公开(公告)号：US20070114640A1

公开(公告)日：2007-05-24

申请号：US11602881

申请日：2006-11-21

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01L23/495

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作电介质材料，但在过电压事件期间，电压可切换材料变得导电并且可以将电导向地电。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。

公开(公告)号：US09084354B2

公开(公告)日：2015-07-14

申请号：US13597152

申请日：2012-08-28

Applicant: Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

Inventor： Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

IPC: H05K3/10 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/10

Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Abstract translation: 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。

公开(公告)号：US09007165B2

公开(公告)日：2015-04-14

申请号：US13524776

申请日：2012-06-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

IPC: H01C7/10 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Abstract translation: 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

公开(公告)号：US08940193B2

公开(公告)日：2015-01-27

申请号：US13158356

申请日：2011-06-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/12 ,  H01C7/10 ,  B05D5/12 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/065 ,  H05K1/02 ,  H05K3/18 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US08723153B2

公开(公告)日：2014-05-13

申请号：US13447173

申请日：2012-04-14

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01L29/04

CPC classification number: H01L21/02118 ,  B82Y30/00 ,  H01C7/12 ,  H01L21/02112 ,  H01L21/02126 ,  H01L21/02167 ,  H01L21/02175 ,  H01L21/312 ,  H01L21/3148 ,  H01L21/318 ,  Y10S438/90

Abstract: Formulations for voltage switchable dielectric materials include two or more different types of semiconductive materials uniformly dispersed within a dielectric matrix material. The semiconductive materials are selected to have different bandgap energies in order to provide the voltage switchable dielectric material with a stepped voltage response. The semiconductive materials may comprise inorganic particles, organic particles, or an organic material that is soluble in, or miscible with, the dielectric matrix material. Formulations optionally can also include electrically conductive materials. At least one of the conductive or semiconductive materials in a formulation can comprise particles characterized by an aspect ratio of at least 3 or greater.

Abstract translation: 可变压电介质材料的配方包括均匀分散在电介质基质材料中的两种或多种不同类型的半导体材料。 选择半导体材料具有不同的带隙能量，以便提供具有阶梯式电压响应的电压可切换介电材料。 半导体材料可以包括无机颗粒，有机颗粒或可溶于介质基质材料或与之混溶的有机材料。 制剂任选地还可以包括导电材料。 制剂中的导电或半导体材料中的至少一种可以包括以纵横比为至少3或更大的特征的颗粒。

公开(公告)号：US08362871B2

公开(公告)日：2013-01-29

申请号：US12607952

申请日：2009-10-28

Applicant: Lex Kosowsky ,  Robert Fleming ,  Ning Shi

Inventor： Lex Kosowsky ,  Robert Fleming ,  Ning Shi

IPC: H01C1/012

CPC classification number: H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/115 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09736 ,  H05K2201/09781

Abstract: A substrate device includes a layer of non-linear resistive transient protective material and a plurality of conductive elements that form part of a conductive layer. The conductive elements include a pair of electrodes that are spaced by a gap, but which electrically interconnect when the transient protective material is conductive. The substrate includes features to linearize a transient electrical path that is formed across the gap.

Abstract translation: 衬底装置包括形成导电层的一部分的非线性电阻性瞬态保护材料层和多个导电元件。 导电元件包括​​一对间隔开的电极，但当瞬态保护材料是导电的时，它们进行电互连。 衬底包括使跨越间隙形成的瞬态电路线性化的特征。

公开(公告)号：US20120202930A1

公开(公告)日：2012-08-09

申请号：US13447173

申请日：2012-04-14

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B3/30 ,  C08K5/3437 ,  C08K5/3415 ,  B82Y30/00

CPC classification number: H01L21/02118 ,  B82Y30/00 ,  H01C7/12 ,  H01L21/02112 ,  H01L21/02126 ,  H01L21/02167 ,  H01L21/02175 ,  H01L21/312 ,  H01L21/3148 ,  H01L21/318 ,  Y10S438/90

Abstract: Formulations for voltage switchable dielectric materials include two or more different types of semiconductive materials uniformly dispersed within a dielectric matrix material. The semiconductive materials are selected to have different bandgap energies in order to provide the voltage switchable dielectric material with a stepped voltage response. The semiconductive materials may comprise inorganic particles, organic particles, or an organic material that is soluble in, or miscible with, the dielectric matrix material. Formulations optionally can also include electrically conductive materials. At least one of the conductive or semiconductive materials in a formulation can comprise particles characterized by an aspect ratio of at least 3 or greater.

Abstract translation: 可变压电介质材料的配方包括均匀分散在电介质基质材料中的两种或多种不同类型的半导体材料。 选择半导体材料具有不同的带隙能量，以便提供具有阶梯式电压响应的电压可切换介电材料。 半导体材料可以包括无机颗粒，有机颗粒或可溶于介质基质材料或与之混溶的有机材料。 制剂任选地还可以包括导电材料。 制剂中的导电或半导体材料中的至少一种可以包括以纵横比为至少3或更大的特征的颗粒。

公开(公告)号：US08206614B2

公开(公告)日：2012-06-26

申请号：US12356490

申请日：2009-01-20

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06

CPC classification number: H01B3/006 ,  B82Y10/00 ,  H01B1/24 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0738 ,  Y10T428/2991

Abstract: A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.

Abstract translation: 一种电压可切换电介质材料，其包含通过机械或机械化学键合方法单独形成的多组分颗粒的浓度，所述机械或机械化学键合方法将半导体或导电型主体颗粒与多个绝缘，导电或半导电的客体颗粒结合。

公开(公告)号：US07968015B2

公开(公告)日：2011-06-28

申请号：US12832040

申请日：2010-07-07

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/04 ,  H02H9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

Abstract translation: 一个或多个实施例提供一种利用具有相对较高纵横比的半导体或导电材料的可开关电介质材料的发光二极管器件。

公开(公告)号：US20110140273A1

公开(公告)日：2011-06-16

申请号：US13034450

申请日：2011-02-24

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01L23/498

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric material, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作介电材料，但是在过电压事件期间，电压可切换材料变得导电并且可以将电传导到地面。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。