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公开(公告)号：US20090250798A1
公开(公告)日：2009-10-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/498 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07575956B2
公开(公告)日：2009-08-18
申请号：US10721916
申请日：2003-11-24
IPC分类号： H01L21/44
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制造半导体散热器的方法。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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33.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE 有权集成电路封装系统，具有灵活的基板和密封的封装公开(公告)号：US20090016033A1
公开(公告)日：2009-01-15
申请号：US12136007
申请日：2008-06-09
IPC分类号： H05K1/18
CPC分类号： H05K1/189 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/141 , H05K1/147 , H05K3/284 , H05K3/3436 , H05K2201/042 , H05K2201/056 , H05K2201/10515 , H05K2201/1053 , H05K2203/1316 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099
摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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公开(公告)号：US20080272487A1
公开(公告)日：2008-11-06
申请号：US12115510
申请日：2008-05-05
CPC分类号： H01L24/85 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/45015 , H01L2224/451 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/4848 , H01L2224/48482 , H01L2224/48499 , H01L2224/48799 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/00 , H01L2224/48824 , H01L2224/45099 , H01L2924/00015
摘要： A wire bond system including providing an integrated circuit die with a bond pad thereon, forming a soft bump on the bond pad, and wire bonding a hard-metal wire on the soft bump.
摘要翻译： 一种引线接合系统，包括在其上提供具有接合焊盘的集成电路管芯，在接合焊盘上形成软凸点，以及将软质凸起上的硬金属线引线接合。
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公开(公告)号：US07445955B2
公开(公告)日：2008-11-04
申请号：US11160837
申请日：2005-07-12
CPC分类号： H01L25/0655 , H01L21/50 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
摘要翻译： 一种用于制造多芯片组件封装的方法，包括：提供第一散热器，其定位成用于释放来自封装的热量，并提供靠近第一散热器定位的第二散热器。 散热器热耦合并且彼此电隔离。 第一半导体器件被附接到第一散热器，与第一散热器进行热和电通信并与第二散热器电绝缘。 第二半导体器件与第二散热器热连接并与之电气连通，并与第一散热器电绝缘。
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公开(公告)号：US20080258289A1
公开(公告)日：2008-10-23
申请号：US12057360
申请日：2008-03-27
申请人： Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
发明人： Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
CPC分类号： H01L23/49805 , H01L21/56 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： An integrated circuit package system comprising: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step.
摘要翻译： 一种集成电路封装系统，包括：形成区域阵列基板; 在面阵列基板上安装表面导体; 在所述面阵列基板和所述表面导体上形成模制封装体; 在模制包装体中提供一个步骤; 并通过该步骤暴露表面导体。
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公开(公告)号：US07420265B2
公开(公告)日：2008-09-02
申请号：US11164321
申请日：2005-11-17
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/73 , H01L2224/1012 , H01L2224/16245 , H01L2224/81136 , H01L2224/81138 , H01L2924/00013 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2224/29099 , H01L2924/00
摘要： An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯，引线框架和集成电路支架。 集成电路管芯与引线框架之间的集成电路支持，电气互连连接到引线框。
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公开(公告)号：US07399658B2
公开(公告)日：2008-07-15
申请号：US11459317
申请日：2006-07-21
IPC分类号： H01L21/00
CPC分类号： H01L23/49861 , H01L23/3675 , H01L25/16 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.
摘要翻译： 制造用于半导体封装的预成型引线框架的方法包括提供具有管芯焊盘和多个引线的引线框架。 在引线框架中形成第一模塑材料以暴露芯片焊盘的上表面和多个引线的上表面。
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公开(公告)号：US20080157325A1
公开(公告)日：2008-07-03
申请号：US11670714
申请日：2007-02-02
申请人： Seng Guan Chow , Il Kwon Shim , Byung Joon Han
发明人： Seng Guan Chow , Il Kwon Shim , Byung Joon Han
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L23/3128 , H01L23/50 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.
摘要翻译： 一种集成电路封装系统，包括基底基板，在基底基板上安装基底裸片，将具有中介层电路器件的集成插入件安装在基底裸片上，并在一侧上形成具有密封腔的封装系统密封剂 与基座相对。
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40.发明授权Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 有权半导体堆叠封装组件，其在上侧和下侧具有暴露的衬底表面公开(公告)号：US07372141B2
公开(公告)日：2008-05-13
申请号：US11395529
申请日：2006-03-31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/552 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85013 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. One or more additional components may be stacked over the land side of the first package substrate.
摘要翻译： 堆叠的封装组件包括第一和第二堆叠封装，每个封装具有至少一个管芯，该裸管固定到封装衬底的管芯附着侧并与其电连接。 一个封装相对于另一个封装反转，即，封装基板的管芯附接面彼此面对，并且基板的“焊盘”侧面彼此背离。 封装的Z-互连是通过连接第一和第二封装衬底的引线键合。 组件以这样的方式封装，使得第二封装衬底（组件的一侧）和第一封装衬底的一部分（在组件的相对侧）被暴露，使得第二级互连和互连 可以制造组件。 一个或多个附加部件可以堆叠在第一封装基板的接地侧上。
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