公开(公告)号：US20180269364A1

公开(公告)日：2018-09-20

申请号：US15542150

申请日：2016-01-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel

IPC: H01L33/54 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A method of producing a plurality of optoelectronic semiconductor components includes a) preparing a composite with a semiconductor layer sequence, wherein the composite includes a plurality of component areas mechanically connected to one another; b) forming a plurality of connecting surfaces on the semiconductor layer sequence, wherein at least one connecting surface is formed on each component area; c) forming a molding compound on the semiconductor layer sequence, wherein the molding compound fills interstices between the connecting surfaces; and d) singulating the composite with the molding compound, wherein during singulation a plurality of molded bodies is formed from the molding compound, each of which is associated with a semiconductor body obtained from a component area of the composite.

公开(公告)号：US20180182926A1

公开(公告)日：2018-06-28

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/38 ,  H01L33/24 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.

公开(公告)号：US20170221869A1

公开(公告)日：2017-08-03

申请号：US15484499

申请日：2017-04-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Lutz Höppel ,  Norwin von Malm

IPC: H01L25/16 ,  H01L33/56 ,  H01L29/861 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L25/167 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L29/861 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03334 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/11002 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92143 ,  H01L2224/94 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.

公开(公告)号：US09590008B2

公开(公告)日：2017-03-07

申请号：US14702807

申请日：2015-05-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Norwin von Malm ,  Patrick Rode ,  Lutz Höppel ,  Karl Engl

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/38 ,  H01L33/00 ,  H01L33/02

CPC classification number: H01L27/15 ,  H01L25/167 ,  H01L33/005 ,  H01L33/02 ,  H01L33/08 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation and is arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region facing away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer, in the emission region, electrically conductively connects to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; the second semiconductor layer, in the emission region, electrically conductively connects to a second connection layer.

Abstract translation: 辐射发射半导体芯片包括具有半导体层序列的载体和半导体本体，其中在具有半导体层序列的半导体主体中形成发光区域和保护二极管区域; 半导体层序列包括产生辐射并且被布置在第一半导体层和第二半导体层之间的有源区; 第一半导体层布置在有源区域背离载体的一侧; 发射区域具有延伸穿过有源区域的凹部; 发射区域中的第一半导体层导电地连接到第一连接层，其中第一连接层在凹部中从第一半导体层向载体延伸; 在发射区域中的第二半导体层导电地连接到第二连接层。

公开(公告)号：US20150270458A1

公开(公告)日：2015-09-24

申请号：US14428333

申请日：2013-09-19

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Lutz Höppel ,  Alexander F. Pfeuffer

IPC: H01L33/56 ,  H01L33/60

CPC classification number: H01L33/56 ,  H01L27/156 ,  H01L33/0016 ,  H01L33/08 ,  H01L33/405 ,  H01L33/44 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip is disclosed. The optoelectronic semiconductor chip includes a semiconductor layer sequence having an active zone suitable for emitting radiation, a carrier substrate, and a mirror layer, the mirror layer being arranged between the semiconductor layer sequence and the carrier substrate, wherein the semiconductor layer sequence is subdivided into a plurality of active regions arranged alongside one another, wherein the plurality of active regions are separated from one another in each case by a trench in the semiconductor layer sequence, wherein the trench in each case severs the semiconductor layer sequence and the mirror layer, wherein the mirror layer has side surfaces facing a trench and side surfaces facing an outer side of the semiconductor chip, wherein the side surfaces of the mirror layer that face an outer side of the semiconductor chip have a metallic encapsulation layer.

Abstract translation: 公开了一种光电半导体芯片。 光电子半导体芯片包括具有适于发射辐射的有源区的半导体层序列，载体衬底和镜像层，镜层布置在半导体层序列和载体衬底之间，其中半导体层序列被细分为 多个有源区域彼此并排布置，其中多个有源区域在每种情况下都分别由半导体层序列中的沟槽分开，其中沟槽在每种情况下都分开半导体层序列和镜面层，其中 镜层具有面向沟槽的侧表面和面向半导体芯片的外侧的侧表面，其中面对半导体芯片的外侧的镜面层的侧表面具有金属封装层。