公开(公告)号：US08436429B2

公开(公告)日：2013-05-07

申请号：US13118445

申请日：2011-05-29

Applicant: Yan Xun Xue ,  Yueh-Se Ho ,  Lei Shi ,  Jun Lu ,  Liang Zhao

Inventor： Yan Xun Xue ,  Yueh-Se Ho ,  Lei Shi ,  Jun Lu ,  Liang Zhao

IPC: H01L27/088

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked power semiconductor device includes vertical metal oxide semiconductor field-effect transistors and dual lead frames packaged with flip-chip technology. In the method of manufacturing the stacked power semiconductor device, a first semiconductor chip is flip chip mounted on the first lead frame. A mounting clips is connected to the electrode at back side of the first semiconductor chip. A second semiconductor chip is mounted on the second lead frame, which is then flipped and stacked on the mounting clip.

Abstract translation: 叠层功率半导体器件包括垂直金属氧化物半导体场效应晶体管和采用倒装芯片技术封装的双引线框架。 在制造堆叠式功率半导体器件的方法中，第一半导体芯片是安装在第一引线框上的倒装芯片。 安装夹在第一半导体芯片的背面连接到电极。 第二半导体芯片安装在第二引线框架上，然后翻转并堆叠在安装夹上。

公开(公告)号：US08431993B2

公开(公告)日：2013-04-30

申请号：US13289918

申请日：2011-11-04

Applicant: Yan Xun Xue ,  Jun Lu ,  Lei Shi ,  Liang Zhao

Inventor： Yan Xun Xue ,  Jun Lu ,  Lei Shi ,  Liang Zhao

IPC: H01L29/94 ,  H01L29/76 ,  H01L31/062 ,  H01L31/119 ,  H01L31/113

CPC classification number: H01L24/73 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.

Abstract translation: 公开了一种将引线框封装内的互连板连接到半导体管芯的方法。 基座引线框架设置有用于附接半导体管芯的管芯焊盘。 提供互连板，用于附接到基底引线框架和半导体管芯。 将基准注册功能添加到基准引线框架和板对准特征到互连板上，其中配准特征被设计成彼此匹配，使得在互连板到基底引线框架的接近时，两个配准特征将相互接合并引导彼此引起伴随 互连板与基座引线框架的自对准连接。 接下来，使互连板靠近基底引线框架以将板对准特征接合并锁定到基准对准特征，从而完成互连板连接到半导体管芯并形成引线框封装。

公开(公告)号：US08370542B2

公开(公告)日：2013-02-05

申请号：US10663384

申请日：2003-09-16

Applicant: Jun Lu ,  Parag Gokhale

Inventor： Jun Lu ,  Parag Gokhale

IPC: G06F13/00

CPC classification number: G06F11/1448 ,  G06F3/0613 ,  G06F3/065 ,  G06F3/0686 ,  G06F17/30283 ,  G11B20/10

Abstract: A system and method for transferring data in a library storage system. The library storage system comprises a management server including a storage policy. A media agent is connected to the management server. A plurality of storage media and a data source are connected to the media agent. The data source is divided into at least a first and a second portion of data. The portions of data are transferred from the data source to a first and second primary storage medium using a first and a second data stream respectively. The media agent then causes the first and second portion of data to be transferred from the first and second storage medium to a third auxiliary storage medium using a third combined data stream. Auxiliary copying is performed in chunks and multiple streams are copied in parallel.

公开(公告)号：US20120322207A1

公开(公告)日：2012-12-20

申请号：US13545225

申请日：2012-07-10

Applicant: Xiaotian Zhang ,  Jun Lu

Inventor： Xiaotian Zhang ,  Jun Lu

IPC: H01L21/60

CPC classification number: H01L24/37 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/0603 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8585 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.

Abstract translation: 本发明公开了一种半导体封装，其具有预先印刷在引线框架和芯片上的粘合剂材料及其制造方法。 粘合剂材料通过预打印被施加到芯片载体和引线框架的引脚以及半导体芯片的前电极上。 半导体芯片的背面粘附在芯片载体上，并且半导体芯片的前电极和引脚分别与金属连接器连接。 根据不同的应用要求，根据半导体芯片和金属连接器的接触区域的尺寸和形状来施加粘合材料的尺寸，形状和厚度。 特别地，通过预先印刷粘合剂材料形成粘合剂区域，从而显着提高半导体产品的质量和性能，并提高生产率。

公开(公告)号：US08315981B2

公开(公告)日：2012-11-20

申请号：US12750009

申请日：2010-03-30

Applicant: Anand Prahlad ,  Parag Gokhale ,  Rajiv Kottomtharayil ,  Jun Lu ,  Rahul S. Pawar

