公开(公告)号：US5731066A

公开(公告)日：1998-03-24

申请号：US546795

申请日：1995-10-23

申请人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

发明人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

IPC分类号： H05K1/09 ,  B23K1/00 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  B32B15/00 ,  B23K31/02 ,  H01R9/09

CPC分类号： H01L23/49811 ,  B23K1/0016 ,  H05K1/111 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/098 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  Y02P70/611 ,  Y10T428/24926

摘要： In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

摘要翻译： 在具有输入/输出引脚接合电极的电子电路装置中，为了显着地改善诸如润湿性和接合强度的接合特性并且大大简化了制造工艺，在形成玻璃陶瓷用于板的电子电路板 材料和布线导体和接合电极，其中Cu的尺寸设置成延伸超过针孔，使得焊料仅与其接触而不是陶瓷电路板。 在使用基板材料的电极上形成覆盖层时，以相同的工序形成布线和接合电极，根据需要在该电极上形成Au或Au-Ni层叠膜，然后使用 焊接如Au-Sn或Au-Ge。

公开(公告)号：US5276289A

公开(公告)日：1994-01-04

申请号：US674599

申请日：1991-03-25

申请人： Ryohei Satoh ,  Fumiyuki Kobayashi ,  Yutaka Watanabe ,  Tositada Netsu ,  Mitugu Shirai ,  Kenji Takeda ,  Masahide Harada ,  Kiyoshi Matsui ,  Hideaki Sasaki

发明人： Ryohei Satoh ,  Fumiyuki Kobayashi ,  Yutaka Watanabe ,  Tositada Netsu ,  Mitugu Shirai ,  Kenji Takeda ,  Masahide Harada ,  Kiyoshi Matsui ,  Hideaki Sasaki

IPC分类号： H01L23/02 ,  B23K35/30 ,  H01L21/60 ,  H01L23/10 ,  H01L23/16 ,  H01L23/538 ,  H01L25/065 ,  H05K3/34 ,  H05K1/00

CPC分类号： H01L24/81 ,  B23K35/30 ,  H01L23/10 ,  H01L23/16 ,  H01L23/5385 ,  H01L25/0655 ,  H05K3/3463 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K2201/094 ,  H05K2201/10704 ,  H05K2201/10734

摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).

摘要翻译： 本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点 与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。 使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金 （熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃） ）。

公开(公告)号：US5136360A

公开(公告)日：1992-08-04

申请号：US563281

申请日：1990-08-06

申请人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

发明人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

IPC分类号： B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H01L21/60 ,  H01L23/488 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L23/488 ,  H01L2224/16225

摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

摘要翻译： 一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分 基材由1.0〜8.0重量份的合金组成构成。 提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。 该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法 电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件 所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

公开(公告)号：US5825632A

公开(公告)日：1998-10-20

申请号：US512705

申请日：1995-08-08

申请人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Masahide Okamoto ,  Masato Nakamura ,  Kousaku Morita ,  Shousaku Ishihara ,  Fumiyuki Kobayashi ,  Fumikazu Tagami ,  Norio Sengoku ,  Tsuyoshi Fujita

发明人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Masahide Okamoto ,  Masato Nakamura ,  Kousaku Morita ,  Shousaku Ishihara ,  Fumiyuki Kobayashi ,  Fumikazu Tagami ,  Norio Sengoku ,  Tsuyoshi Fujita

IPC分类号： C03C3/089 ,  C03C8/16 ,  C03C14/00 ,  C03C17/06 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/11 ,  H05K1/16

CPC分类号： C03C14/004 ,  C03C17/06 ,  C03C3/089 ,  C03C8/16 ,  H01L21/4807 ,  H01L23/15 ,  C03C2217/253 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： Ceramic circuit substrate which is sintered at 900.degree. to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850.degree. to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.

