MICROBATTERY WITH THROUGH-SILICON VIA ELECTRODES

    公开(公告)号:US20190355991A1

    公开(公告)日:2019-11-21

    申请号:US16524843

    申请日:2019-07-29

    Abstract: Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

    Deformable closed-loop multi-layered microelectronic device

    公开(公告)号:US10170449B2

    公开(公告)日:2019-01-01

    申请号:US15584856

    申请日:2017-05-02

    Inventor: Bucknell C. Webb

    Abstract: A deformable closed-loop multi-layered microelectronic device is provided. A top layer, a bottom layer and a middle layer of the microelectronic device each have at least a first section and a second section pivotable with respect to each other. A pivot is provided to a terminal end of the first section of the middle layer, for allowing the first section to rotate about the pivot. The pivot is vertically sandwiched between and connected to a terminal end of the first section of the top layer and a terminal end of the first section of the bottom layer. The first sections of the bottom layer and the top layer are pivotable in a substantially synchronized manner to deform the bottom layer and the top layer in a substantially synchronized manner.

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