公开(公告)号：US20100193928A1

公开(公告)日：2010-08-05

申请号：US12364340

申请日：2009-02-02

申请人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

发明人： Frank Zudock ,  Thorsten Meyer ,  Markus Brunnbauer ,  Andreas Wolter

IPC分类号： H01L25/11 ,  H01L23/538 ,  H01L21/768

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2224/82

摘要： A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

摘要翻译： 一种半导体器件包括半导体芯片，其具有在半导体芯片的第一主面之间延伸的贯通连接和与第一主面相对的半导体芯片的第二主面，至少部分地封装半导体芯片的封装材料，以及第一 金属层设置在封装材料上并与通孔连接。

公开(公告)号：US20090261468A1

公开(公告)日：2009-10-22

申请号：US12105837

申请日：2008-04-18

申请人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

发明人： Werner Kroeninger ,  Josef Schwaiger ,  Ludwig Schneider ,  Ottmar Geitner ,  Markus Brunnbauer ,  Thorsten Meyer ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Xaver Schloegel

IPC分类号： H01L21/50 ,  H01L23/00

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/25 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/072 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

摘要翻译： 半导体模块。 一个实施例提供放置在载体上的至少两个半导体芯片。 然后将至少两个半导体芯片用模制材料覆盖以形成模制体。 成型体变薄，直到暴露出至少两个半导体芯片。 然后，从至少两个半导体芯片移除载体。 将至少两个半导体芯片分割。

公开(公告)号：US07585701B2

公开(公告)日：2009-09-08

申请号：US11439425

申请日：2006-05-24

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

摘要翻译： 具有粘合膜的载体片包括具有上侧和下侧的耐热基膜，以及设置在基膜的下侧并且朝向载体片取向的热敏粘合剂层。 基膜的上侧包括固定有半导体芯片的粘合剂层，半导体芯片由膜上侧的粘合剂层的去活化区域包围。

公开(公告)号：US20090045511A1

公开(公告)日：2009-02-19

申请号：US11839129

申请日：2007-08-15

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Stephan Bradl

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Stephan Bradl

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L23/525 ,  H01L23/5329 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： An integrated circuit includes a substrate including a contact pad, a redistribution line coupled to the contact pad, and a dielectric material layer between the substrate and the redistribution line. The integrated circuit includes a solder ball coupled to the redistribution line and a parylene material layer sealing the dielectric material layer and the redistribution line.

摘要翻译： 集成电路包括包括接触焊盘，耦合到接触焊盘的再分配线以及衬底和再分配线之间的介电材料层的衬底。 集成电路包括耦合到再分配线的焊球和密封介电材料层和再分配线的聚对二甲苯材料层。

公开(公告)号：US20080135977A1

公开(公告)日：2008-06-12

申请号：US11614579

申请日：2006-12-21

申请人： Thorsten Meyer ,  Bernd Waidhas ,  Markus Brunnbauer ,  Grit Sommer ,  Thomas Wagner

发明人： Thorsten Meyer ,  Bernd Waidhas ,  Markus Brunnbauer ,  Grit Sommer ,  Thomas Wagner

IPC分类号： H01L21/20 ,  H01L29/00

CPC分类号： H01L23/645 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： Semiconductor element having a semiconductor chip and a passive component, as well as a method for its productionThe invention relates to a semiconductor component (1) having a semiconductor chip (2), and a passive component (3), with the semiconductor component (1) having a coil (6) as the passive component (3). The semiconductor chip (2) and the passive component (3) are embedded in a plastic encapsulation compound (4) with connection elements to external contacts (31).

摘要翻译： 具有半导体芯片和无源元件的半导体元件及其制造方法本发明涉及具有半导体芯片（2）的半导体元件（1）和具有半导体元件（2）的无源元件（3） 1）具有线圈（6）作为被动部件（3）。 将半导体芯片（2）和无源部件（3）嵌入塑料封装化合物（4）中，其中连接元件连接到外部触点（31）。

公开(公告)号：US20070249102A1

公开(公告)日：2007-10-25

申请号：US11738213

申请日：2007-04-20

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L21/00 ,  H01L21/82

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed. The embodiments include a wiring structure with interconnects and dielectric layers composed of a low-k dielectric is arranged on the top side of the composite plate.

摘要翻译： 公开了一种面板和半导体器件，在一个实施例中，由具有半导体芯片的复合板和塑料外壳组成构成，以及其制造方法。 这些实施例包括具有互连的布线结构和由低k电介质构成的电介质层布置在复合板的顶侧上。

公开(公告)号：US20060273469A1

公开(公告)日：2006-12-07

申请号：US11439425

申请日：2006-05-24

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

公开(公告)号：US20140197530A1

公开(公告)日：2014-07-17

申请号：US13739045

申请日：2013-01-11

申请人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

发明人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/315 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer.

摘要翻译： 描述了半导体器件，其具有至少一个半导体芯片，该芯片在其顶侧具有有源区，至少部分形成在低k材料上的有源区，所述低k材料限定低k分区 说活跃区; 嵌入材料，其中所述至少一个半导体芯片被嵌入，所述嵌入材料的至少一部分与所述有源区域形成共面区域; 低k子区域内的至少一个接触区域; 在共面区域上的再分配层，再分配层连接到所述接触区域; 位于所述低k子区域外的至少一个第一级互连，所述第一级互连经由再分配层电连接到所述接触区域中的至少一个。

公开(公告)号：US08524542B2

公开(公告)日：2013-09-03

申请号：US13556837

申请日：2012-07-24

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54493 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A blank and a semiconductor device include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

摘要翻译： 空白和半导体器件包括具有嵌入在塑料封装模塑料中的半导体芯片的复合面板。 坯料包括具有半导体芯片的复合面板，该复合面板具有以塑料封装模制化合物排成行和列的半导体芯片，半导体芯片的有源上侧与复合面板的上侧形成共面表面积。 当半导体芯片嵌入模塑料中时，该坯料还包括印模在塑料封装模塑料中的取向指示器。

公开(公告)号：US08431063B2

公开(公告)日：2013-04-30

申请号：US11581060

申请日：2006-10-16

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： B29B17/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

摘要： A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

摘要翻译： 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（TR）。