

Inventor： CHIA-CHENG CHEN ,  CHAO-CHING WANG ,  CHIANG-HUA HUANG ,  CHENG-HSIEN LIN

IPC: H01R43/00

CPC classification number: H05K3/281 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/027 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/1545 ,  H05K2203/166 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract translation: 提供了制造柔性印刷电路板的示例性方法。 从第一供给辊供给金属箔。 金属箔在金属箔的两个相对侧上具有第一表面和第二表面。 具有限定在其中的多个第一开口的第一覆盖物从第二馈电辊供应并层压在金属箔的第一表面上。 用金属箔形成电迹线。 具有限定在其中的多个第二开口的第二覆盖物从第三进料辊供应并层压在金属箔的第二表面上。 每个第二开口与相应的第一开口对准，使得电迹线从相应的第一和第二开口露出。 该方法可以提高以空心形式制造柔性印刷电路板的质量和效率。