Patent search ap:("Isamu Yoshida" OR "Keisuke Kazuno") AND inv:"Isamu Yoshida" Page 4

31.

发明授权
Method of uniformly encapsulating a semiconductor device in resin 失效
Title translation: 将半导体器件均匀地封装在树脂中的方法

公开(公告)号：US5371044A

公开(公告)日：1994-12-06

申请号：US876349

申请日：1992-04-30

Applicant: Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Ichiro Anjoh , Kenichi Imura , Toshihiro Yasuhara , Junichi Arita , Kazuhiro Sugino

Inventor： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Ichiro Anjoh , Kenichi Imura , Toshihiro Yasuhara , Junichi Arita , Kazuhiro Sugino

IPC: B29C45/02 , B29C45/14 , H01L21/56 , H01L23/495 , H01L21/58 , H01L21/60

CPC classification number: H01L21/565 , B29C45/14655 , H01L23/4951 , H01L23/49541 , B29C45/02 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/01025 , H01L2924/01079

Abstract: A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.

Abstract translation: 一种模制方法，其中具有等于或大于供应通道的出口宽度的尺寸的控制板设置在与模具的树脂供应通道相邻的空腔中，从而树脂模制件可以在包括半导体器件和引线的插入件的上侧和下侧基本相等地实现。

32.

发明授权
Semiconductor device 失效
Title translation: 半导体器件

公开(公告)号：US5358904A

公开(公告)日：1994-10-25

申请号：US990272

申请日：1992-12-14

Applicant: Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjoh , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsurou Matsumoto

Inventor： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjoh , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsurou Matsumoto

IPC: H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34 , H01L21/60

CPC classification number: H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract translation: 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

33.

发明授权
Method of producing semiconductor devices 失效
Title translation: 半导体器件的制造方法

公开(公告)号：US4946633A

公开(公告)日：1990-08-07

申请号：US184790

申请日：1988-04-22

Applicant: Junichi Saeki , Aizo Kaneda , Shigeharu Tsunoda , Isamu Yoshida , Kunihiko Nishi

Inventor： Junichi Saeki , Aizo Kaneda , Shigeharu Tsunoda , Isamu Yoshida , Kunihiko Nishi

IPC: B29C45/02 , B29C45/14 , H01L21/00 , H01L21/56

CPC classification number: B29C45/14655 , B29C45/02 , H01L21/565 , H01L24/97 , B29C2045/2712 , H01L2924/181 , Y10S425/812

Abstract: Apparatus for producing semiconductor devices is provided with mold and lead frame suitable for improving the production efficiency and product quality. Also disclosed is a method of producing semiconductor devices by means of the apparatus. The mold is characterized by the shape of a die and has a plurality of pots for pressure-feeding resin, a flow passage communicating the pots with each other so as to uniformalize the molding pressure applied to the pots even if there are variations in the weights of the resin charged in the pots, and a plurality of cavities disposed in series.

Abstract translation: 用于生产半导体器件的设备设置有适于提高生产效率和产品质量的模具和引线框架。还公开了通过该装置制造半导体器件的方法。模具的特征在于模具的形状，并且具有用于加压树脂的多个盆，使得盆彼此连通的流动通道，以便均匀化施加到罐的成型压力，即使重量有变化填充在所述盆中的树脂，以及串联设置的多个空腔。

34.

发明授权
Pretreatment agent for subject fluid in pregnancy test 失效
Title translation: 妊娠试验中受试物质的预处理剂

公开(公告)号：US4270923A

公开(公告)日：1981-06-02

申请号：US107179

申请日：1979-12-26

Applicant: Koichi Kondo , Isamu Yoshida , Takashi Kobayashi

Inventor： Koichi Kondo , Isamu Yoshida , Takashi Kobayashi

IPC: G01N33/53 , G01N33/74 , G01N33/76

CPC classification number: G01N33/76 , Y10S436/814 , Y10S436/818 , Y10S436/825

Abstract: By using a new pretreatment agent consisting essentially of a carboxylic acid-type cation exchange resin fiber or a siliconized glass fiber, the interfering components and the elements of turbidity present in a subject fluid for immunologic pregnancy test can be specifically removed without entailing a substantial loss of human chorionic gonadotropin contained in the subject fluid.

