公开(公告)号：US5371044A

公开(公告)日：1994-12-06

申请号：US876349

申请日：1992-04-30

申请人： Isamu Yoshida ,  Junichi Saeki ,  Shigeharu Tsunoda ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Imura ,  Toshihiro Yasuhara ,  Junichi Arita ,  Kazuhiro Sugino

发明人： Isamu Yoshida ,  Junichi Saeki ,  Shigeharu Tsunoda ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Imura ,  Toshihiro Yasuhara ,  Junichi Arita ,  Kazuhiro Sugino

IPC分类号： B29C45/02 ,  B29C45/14 ,  H01L21/56 ,  H01L23/495 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L21/565 ,  B29C45/14655 ,  H01L23/4951 ,  H01L23/49541 ,  B29C45/02 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01025 ,  H01L2924/01079

摘要： A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.

摘要翻译： 一种模制方法，其中具有等于或大于供应通道的出口宽度的尺寸的控制板设置在与模具的树脂供应通道相邻的空腔中，从而树脂模制件可以 在包括半导体器件和引线的插入件的上侧和下侧基本相等地实现。

公开(公告)号：US5266834A

公开(公告)日：1993-11-30

申请号：US915761

申请日：1992-07-21

申请人： Kunihiko Nishi ,  Michio Tanimoto ,  Toshihiro Yasuhara ,  Katsuhiro Tabata ,  Yasuhiro Yoshikawa ,  Isao Akima ,  Souichi Kunito ,  Toshio Nosaka ,  Hideaki Nakamura

发明人： Kunihiko Nishi ,  Michio Tanimoto ,  Toshihiro Yasuhara ,  Katsuhiro Tabata ,  Yasuhiro Yoshikawa ,  Isao Akima ,  Souichi Kunito ,  Toshio Nosaka ,  Hideaki Nakamura

IPC分类号： H01L23/495 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

摘要翻译： 提供了用于实现更高的堆积密度和更高的存储器电路集成的封装，特别地，提供了具有堆叠的多个薄的表面贴装封装的结构。 每个层叠包装包括半导体颗粒，固定在颗粒的前表面的引线，固定到其后表面的散热板和树脂模制构件。 为了实现稳定的层压结构，模具构件在颗粒的前侧成形为凸形，并且在其后侧成为凹形，使得一个包装的凹部能够与凸部接合 的另一个包。

公开(公告)号：US5150193A

公开(公告)日：1992-09-22

申请号：US653244

申请日：1991-02-11

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

IPC分类号： H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01205 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351

摘要： The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.

摘要翻译： 本发明的特征在于，在芯片焊盘或突片中设置大面积的贯通孔，防止树脂在气相成膜用高温焊接气氛中的表面封装树脂封装的背面开裂， 相回流等，由此提供了高可靠性的树脂模制表面封装IC。

公开(公告)号：US4989068A

公开(公告)日：1991-01-29

申请号：US306398

申请日：1989-02-06

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami

IPC分类号： H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/556

CPC分类号： H01L24/32 ,  H01L23/3135 ,  H01L23/3164 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/556 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1815

摘要： A semiconductor device having a structure in which an insulating resin film or sheet is stuck on the principal surface of a semiconductor chip which is formed with circuits and in which the inner lead portions of a lead frame are arranged on the principal surface of the semiconductor chip through the insulating sheet, is provided in order that the semiconductor chip having the highest possible density of integration may be received placed in a standardized package. The present invention particularly features the shape of the lead frame, according to which the inner lead portions lying within a sealing member are substantially entirely arrayed over the semiconductor chip itself. The fore or front ends of the inner lead portions and the external terminals are located near the shorter lateral sides thereof on the semiconductor chip and the corresponding electrical connections therebetween are along the shorter sides of the semiconductor chip by pieces of bonding wire connecting respective front ends of inner lead portions with corresponding external terminals.

公开(公告)号：US4987474A

公开(公告)日：1991-01-22

申请号：US536932

申请日：1990-06-12

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Asao Nishimura ,  Naozumi Hatada ,  Sueo Kawai ,  Makoto Kitano ,  Hideo Miura ,  Akihiro Yaguchi ,  Gen Murakami

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Asao Nishimura ,  Naozumi Hatada ,  Sueo Kawai ,  Makoto Kitano ,  Hideo Miura ,  Akihiro Yaguchi ,  Gen Murakami

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

摘要： In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.

摘要翻译： 在放置或放置在树脂成型包装体中的放大或放大的半导体芯片时，用于放置内部引线的空间被充分地固定的无引线框架中，为了增加占空比的目的，提供通孔 树脂部分。 此外，与颗粒的下表面相对应的每个引线在其宽度方向上分支成多个部分，以便减小应力。 此外，在介于引线和芯片之间的绝缘片中，其较短侧面的尺寸被设定为小于颗粒的较短侧面的尺寸，以防止在端部的端部发生裂纹 绝缘片。