摘要翻译： 在900〜1050℃下烧结并具有低相对介电常数，与硅相当的热膨胀系数和高弯曲强度的陶瓷电路基板及其制造方法通过使用具有软化点的玻璃 为850〜1100℃，即具有图1的区域的成分的玻璃。 图1（SiO 2-B 2 O 3 -R 2 O的三角形组成图，组成由小圆的位置表示，小圆数表示组成数），用连接表示第一，第三，第十，第十一， 和第四组分分别作为原料。

公开(公告)号：US5277723A

公开(公告)日：1994-01-11

申请号：US762933

申请日：1991-09-19

申请人： Hironori Kodama ,  Masahide Okamoto ,  Hideo Suzuki ,  Satoru Ogihara ,  Tadahiko Moyoshi ,  Fumiyuki Kobayashi

发明人： Hironori Kodama ,  Masahide Okamoto ,  Hideo Suzuki ,  Satoru Ogihara ,  Tadahiko Moyoshi ,  Fumiyuki Kobayashi

IPC分类号： B32B18/00 ,  C04B35/645 ,  H01L21/48 ,  C04B37/00

CPC分类号： H01L21/4857 ,  B32B18/00 ,  C04B35/645 ,  C04B37/001 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/56 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/76 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152

摘要： A method of producing a sintered multi-layer ceramic body used for ceramic parts of various electronic devices such as multi-layer substrates for LSI packaging and highly functional structural materials and by applying a pressure and/or constraining force to an outermost surface of the laminate. The method is featured by the shape of the surfaces to which a pressure and/or constraining force are not applied, ranges of the pressure and/or the constraining force, and the like.

摘要翻译： 一种制造用于各种电子器件的陶瓷部件的烧结多层陶瓷体的制造方法，例如用于LSI封装的多层基板和高功能结构材料，并且通过对层压体的最外表面施加压力和/或约束力 。 该方法的特征在于未施加压力和/或约束力的表面的形状，压力范围和/或约束力等。

公开(公告)号：US6118671A

公开(公告)日：2000-09-12

申请号：US103812

申请日：1998-06-24

申请人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Masahide Okamoto ,  Masato Nakamura ,  Kousaku Morita ,  Shousaku Ishihara ,  Fumikazu Tagami ,  Norio Sengoku ,  Tsuyoshi Fujita ,  Fumiyuki Kobayashi

发明人： Hirayoshi Tanei ,  Shoichi Iwanaga ,  Masahide Okamoto ,  Masato Nakamura ,  Kousaku Morita ,  Shousaku Ishihara ,  Fumikazu Tagami ,  Norio Sengoku ,  Tsuyoshi Fujita ,  Fumiyuki Kobayashi

IPC分类号： C03C3/089 ,  C03C8/16 ,  C03C14/00 ,  C03C17/06 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/11

CPC分类号： C03C14/004 ,  C03C17/06 ,  C03C3/089 ,  C03C8/16 ,  H01L21/4807 ,  H01L23/15 ,  C03C2217/253 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.

摘要翻译： 陶瓷电路基板，其在900〜1050℃下烧结并具有低的相对介电常数，与硅相当的热膨胀系数和高的弯曲强度，以及制造方法是通过使用软化点为 850至1100℃，即具有包括在图1中的区域中的组成的玻璃。 图1（SiO 2-B 2 O 3 -R 2 O的三角形组成图，组成由小圆的位置表示，小圆数表示组成数），用连接表示第一，第三，第十，第十一， 和第四组分分别作为原料。

公开(公告)号：US09183797B2

公开(公告)日：2015-11-10

申请号：US14110767

申请日：2012-04-09

申请人： Kohzoh Takahashi ,  Taketoshi Nakano ,  Asahi Yamato ,  Ken Inada ,  Fumiyuki Kobayashi ,  Toshihiro Yanagi

发明人： Kohzoh Takahashi ,  Taketoshi Nakano ,  Asahi Yamato ,  Ken Inada ,  Fumiyuki Kobayashi ,  Toshihiro Yanagi