Inventor： Anand Prahlad ,  Parag Gokhale ,  Rajiv Kottomtharayil ,  Jun Lu ,  Rahul S. Pawar

IPC: G06F7/00 ,  G06F17/00

CPC classification number: G06F11/1451 ,  G06F11/1448 ,  G06F11/1458 ,  G06F11/1464 ,  G06F11/1469 ,  G06F17/30283 ,  G06F17/3056 ,  H04L63/102 ,  H04L67/1097

Abstract: Systems and methods integrate disparate backup devices with a unified interface. In certain examples, a management console manages data from various backup devices, while retaining such data in its native format. The management console can display a hierarchical view the client devices and/or their data and can further provide utilities for processing the various data formats. A data structure including fields for storing both metadata common to the client device data and value-added metadata can be used to mine or process the data of the disparate client devices. The unified single platform and interface reduces the need for multiple data management products and/or customized data utilities for each individual client device and provides a single pane of glass view into data management operations. Integrating the various types of storage formats and media allows a user to retain existing storage infrastructures and further facilitates scaling to meet long-term management needs.

Abstract translation: 系统和方法将不同的备份设备与统一的接口集成。 在某些示例中，管理控制台管理来自各种备份设备的数据，同时以其本机格式保留此类数据。 管理控制台可以显示客户端设备和/或其数据的分层视图，并且可以进一步提供用于处理各种数据格式的实用程序。 可以使用包括用于存储客户端设备数据和增值元数据共有的元数据的字段的数据结构来挖掘或处理不同客户端设备的数据。 统一的单一平台和接口减少了对每个单独的客户端设备的多个数据管理产品和/或定制数据实用程序的需求，并将单个窗格视图提供到数据管理操作中。 集成各种类型的存储格式和媒体允许用户保留现有的存储基础架构，并进一步促进扩展以满足长期管理需求。

公开(公告)号：US08302287B2

公开(公告)日：2012-11-06

申请号：US12891105

申请日：2010-09-27

Applicant: Jun Lu ,  François Hébert

Inventor： Jun Lu ,  François Hébert

IPC: H01F7/06

CPC classification number: H01F17/0013 ,  H01F27/29 ,  H01F41/046 ,  H01L2224/16235 ,  H01L2924/15311 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073

Abstract: A multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element.

Abstract translation: 多层电感器包括具有形成在其底表面上的外部导电图案的底部磁性层，用于连接到诸如印刷电路板的基板。 底部外部导电图案包括信号/电源触点和第一和第二电感器电极。 顶部磁性层包括具有信号/功率触点和电感器电极触点的顶部外部导电图案。 形成在设置在顶部和底部磁性层之间的中间磁性层的顶表面上的电感器导电图案通过通孔彼此电耦合以形成螺旋形电感器元件。

公开(公告)号：US08298618B2

公开(公告)日：2012-10-30

申请号：US12459795

申请日：2009-07-07

Applicant: Dongpeng Yan ,  Jun Lu ,  Min Wei ,  Xue Duan

Inventor： Dongpeng Yan ,  Jun Lu ,  Min Wei ,  Xue Duan

IPC: B05D5/00 ,  B05D7/24 ,  B05D1/18 ,  B05D1/38

CPC classification number: C09K11/06 ,  C09K2211/1408 ,  H01L51/0038 ,  H01L51/5032 ,  H01L51/5278 ,  H05B33/10

Abstract: A preparation method of composite blue luminescent thin film of sulfonated poly(p-phenylene) (i.e. poly[2,5-bis(3-sulfonatopropoxy)-1,4-phenylene-alt-1,4-phenylene]) and LDHs (Layered Double Hydroxides) is disclosed. The preparation method comprises the following steps: preparing delaminated LDHs colloidal solution using formamide solvent, preparing sulfonated poly(p-phenylene) aqueous solution, and performing alternate assembling on hydrophilically treated substrate in the two solutions to give the composite thin film of sulfonated poly(p-phenylene)/LDHs multilayer. The preparation method has the advantages of simple preparation process, and film thickness controllable at nanoscale precision, in addition, this method also achieves the immobilization of luminescent polymer via restricted space among LDHs layers and host-guest interaction, effectively improves thermal stability, and reduces fluorescence quenching caused by aggregation.

