公开(公告)号：US06377723B1

公开(公告)日：2002-04-23

申请号：US09660942

申请日：2000-09-13

申请人： Tsunetoshi Saito ,  Toshihiko Ohta

发明人： Tsunetoshi Saito ,  Toshihiko Ohta

IPC分类号： G02B626

CPC分类号： G02B6/1203

摘要： A plate-shaped member (8a) whose linear expansion coefficient is larger than that of a substrate (1) is provided on the rear side of the substrate (1) of an arrayed waveguide diffraction grating (11) which divides, by a diffraction effect of an array waveguide (40), lights of a plurality of wavelengths from those having a plurality of wavelengths different from each other, which are inputted from an optical input waveguide (2), and outputs these lights from the respective optical output waveguides (6). A light transmission feature of the respective output lights includes a light transmission feature for causing lights to be transmitted, centering around the center wavelengths of light transmission, which are different from each other, wherein the center wavelengths of light transmission shifts to the long wavelength side by a temperature rise.

摘要翻译： 在阵列波导衍射光栅（11）的基板（1）的背面侧设置线膨胀系数大于基板（1）的板状部件（8a），其通过衍射效应 阵列波导（40）的多个波长的光从具有从光输入波导（2）输入的具有彼此不同的多个波长的波长的光，并且从各个光输出波导（6）输出 ）。 各个输出光的透光特征包括使透过光的透射特征，以相互不同的光透射中心波长为中心，其中光透射的中心波长偏移到长波长侧 温度升高。

公开(公告)号：US06269998B1

公开(公告)日：2001-08-07

申请号：US09704784

申请日：2000-11-03

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K3102

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81022 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174 ,  H01L2924/00

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

摘要翻译： 电子电路的制造方法包括将电子器件设置在电路基板上，对形成在电子器件或电路基板上的焊料进行热熔融，使电子器件和电路基板接合。 该方法包括以下步骤：将液体供给到电路基板上的焊盘上，将电子设备对准和安装在焊盘上，将电路基板放置在处理容器中并加热电路基板。 加热步骤包括控制处理容器中的气氛的压力，热熔焊料以防止液体的至少一部分蒸发直到电子器件和电路基板接合，并允许液体在 电子器件和电路基板结合。

公开(公告)号：US6161748A

公开(公告)日：2000-12-19

申请号：US538515

申请日：2000-03-30

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00 ,  B23K31/02

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81022 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174 ,  H01L2924/00

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

公开(公告)号：US06133135A

公开(公告)日：2000-10-17

申请号：US322998

申请日：1999-06-01

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

公开(公告)号：US6046891A

公开(公告)日：2000-04-04

申请号：US22120

申请日：1998-02-11

申请人： Hiroaki Yoda ,  Yuichi Ohsawa ,  Kohichi Tateyama ,  Reiko Kondoh ,  Toshihiko Ohta ,  Junichi Akiyama ,  Hitoshi Iwasaki

发明人： Hiroaki Yoda ,  Yuichi Ohsawa ,  Kohichi Tateyama ,  Reiko Kondoh ,  Toshihiko Ohta ,  Junichi Akiyama ,  Hitoshi Iwasaki

IPC分类号： G11B5/00 ,  G11B5/127 ,  G11B5/31 ,  G11B5/39

CPC分类号： B82Y10/00 ,  B82Y25/00 ,  G11B5/1278 ,  G11B5/3903 ,  G11B5/3912 ,  G11B5/3919 ,  G11B5/399 ,  G11B2005/0016 ,  G11B2005/0018 ,  G11B2005/3996 ,  G11B5/3163 ,  G11B5/3932 ,  G11B5/3967 ,  Y10T29/49025

摘要： The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films, a nonmagnetic film sandwiched between the magnetic films, and leads connected to the magnetoresistance effect element wherein the width of one of the magnetic films, which essentially responds to a signal magnetic field, is not more than a distance between leads. The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films and a nonmagnetic film sandwiched between the magnetic films, which makes use of a change in magnetic resistance caused by spin-dependent scattering, wherein at least a portion of one magnetic films, which essentially respond to a signal magnetic field, extends in a direction same as that of the signal magnetic field.

