公开(公告)号：US5731066A

公开(公告)日：1998-03-24

申请号：US546795

申请日：1995-10-23

申请人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

发明人： Akihiro Ando ,  Osamu Yamada ,  Ryohei Satoh ,  Takashi Inoue ,  Masahide Okamoto ,  Fumiyuki Kobayashi ,  Toshihiko Ohta ,  Minoru Tanaka

IPC分类号： H05K1/09 ,  B23K1/00 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  B32B15/00 ,  B23K31/02 ,  H01R9/09

CPC分类号： H01L23/49811 ,  B23K1/0016 ,  H05K1/111 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/098 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  Y02P70/611 ,  Y10T428/24926

摘要： In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

摘要翻译： 在具有输入/输出引脚接合电极的电子电路装置中，为了显着地改善诸如润湿性和接合强度的接合特性并且大大简化了制造工艺，在形成玻璃陶瓷用于板的电子电路板 材料和布线导体和接合电极，其中Cu的尺寸设置成延伸超过针孔，使得焊料仅与其接触而不是陶瓷电路板。 在使用基板材料的电极上形成覆盖层时，以相同的工序形成布线和接合电极，根据需要在该电极上形成Au或Au-Ni层叠膜，然后使用 焊接如Au-Sn或Au-Ge。

公开(公告)号：US5939789A

公开(公告)日：1999-08-17

申请号：US893323

申请日：1997-07-16

申请人： Michifumi Kawai ,  Ryohei Satoh ,  Osamu Yamada ,  Eiji Matsuda ,  Masakazu Ishino ,  Takashi Inoue ,  Hideo Sotokawa ,  Masayuki Kyoui

发明人： Michifumi Kawai ,  Ryohei Satoh ,  Osamu Yamada ,  Eiji Matsuda ,  Masakazu Ishino ,  Takashi Inoue ,  Hideo Sotokawa ,  Masayuki Kyoui

IPC分类号： H05K3/46 ,  H01L21/48 ,  H05K3/28 ,  H05K3/42 ,  H01L23/485

CPC分类号： H01L21/4857 ,  H05K3/4617 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2203/1189 ,  H05K3/28 ,  H05K3/423

摘要： A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.

摘要翻译： 一种多层基板，其通过层叠多个基板而制造，所述多个基板包括绝缘膜，穿过所述上表面的绝缘膜的下表面的多个通孔，设置在所述绝缘膜的上表面上的布线 绝缘膜和通孔的上表面并与通孔电连接;接合构件，其设置在通孔的下表面上并与通孔电连接;以及接合层，其设置在上部 形成布线的绝缘膜的表面及其制造方法，从而可以获得大量的成本降低和高密度效果。

公开(公告)号：US5973406A

公开(公告)日：1999-10-26

申请号：US918019

申请日：1997-08-25

申请人： Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

发明人： Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

IPC分类号： H01L21/60 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/81 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/086 ,  Y02P70/613

摘要： An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.

摘要翻译： 无需使用焊剂即可正确焊接电子设备，也不会对基板进行精确定位。 在要安装电子装置的基板上的区域中形成尺寸约为电子装置的端子焊盘尺寸的两倍的焊盘。 在放置基板表面的电子装置之后，将整个单元在氮气气氛中加热以熔化形成在电子装置的端子板上的凸块。 熔融的焊料润湿并扩散在形成在衬底上的接合焊盘上，从而在接合焊盘和端子焊盘之间建立回流焊接。 电子器件相对于衬底的位置由于通过在衬底的焊盘上的熔融焊料的润湿和扩散而引起的自对准功能自发校正。

公开(公告)号：US5865365A

公开(公告)日：1999-02-02

申请号：US761430

申请日：1996-12-06

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426

摘要： A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

摘要翻译： 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中，并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法，进行无焊剂焊接，位移偏移降低，并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。

公开(公告)号：US09295261B2

公开(公告)日：2016-03-29

申请号：US12282529

申请日：2007-03-28

申请人： Shingo Fujii ,  Munehiro Suzuki ,  Osamu Yamada

发明人： Shingo Fujii ,  Munehiro Suzuki ,  Osamu Yamada

IPC分类号： A01N53/00

CPC分类号： A01N53/00 ,  A01N25/02 ,  A01N25/04 ,  A01N37/38 ,  A01N25/30 ,  A01N2300/00

摘要： The present invention relates to new aqueous microemulsions containing organic pesticide compounds of limited water-solubility and to their use for plant protection, including seed and crop protection, and protection or non-living material. The aqueous microemulsions comprise a) at least one pyrethroid compound P; b) at least one organic solvent, selected from compounds of the formula I R1—(O-Alk)m-O—C(O)R2 (I) wherein m is 1, 2 or 3, R1 is H, C1-C6-alkyl or C(O)R3, R2 is hydrogen or C1-C4-alkyl, which may be unsubstituted or substituted with OH, Alk is C2-C6-alkylene, and R3 is hydrogen or C1-C4-alkyl, which may be unsubstituted or substituted with OH; c) at least one surfactant; and d) water.