Abstract translation: 通过使用基本上由羧酸型阳离子交换树脂纤维或硅化玻璃纤维组成的新的预处理剂，可以特异性地除去存在于用于免疫妊娠试验的目标流体中的干扰成分和浊度元素，而不会引起实质损失的人绒毛膜促性腺激素。

35.

发明授权
Power module and manufacturing method thereof 有权
Title translation: 电源模块及其制造方法

公开(公告)号：US08723320B2

公开(公告)日：2014-05-13

申请号：US13537116

申请日：2012-06-29

Applicant: Isamu Yoshida , Michiaki Hiyoshi , Takehide Yokozuka , Akihiro Muramoto

Inventor： Isamu Yoshida , Michiaki Hiyoshi , Takehide Yokozuka , Akihiro Muramoto

IPC: H01L23/48

CPC classification number: H01L23/49811 , H01L23/3735 , H01L25/072 , H01L2924/0002 , H01L2924/01327 , H01L2924/00

Abstract: A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

Abstract translation: 电源模块包括具有其上形成有多个布线图案的表面的基板，安装在基板上并与多个布线图形的一部分电连接的半导体器件，以及端子部分，其引线电连接到多个布线图案的其他部分，并且被构造成通过层叠多个金属构件来形成端子部分的引线，所述多个金属构件包含与用于形成布线图案的其他部分的材料基本相同或者更软的材料，并且与用于形成布线图形的另一部分的材料相同或更软的多个金属构件的材料通过超声波接合电连接到布线图案的另一部分。

36.

发明授权
Semiconductor device and electronic control unit using the same 有权
Title translation: 半导体装置和使用该装置的电子控制装置

公开(公告)号：US07679176B2

公开(公告)日：2010-03-16

申请号：US11635561

申请日：2006-12-08

Applicant: Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida

Inventor： Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida

IPC: H01L23/02

CPC classification number: H01L23/49822 , H01L23/142 , H01L23/3677 , H01L23/49816 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Abstract translation: 半导体器件具有带电子电路的基板，设置在基板的第一表面并通过引线键合电连接到电子电路的半导体元件，与半导体元件电连接的金属芯层。与衬底的第一表面相对设置的多个导电凸块。至少半导体元件密封有热可硬化树脂，金属板与金属芯层电连接。

37.

发明授权
Semiconductor device 失效
Title translation: 半导体器件

公开(公告)号：US06720208B2

公开(公告)日：2004-04-13

申请号：US10322672

申请日：2002-12-19

Applicant: Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto

Inventor： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto

IPC: H01L2144

CPC classification number: H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2224/92147 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , H01L2924/00012 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/0695 , H01L2224/85399

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract translation: 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

38.

发明授权
Link plate for power transmission chain 有权
Title translation: 传动链链板

公开(公告)号：US06220981B1

公开(公告)日：2001-04-24

申请号：US09252674

申请日：1999-02-22

Applicant: Isamu Yoshida

Inventor： Isamu Yoshida

IPC: F16H708

CPC classification number: F16G13/06 , F16H57/05

Abstract: In a link plate for use in a power transmission chain driven to run while a side edge of the link plate is in sliding contact with a shoe surface a chain guide member, the side edge of the link plate has a pair of contact portions near opposite longitudinal ends thereof for sliding contact with the shoe surface, and a recessed central portion extending between the contact portions. The recessed central portion together with the shoe surface forms a space which is capable of collecting and holding lubricating oil when the contact portions are in sliding contact with the shoe surface. As the link plate slides on the shoe surface, the lubricating oil trapped inside the space gradually enters between the contact portions and the shoe surface to thereby form an oil film. With this oil film, friction between the link plate and the shoe surface is reduced, leading to reduction of running resistance of the power transmission chain.

Abstract translation: 在用于驱动运行的动力传递链的连杆板中，连杆板的侧边缘与靴形表面滑动接触链条导向件，连杆板的侧边缘具有一对接触部分其纵向端部与鞋面滑动接触，以及在接触部分之间延伸的凹入的中心部分。凹陷的中心部分与鞋表面一起形成了当接触部分与鞋表面滑动接触时能够收集和保持润滑油的空间。当链板在鞋面上滑动时，捕获在空间内的润滑油逐渐进入接触部分和鞋表面之间，从而形成油膜。利用该油膜，链板与鞋面之间的摩擦力减小，导致动力传动链的行驶阻力降低。