IPC分类号： G09G3/36 ,  G09G3/20 ,  G09G5/04 ,  G09G5/06 ,  G09G3/34

CPC分类号： G09G3/36 ,  G09G3/2003 ,  G09G3/3406 ,  G09G3/3648 ,  G09G5/04 ,  G09G5/06 ,  G09G2300/0452 ,  G09G2320/0242 ,  G09G2320/0276 ,  G09G2340/02 ,  G09G2340/06 ,  G09G2360/16

摘要： Disclosed is a display device that (i) converts an input image formed of R, G, and B into a converted image formed of R, G, B, and W to display the converted image and that (ii) compresses the luminance of an input image for the subsequent frame on the basis of an adjustment value C which is corrected in correspondence with the number of, among all pixels in a converted image for the current frame, pixels in a state of luminance saturation and that then converts the input image into a converted image, the display device including a luminance oscillation detecting section (10) for detecting, while input images identical to each other are being inputted each as the above input image, whether converted images corresponding to the respective input images have an oscillating luminance, the display device, in the case where the luminance oscillation detecting section (10) has detected that the converted images have an oscillating luminance, stopping correction of the adjustment value C to fix the adjustment value C to a certain value, thereby preventing the converted images from having an oscillating luminance as a result of oscillation of the adjustment value C.

摘要翻译： 公开了一种显示装置，（i）将由R，G和B形成的输入图像转换为由R，G，B和W形成的转换图像，以显示转换的图像，并且（ii）压缩 基于对应于当前帧的转换图像中的所有像素中的亮度饱和状态的像素而被校正的调整值C的输入图像，然后将输入图像转换 转换成图像的显示装置包括：亮度振荡检测部（10），用于检测输入图像相同的输入图像，作为上述输入图像，每个输入图像的转换图像是否具有振荡亮度 在显示装置中，在亮度振荡检测部（10）检测到转换图像具有振荡亮度的情况下，停止将调整值C修正为fi 将调整值C设定为一定值，由此由于调整值C的振荡而使转换图像具有振荡亮度。

公开(公告)号：US20140028657A1

公开(公告)日：2014-01-30

申请号：US14009947

申请日：2012-04-04

申请人： Fumiyuki Kobayashi ,  Taketoshi Nakano ,  Asahi Yamato ,  Kohji Saitoh ,  Ken Inada ,  Kohzoh Takahashi ,  Toshihiro Yanagi

发明人： Fumiyuki Kobayashi ,  Taketoshi Nakano ,  Asahi Yamato ,  Kohji Saitoh ,  Ken Inada ,  Kohzoh Takahashi ,  Toshihiro Yanagi

IPC分类号： G09G3/36

CPC分类号： G09G3/3696 ,  G09G3/3648 ,  G09G3/3677 ,  G09G3/3688 ,  G09G2310/0248 ,  G09G2310/0291 ,  G09G2320/103 ,  G09G2330/021 ,  G09G2330/022

摘要： An object of the present invention is to provide (i) a display device which, during a display of a moving image and a still image, reduces electric power consumption without causing a deterioration in display quality, and (ii) a method for displaying the display device. In an intermittent drive mode in which driving and a pause of the driving are repeated, an image identification section (6) identifies an input image (image data (DA)) as a still image or a moving image. In a case where the input image is identified as the moving image, a drive/pause control section (7) generates a drive/pause control signal (DSC) in accordance with a period ratio which is in accordance with the moving image. A timing control section (8) generates a driver control signal so that intermittent driving is carried out. Then, a source driver (3) and a gate driver (4) drives a display section (2) so that the drive period and the pause period are repeated in accordance with a predetermined period ratio, so that the input image (DA) is displayed. The drive/pause control section (7) sets a time ratio between the drive period and the pause period so that the time ratio is variable for each of the moving image and the still image.