摘要翻译： 本发明涉及含有水溶性有限的有机农药化合物的新的含水微乳液及其用于植物保护的用途，包括种子和作物保护以及保护或非生物材料。 含水微乳液包含a）至少一种拟除虫菊酯化合物P; b）至少一种选自式I R1-（O-Alk）mO-C（O）R 2（I）的化合物的有机溶剂，其中m是1,2或3，R 1是H，C 1 -C 6烷基 或C（O）R 3，R 2是氢或C 1 -C 4烷基，其可以是未取代的或被OH取代，Alk是C 2 -C 6亚烷基，R 3是氢或C 1 -C 4 - 烷基，其可以是未取代的或 用OH取代; c）至少一种表面活性剂; 和d）水。

公开(公告)号：US08638026B2

公开(公告)日：2014-01-28

申请号：US13123199

申请日：2009-10-06

申请人： Masashi Shibahara ,  Mikio Tokuyama ,  Koichiro Takeuchi ,  Shigeru Haneda ,  Osamu Yamada ,  Naoki Sakamoto ,  Eiichi Hazaki ,  Akito Tanokuchi

发明人： Masashi Shibahara ,  Mikio Tokuyama ,  Koichiro Takeuchi ,  Shigeru Haneda ,  Osamu Yamada ,  Naoki Sakamoto ,  Eiichi Hazaki ,  Akito Tanokuchi

IPC分类号： H01L41/08

CPC分类号： H01J37/20 ,  H01J2237/20221 ,  H01J2237/20264 ,  H01J2237/28

摘要： A stage comprises a linear guide rail (2) for guiding a movable table (4), a driven bar (12), a linear drive actuator in contact with the driven bar (12) to transmit driving force to the driven bar (12), and parallel plate springs (30) for holding opposite ends of the driven bar (12). A drive transmitting surface of the linear drive actuator is provided so as to be separated from the movable table (4), and this prevents the accuracy of positioning from being reduced. Also, the parallel springs (30) reduce deforming forces applied to sections supporting the driven bar (12), and this prevents the driven bar from being damaged. The configuration makes the stage highly accurate and highly reliable.

摘要翻译： 平台包括用于引导可动台（4）的直线导轨（2），从动杆（12），与从动杆（12）接触的线性驱动致动器，以将驱动力传递到从动杆（12） 和用于保持从动杆（12）的相对端的平行板簧（30）。 线性驱动致动器的驱动传递表面设置成与可移动台（4）分离，这防止了定位精度的降低。 此外，平行弹簧（30）减小施加到支撑从动杆（12）的部分的变形力，并且这防止被驱动杆被损坏。 该配置使舞台高度准确和高度可靠。

公开(公告)号：US08574361B2

公开(公告)日：2013-11-05

申请号：US12524811

申请日：2008-03-05

申请人： Osamu Yamada ,  Hisashi Minemoto ,  Kouichi Hiranaka ,  Takeshi Hatakeyama ,  Takatomo Sasaki ,  Yusuke Mori ,  Fumio Kawamura ,  Yasuo Kitaoka

发明人： Osamu Yamada ,  Hisashi Minemoto ,  Kouichi Hiranaka ,  Takeshi Hatakeyama ,  Takatomo Sasaki ,  Yusuke Mori ,  Fumio Kawamura ,  Yasuo Kitaoka

IPC分类号： H01L21/322

CPC分类号： H01L31/03044 ,  C30B9/10 ,  C30B11/12 ,  C30B19/02 ,  C30B29/403 ,  C30B29/406 ,  G02B1/02

摘要： A method for producing a high-quality group-III element nitride crystal at a high crystal growth rate, and a group-III element nitride crystal are provided. The method includes the steps of placing a group-III element, an alkali metal, and a seed crystal of group-III element nitride in a crystal growth vessel, pressurizing and heating the crystal growth vessel in an atmosphere of nitrogen-containing gas, and causing the group-III element and nitrogen to react with each other in a melt of the group-III element, the alkali metal and the nitrogen so that a group-III element nitride crystal is grown using the seed crystal as a nucleus. A hydrocarbon having a boiling point higher than the melting point of the alkali metal is added before the pressurization and heating of the crystal growth vessel.

