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公开(公告)号:US11362382B2
公开(公告)日:2022-06-14
申请号:US15416564
申请日:2017-01-26
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Bing Dang , John U. Knickerbocker , Yang Liu , Jae-Woong Nah , Adinath Narasgond , Bucknell C. Webb
IPC: H01M50/10 , H01M50/209 , H01M6/40 , H01M10/04
Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.
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公开(公告)号:US10940265B2
公开(公告)日:2021-03-09
申请号:US16435517
申请日:2019-06-09
Applicant: International Business Machines Corporation
Inventor: Bing Dang , John U. Knickerbocker , Joana S. B. T. Maria , Bucknell C. Webb , Steven L. Wright
Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.
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公开(公告)号:US10687425B2
公开(公告)日:2020-06-16
申请号:US15821446
申请日:2017-11-22
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC: H05K3/30 , H05K1/18 , H05K3/00 , H05K3/34 , H05K1/11 , H05K1/03 , H05K1/02 , G01R31/44 , G01R31/309 , G01R31/28 , H05K13/00
Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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公开(公告)号:US10607963B2
公开(公告)日:2020-03-31
申请号:US15266786
申请日:2016-09-15
Applicant: International Business Machines Corporation
Inventor: Thomas J. Brunschwiler , Timothy Joseph Chainer , Evan George Colgan , Michael Anthony Gaynes , Jeffrey Donald Gelorme , Gerard McVicker , Ozgur Ozsun , Pritish Ranjan Parida , Mark Delorman Schultz , Bucknell C. Webb
IPC: H01L25/065 , H01L23/00 , H01L21/48 , H01L23/473 , H01L23/433
Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
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公开(公告)号:US20190355991A1
公开(公告)日:2019-11-21
申请号:US16524843
申请日:2019-07-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Paul S. Andry , Bucknell C. Webb
Abstract: Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.
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公开(公告)号:US10393798B2
公开(公告)日:2019-08-27
申请号:US15821403
申请日:2017-11-22
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC: G01R31/309 , G01R31/28 , H05K3/34 , H05K3/30 , H05K3/00 , H05K1/18 , H05K1/11 , H05K1/03 , H05K1/02 , H05K13/00
Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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公开(公告)号:US10282646B2
公开(公告)日:2019-05-07
申请号:US15811018
申请日:2017-11-13
Applicant: International Business Machines Corporation
Inventor: Evan G. Colgan , Fuad E. Doany , Li-Wen Hung , Reinaldo A. Vega , Bucknell C. Webb
Abstract: A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.
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公开(公告)号:US10170449B2
公开(公告)日:2019-01-01
申请号:US15584856
申请日:2017-05-02
Applicant: International Business Machines Corporation
Inventor: Bucknell C. Webb
IPC: H01L25/065 , H01L23/00 , H01L29/06
Abstract: A deformable closed-loop multi-layered microelectronic device is provided. A top layer, a bottom layer and a middle layer of the microelectronic device each have at least a first section and a second section pivotable with respect to each other. A pivot is provided to a terminal end of the first section of the middle layer, for allowing the first section to rotate about the pivot. The pivot is vertically sandwiched between and connected to a terminal end of the first section of the top layer and a terminal end of the first section of the bottom layer. The first sections of the bottom layer and the top layer are pivotable in a substantially synchronized manner to deform the bottom layer and the top layer in a substantially synchronized manner.
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39.
公开(公告)号:US20180133152A1
公开(公告)日:2018-05-17
申请号:US15852943
申请日:2017-12-22
Applicant: International Business Machines Corporation
Inventor: S. Jay Chey , Bing Dang , John U. Knickerbocker , Kenneth F. Latzko , Joana Sofia Branquinho Teresa Maria , Lavanya Turlapati , Bucknell C. Webb , Steven L. Wright
CPC classification number: A61K9/0097 , A61M31/002 , A61M2205/0244 , A61N1/0428 , A61N1/0444 , A61N1/0448
Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.
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公开(公告)号:US20180095125A1
公开(公告)日:2018-04-05
申请号:US15821403
申请日:2017-11-22
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC: G01R31/28 , G01R31/309 , H05K1/11 , H05K1/18 , H05K1/03 , H05K1/02 , H05K3/34 , H05K3/30 , H05K3/00
CPC classification number: G01R31/2818 , G01R31/309 , H05K1/0268 , H05K1/0274 , H05K1/0393 , H05K1/111 , H05K1/189 , H05K3/0026 , H05K3/305 , H05K3/341 , H05K3/3494 , H05K13/0069 , H05K2201/09072 , H05K2201/10015 , H05K2201/10037 , H05K2201/1006 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10522 , H05K2203/107 , H05K2203/162
Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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