摘要翻译： 本发明的一个目的是提供一种显示装置，其在运动图像和静止图像的显示期间降低电力消耗而不会导致显示质量的劣化，并且（ii）显示装置 显示设备。 在重复驱动和暂停的间歇驱动模式中，图像识别部（6）将输入图像（图像数据（DA））识别为静止图像或运动图像。 在将输入图像识别为运动图像的情况下，驱动/暂停控制部（7）根据与运动图像相应的周期比来生成驱动/暂停控制信号（DSC）。 定时控制部（8）产生驱动控制信号，进行间歇驱动。 然后，源驱动器（3）和栅极驱动器（4）驱动显示部（2），使得根据预定周期比重复驱动周期和暂停时段，使得输入图像（DA）为 显示。 驱动/暂停控制部（7）设定驱动周期和暂停时间之间的时间比，使得运动图像和静止图像中的每一个的时间比是可变的。

公开(公告)号：US20100203206A1

公开(公告)日：2010-08-12

申请号：US12671329

申请日：2008-07-23

申请人： Yasuyoshi Hayata ,  Fumiyuki Kobayashi

发明人： Yasuyoshi Hayata ,  Fumiyuki Kobayashi

IPC分类号： A23L3/3418 ,  A23B7/148 ,  C12G3/00 ,  C12C11/11 ,  C12G1/08

CPC分类号： B01F5/106 ,  A23B7/148 ,  A23L3/3418 ,  B01F3/04503 ,  B01F3/0876 ,  B01F2003/04858 ,  C02F1/685 ,  C02F2301/066 ,  C02F2303/04 ,  C12C11/11 ,  C12G1/02 ,  C12H1/14

摘要： For the purpose of simply sterilizing drinking water and food products utilizing carbon dioxide that is in a gaseous state, there is provided a method for treating a food product, which is characterized in that the method comprises allowing microscopic bubbles of carbon dioxide to come into contact with a food product containing microorganisms or enzymes at a pressure of 0.2 to 2 MPa, thereby sterilizing the microorganisms or deactivating the enzymes contained in the food product.

摘要翻译： 为了简单地利用处于气态的二氧化碳对饮用水和食品进行消毒，提供了一种处理食品的方法，其特征在于该方法包括使二氧化碳的微小气泡接触 含有0.2〜2MPa压力的微生物或酶的食品，从而对微生物进行灭菌或使食品中所含的酶失活。

公开(公告)号：US20060037848A1

公开(公告)日：2006-02-23

申请号：US11200085

申请日：2005-08-10

申请人： Fumiyuki Kobayashi

发明人： Fumiyuki Kobayashi

IPC分类号： H01H9/00

CPC分类号： H04M1/7258 ,  G06F3/0202 ,  G06F3/0238 ,  H01H13/83 ,  H01H2219/02 ,  H01H2219/028 ,  H01H2219/03 ,  H01H2219/039 ,  H01H2221/07 ,  H04M1/22

摘要： The present invention provides a key button structure, capable of easily and positively finding a targeted character in accordance with an entry mode preset by a user, comprises: a key top; a light shielding section, which is attached onto rear face of the key top and of which is formed by reversely printing characters assigned to a key button for each character type display area; key backlights, each of which is provided in a dome anchoring sheet for covering a metal dome, and are arranged so as to be divided into three types: key backlights for lighting a numeral display area, a kana character display area, and an alphabetical letter display area respectively. For example, with a numeral entry mode preset, only the key backlight for lighting the numeral display area is lighted, thus displaying only a required numeral bright in the number entry mode.

摘要翻译： 本发明提供一种键按钮结构，能够根据用户预先设定的输入模式容易且积极地发现目标人物，包括：键顶; 遮光部，其安装在键顶的后表面上，并且通过反转打印分配给每个字符型显示区域的按键的字符而形成; 关键背光灯，其中每个都设置在用于覆盖金属圆顶的圆顶锚固片材中，并且被布置成被分为三种类型：用于点亮数字显示区域的钥匙背光灯，假名字符显示区域和字母字母 显示区域。 例如，在数字输入模式被预先设定的情况下，只有点亮数字显示区域的按键背光灯被点亮，从而在数字输入模式中只显示所需的数字亮。