Abstract translation: 磺化聚（对亚苯基）（即聚[2,5-双（3-磺基丙氧基）-1,4-亚苯基 - 邻-1,4-亚苯基]）和LDHs的复合蓝色发光薄膜的制备方法 分层双氢氧化物）。 制备方法包括以下步骤：使用甲酰胺溶剂制备分层的LDHs胶体溶液，制备磺化聚（对亚苯基）水溶液，并在两种溶液中对亲水处理的基材进行交替组装，得到磺化聚（ 对亚苯基）/ LDHs多层。 该制备方法制备工艺简单，膜厚可控于纳米级精度，此外，该方法还通过LDH层间的空间限制和主 - 客体相互作用实现了发光聚合物的固定，有效提高了热稳定性，降低了 由聚集引起的荧光猝灭。

公开(公告)号：US08247288B2

公开(公告)日：2012-08-21

申请号：US12947717

申请日：2010-11-16

Applicant: Yan Xun Xue ,  Anup Bhalla ,  Hamza Yilmaz ,  Jun Lu

Inventor： Yan Xun Xue ,  Anup Bhalla ,  Hamza Yilmaz ,  Jun Lu

IPC: H01L21/8242

CPC classification number: H01L23/5223 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0629 ,  H01L27/0688 ,  H01L28/88 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A bypass capacitor is directly integrated on top of a MOSFET chip. The capacitor comprises multi layers of conductive material and dielectric material staking on top of each other with connection vias through dielectric layer for connecting different conductive layers. The method of integrating the bypass capacitor comprises repeating steps of depositing a dielectric layer, forming connection vias through the dielectric layer, depositing a conductive layer and patterning the conductive layer.

Abstract translation: 旁路电容直接集成在MOSFET芯片的顶部。 电容器包括多层导电材料和电介质材料，它们通过介电层连接不同导电层的连接通孔彼此顶部。 集成旁路电容器的方法包括沉积介电层的重复步骤，形成通过电介质层的连接通孔，沉积导电层和图案化导电层。

公开(公告)号：US08229954B2

公开(公告)日：2012-07-24

申请号：US13343034

申请日：2012-01-04

Applicant: Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

Inventor： Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

IPC: G06F17/30

CPC classification number: G06F17/30094 ,  G06F11/1448 ,  G06F11/1453 ,  Y10S707/99934 ,  Y10S707/99955

Abstract: A method in a computer system for retrieving data from one of multiple copies of the data is provided, referred to as the data management system. The data management system receives a request identifying a data object to be accessed. Then, the data management system queries a metabase to locate data copies that contain the identified data object, wherein the data copies are created from similar source data, and wherein for each data copy the metabase contains an indication of the availability of the copy relative to other copies. Next, the data management system determines one of the located data copies to use to access the identified data object, wherein the determination is made based on the indicated availability contained in the metabase for each of the located data copies. Then, the data management system accesses the identified data object using the determined one of the located data copies.

Abstract translation: 提供了一种用于从数据的多个副本之一检索数据的计算机系统中的方法，称为数据管理系统。 数据管理系统接收标识要访问的数据对象的请求。 然后，数据管理系统查询元数据库以定位包含识别的数据对象的数据副本，其中数据副本是从类似的源数据创建的，并且其中对于每个数据拷贝，元数据库包含相对于 其他副本。 接下来，数据管理系统确定用于访问所识别的数据对象的所定位的数据副本之一，其中基于针对每个所定位的数据副本的元数据库中包含的指示的可用性进行确定。 然后，数据管理系统使用所确定的一个定位的数据副本来访问所识别的数据对象。

公开(公告)号：US08180837B2

公开(公告)日：2012-05-15

申请号：US12114815

申请日：2008-05-04

Applicant: Jun Lu ,  Jiandong Cheng

Inventor： Jun Lu ,  Jiandong Cheng

IPC: G06F15/16 ,  G06K9/00

CPC classification number: G06Q10/107 ,  G06K9/00456

Abstract: Systems and methods for an anti-spam detection module that can detect image spam are provided. According to one embodiment, an image spam detection process involves determining and measuring various characteristics of images that may be embedded within or otherwise associated with an electronic mail (email) message. An approximate display location of the embedded images is determined. The existence of one or more abnormal factors associated with the embedded images is identified. A quantity of text included in the one or more embedded images is determined and measured by analyzing one or more blocks of binarized representations of the one or more embedded images. Finally, the likelihood that the email message is spam is determined based on one or more of the approximate display location, the existence of one or more abnormal factors and the quantity and location of text measured.

Abstract translation: 提供了可以检测图像垃圾邮件的反垃圾邮件检测模块的系统和方法。 根据一个实施例，图像垃圾邮件检测过程涉及确定和测量可以嵌入在电子邮件（电子邮件）消息内或以其他方式与电子邮件（电子邮件））消息相关联的图像的各种特征。 确定嵌入图像的近似显示位置。 识别与嵌入图像相关联的一个或多个异常因素的存在。 通过分析一个或多个嵌入图像的二值化表示的一个或多个块来确定和测量包含在一个或多个嵌入图像中的文本量。 最后，基于一个或多个近似显示位置，一个或多个异常因素的存在以及测量的文本的数量和位置来确定电子邮件是垃圾邮件的可能性。