摘要翻译： 提供了以高晶体生长速度生产高质量III族元素氮化物晶体的方法和III族元素氮化物晶体。 该方法包括以下步骤：将III族元素，碱金属和III族元素氮化物的晶种放置在晶体生长容器中，在含氮气体的气氛中加压和加热晶体生长容器， 导致III族元素和氮在III族元素，碱金属和氮的熔体中彼此反应，从而使用晶种作为核生长III族元素氮化物晶体。 在晶体生长容器的加压和加热之前，加入沸点高于碱金属的熔点的烃。

公开(公告)号：US08329056B2

公开(公告)日：2012-12-11

申请号：US12853601

申请日：2010-08-10

申请人： Fumitoshi Yamashita ,  Osamu Yamada ,  Shiho Ohya

发明人： Fumitoshi Yamashita ,  Osamu Yamada ,  Shiho Ohya

IPC分类号： H01F1/08

CPC分类号： H01F1/0578 ,  H01F1/059 ,  H01F7/02 ,  H01F41/0266 ,  H01F41/028

摘要： Anisotropic rare earth-iron based resin bonded magnet comprises: [1] a continuous phase including: (1) a spherical Sm2Fe17N3 based magnetic material covered with epoxy oligomer where its average particle size is 1 to 10 μm, its average aspect ratio ARave is 0.8 or more, and mechanical milling is not applied after Sm—Fe alloy is nitrided; (2) a linear polymer with active hydrogen group reacting to the oligomer; and (3) additive; and [2] a discontinuous phase being an Nd2Fe14B based magnetic material coated with the epoxy oligomer where its average particle size is 50 to 150 μm, and its average aspect ratio ARave is 0.65 or more, further satisfying: [3] the air-gap ratio of a granular compound on the phases is 5% or less; and [4] a composition where crosslinking agent with 10 μm or less is adhered on the granular compound is formed at 50 MPa or less.

摘要翻译： 各向异性稀土 - 铁基树脂粘结磁铁包括：[1]连续相，包括：（1）用环氧低聚物覆盖的球形Sm2Fe17N3系磁性材料，其平均粒径为1〜10μm，平均长径比ARave为0.8 或以上，并且在Sm-Fe合金被氮化之后不施加机械研磨; （2）具有与低聚物反应的活性氢基团的直链聚合物; 和（3）添加剂; 和[2]不连续相是涂覆有环氧低聚物的Nd 2 Fe 14 B基磁性材料，其平均粒度为50〜150μm，其平均长径比Arave为0.65以上，进一步满足：[3]气隙 相上的粒状化合物的比例为5％以下; 和[4]在该粒状化合物上附着有10μm以下的交联剂的组合物形成为50MPa以下。

公开(公告)号：US07735708B2

公开(公告)日：2010-06-15

申请号：US11778842

申请日：2007-07-17

申请人： Osamu Yamada

发明人： Osamu Yamada

IPC分类号： B23K37/00

CPC分类号： H05K3/3494 ,  B23K1/008 ,  H05K2203/081

摘要： In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material having a thickness of T, and a lower portion formed from a metallic-plate wall (2b) extending downward from the heat-insulating wall (2a) toward the conveyor (5). The pitch P2 of the blowout pipes (20) across the metallic-plate wall (2b) is substantially same as the pitch P1 (12 mm) of the blowout pipes (20) disposed inside each of the chambers (R1 to R5) and adjacent to each other.

摘要翻译： 在气氛回收箱（18）底部的第二水平板（18a）中，在彼此相邻的吹出管（20）之间形成有圆形孔（21）。 位于输送机（5）上方的每个分隔壁（2）包括由绝热壁（2a）形成的上部，该隔热壁包括厚度为T的绝热材料和由金属板形成的下部 壁（2b）从隔热壁（2a）朝向输送机（5）向下延伸。 穿过金属板壁（2b）的吹出管（20）的间距P2与布置在每个室（R1至R5）内的喷出管（20）的间距P1（12mm）大致相同 对彼此。

公开(公告)号：US07545278B2

公开(公告)日：2009-06-09

申请号：US11796047

申请日：2007-04-26

申请人： Shusaku Okamoto ,  Osamu Yamada ,  Tomonobu Naruoka ,  Toru Tanigawa

发明人： Shusaku Okamoto ,  Osamu Yamada ,  Tomonobu Naruoka ,  Toru Tanigawa

IPC分类号： G08B13/14

CPC分类号： G06Q10/08

摘要： An article present region estimating means references information on location and time of an article detected in an article detecting device and stored in an article management database and information on location and time of a person detected in a person detecting device and stored in a person management database to estimate a location where the article is most likely to be present. An article position candidate weighting means may be perform weighting based on information such as movement of the person, location where the article is normally placed.

摘要翻译： 文章呈现区域估计装置参考在物品检测装置中检测并存储在物品管理数据库中的物品的位置和时间的信息以及在人物检测装置中检测到并存储在人物管理数据库中的人的位置和时间的信息 估计文章最有可能存在的位置。 文章位置候选者加权装置可以基于人的移动，通常放置物品的位置的信息来执行加权。