摘要翻译： 本发明提供了一种具有磁阻效应元件的薄膜头，该磁阻效应元件包括至少两个磁性膜，夹在磁性膜之间的非磁性膜和连接到磁阻效应元件的引线，其中一个磁性膜的宽度基本上 响应信号磁场，不超过引线之间的距离。 本发明提供了具有磁阻效应元件的薄膜头，该磁阻效应元件包括至少两个磁性膜和夹在磁性膜之间的非磁性膜，其利用由自旋依赖性散射引起的磁阻的变化，其中至少一个 基本上响应于信号磁场的一个磁性膜的部分在与信号磁场相同的方向上延伸。

公开(公告)号：US5905611A

公开(公告)日：1999-05-18

申请号：US848733

申请日：1997-05-22

申请人： Hiroaki Yoda ,  Yuichi Ohsawa ,  Kohichi Tateyama ,  Reiko Kondoh ,  Toshihiko Ohta ,  Junichi Akiyama ,  Hitoshi Iwasaki

发明人： Hiroaki Yoda ,  Yuichi Ohsawa ,  Kohichi Tateyama ,  Reiko Kondoh ,  Toshihiko Ohta ,  Junichi Akiyama ,  Hitoshi Iwasaki

IPC分类号： G11B5/00 ,  G11B5/127 ,  G11B5/31 ,  G11B5/39

CPC分类号： B82Y10/00 ,  B82Y25/00 ,  G11B5/1278 ,  G11B5/3903 ,  G11B5/3912 ,  G11B5/3919 ,  G11B5/399 ,  G11B2005/0016 ,  G11B2005/0018 ,  G11B2005/3996 ,  G11B5/3163 ,  G11B5/3932 ,  G11B5/3967 ,  Y10T29/49025

摘要： The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films, a nonmagnetic film sandwiched between the magnetic films, and leads connected to the magnetoresistance effect element wherein the width of one of the magnetic films, which essentially responds to a signal magnetic field, is not more than a distance between leads. The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films and a nonmagnetic film sandwiched between the magnetic films, which makes use of a change in magnetic resistance caused by spin-dependent scattering, wherein at least a portion of one magnetic films, which essentially respond to a signal magnetic field extends in a direction same as that of the signal magnetic field.

摘要翻译： 本发明提供了一种具有磁阻效应元件的薄膜头，该磁阻效应元件包括至少两个磁性膜，夹在磁性膜之间的非磁性膜和连接到磁阻效应元件的引线，其中一个磁性膜的宽度基本上 响应信号磁场，不超过引线之间的距离。 本发明提供了具有磁阻效应元件的薄膜头，该磁阻效应元件包括至少两个磁性膜和夹在磁性膜之间的非磁性膜，其利用由自旋依赖性散射引起的磁阻的变化，其中至少一个 基本上响应于信号磁场的一个磁性膜的部分在与信号磁场的方向相同的方向上延伸。

公开(公告)号：US5731066A

公开(公告)日：1998-03-24

申请号：US546795

申请日：1995-10-23

申请人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

发明人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

IPC分类号： H05K1/09 ,  B23K1/00 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  B32B15/00 ,  B23K31/02 ,  H01R9/09

CPC分类号： H01L23/49811 ,  B23K1/0016 ,  H05K1/111 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/098 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  Y02P70/611 ,  Y10T428/24926

摘要： In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

摘要翻译： 在具有输入/输出引脚接合电极的电子电路装置中，为了显着地改善诸如润湿性和接合强度的接合特性并且大大简化了制造工艺，在形成玻璃陶瓷用于板的电子电路板 材料和布线导体和接合电极，其中Cu的尺寸设置成延伸超过针孔，使得焊料仅与其接触而不是陶瓷电路板。 在使用基板材料的电极上形成覆盖层时，以相同的工序形成布线和接合电极，根据需要在该电极上形成Au或Au-Ni层叠膜，然后使用 焊接如Au-Sn或Au-Ge。

公开(公告)号：US4673724A

公开(公告)日：1987-06-16

申请号：US804419

申请日：1985-12-04

申请人： Seiji Endoh ,  Kunio Kimura ,  Toshihiko Ohta ,  Yasuo Kato

发明人： Seiji Endoh ,  Kunio Kimura ,  Toshihiko Ohta ,  Yasuo Kato

IPC分类号： C08G63/06 ,  C08G65/38

CPC分类号： C08G63/065

摘要： A crystalline polymeric whisker comprising repeating units derived from a compound selected from the group consisting of p-oxybenzoyl and 2-oxy-6-naphthoyl, which has high elasticity and tenacity as well as good heat resistance.

摘要翻译： 一种结晶聚合物晶须，其包含衍生自选自对氧基苯甲酰基和2-氧基-6-萘甲酰基的化合物的重复单元，其具有高弹性和韧性以及良好的耐热性。