公开(公告)号：US11409682B2

公开(公告)日：2022-08-09

申请号：US16950861

申请日：2020-11-17

Applicant: Rambus Inc.

Inventor： Amir Amirkhany ,  Suresh Rajan ,  Ravindranath Kollipara ,  Ian Shaeffer ,  David A. Secker

IPC: G06F13/40 ,  G06F13/16 ,  G06F12/00 ,  G06F13/00

Abstract: A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

公开(公告)号：US11106542B2

公开(公告)日：2021-08-31

申请号：US16593305

申请日：2019-10-04

Applicant: Rambus Inc.

Inventor： Steven Woo ,  David A. Secker ,  Ravindranath Kollipara

IPC: G06F11/14 ,  G06F1/12 ,  G06F11/16 ,  G06F11/20 ,  G06F13/42

Abstract: Described is memory system enabling memory mirroring in single write operations for the primary and backup data storage. The memory system utilizes a memory channel including one or more latency groups, with each latency group encompassing a number of memory modules that have the same signal timing to the controller. A primary copy and a backup copy of a data element can be written to two memory modules in the same latency group of the channel and in a single write operation. The buses of the channel may have the same trace length to each of the memory modules within a latency group.

公开(公告)号：US20200026677A1

公开(公告)日：2020-01-23

申请号：US16525315

申请日：2019-07-29

Applicant: Rambus Inc.

Inventor： Amir Amirkhany ,  Suresh Rajan ,  Ravindranath Kollipara ,  Ian Shaeffer ,  David A. Secker

IPC: G06F13/40 ,  G06F13/16 ,  G06F12/00 ,  G06F13/00

Abstract: A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

公开(公告)号：US10437685B2

公开(公告)日：2019-10-08

申请号：US15783177

申请日：2017-10-13

Applicant: Rambus Inc.

Inventor： Steven Woo ,  David A. Secker ,  Ravindranath Kollipara

IPC: G06F11/14 ,  G06F1/12 ,  G06F11/20 ,  G06F11/16 ,  G06F13/42

Abstract: Described is memory system enabling memory mirroring in single write operations for the primary and backup data storage. The memory system utilizes a memory channel including one or more latency groups, with each latency group encompassing a number of memory modules that have the same signal timing to the controller. A primary copy and a backup copy of a data element can be written to two memory modules in the same latency group of the channel and in a single write operation. The buses of the channel may have the same trace length to each of the memory modules within a latency group.

公开(公告)号：US20180285013A1

公开(公告)日：2018-10-04

申请号：US15745396

申请日：2016-07-14

Applicant: Rambus Inc.

Inventor： Suresh Rajan ,  Abhijit M. Abhyankar ,  Ravindranath Kollipara ,  David A. Secker

IPC: G06F3/06 ,  G06F13/16

Abstract: Described are memory modules that include address-buffer components and data-buffer components that together support wide- and narrow-data modes. The address-buffer component manages communication between a memory controller and two sets of memory components. In the wide-data mode, the address-buffer enables memory components in each set and instructs the data-buffer components to communicate full-width read and write data by combining data from or to from both sets for each memory access. In the narrow-data mode, the address-buffer enables memory components in just one of the two sets and instructs the data-buffer components to half-width read and write data with one set per memory access.

公开(公告)号：US20180089035A1

公开(公告)日：2018-03-29

申请号：US15783177

申请日：2017-10-13

Applicant: Rambus Inc.

Inventor： Steven Woo ,  David A. Secker ,  Ravindranath Kollipara

IPC: G06F11/14 ,  G06F11/16

CPC classification number: G06F11/1456 ,  G06F1/12 ,  G06F11/1666 ,  G06F11/20 ,  G06F11/2058 ,  G06F13/4234 ,  G06F2201/84 ,  Y02D10/14 ,  Y02D10/151

Abstract: Described is memory system enabling memory minoring in single write operations for the primary and backup data storage. The memory system utilizes a memory channel including one or more latency groups, with each latency group encompassing a number of memory modules that have the same signal timing to the controller. A primary copy and a backup copy of a data element can be written to two memory modules in the same latency group of the channel and in a single write operation. The buses of the channel may have the same trace length to each of the memory modules within a latency group.

公开(公告)号：US20180047436A1

公开(公告)日：2018-02-15

申请号：US15623261

申请日：2017-06-14

Applicant: Rambus Inc.

Inventor： Ian Shaeffer ,  Lawrence Lai ,  Fan Ho ,  David A. Secker ,  Wayne S. Richardson ,  Akash Bansal ,  Brian S. Leibowitz ,  Kyung Suk Oh

IPC: G11C8/12 ,  G11C5/04 ,  G11C5/06 ,  G11C8/18 ,  H01L23/00 ,  H01L25/065 ,  G11C5/02 ,  G11C7/10

CPC classification number: G11C8/12 ,  G11C5/02 ,  G11C5/04 ,  G11C5/06 ,  G11C5/063 ,  G11C7/1012 ,  G11C7/1045 ,  G11C8/18 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins.

公开(公告)号：US20150332746A1

公开(公告)日：2015-11-19

申请号：US14813028

申请日：2015-07-29

Applicant: Rambus Inc.

Inventor： Ian Shaeffer ,  Lawrence Lai ,  Fan Ho ,  David A. Secker ,  Wayne S. Richardson ,  Akash Bansal ,  Brian S. Leibowitz ,  Kyung Suk Oh

IPC: G11C8/12 ,  G11C8/18 ,  G11C5/02

CPC classification number: G11C8/12 ,  G11C5/02 ,  G11C5/04 ,  G11C5/06 ,  G11C5/063 ,  G11C7/1012 ,  G11C7/1045 ,  G11C8/18 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins.

Abstract translation: 描述了包括可编程命令和地址（CA）接口和/或可编程数据接口的存储器件。 在操作模式下，两个或多个CA接口可能处于活动状态。 在另一操作模式中，至少一个但不是全部的CA接口可能是活动的。 在操作模式下，所有数据接口都可能处于活动状态。 在另一种操作模式中，至少一个但不是全部的数据接口可能是活动的。 存储器装置可以包括用于选择：操作模式的电路; 操作模式中的子模式; 一个或多个CA接口作为活动CA接口; 来自多个活动CA接口的主CA接口; 和/或一个或多个数据接口作为活动数据接口。 电路可以基于一个或多个寄存器中的一个或多个位和/或在一个或多个引脚上接收到的一个或多个信号来执行这些选择。

公开(公告)号：US20150108656A1

公开(公告)日：2015-04-23

申请号：US14513871

申请日：2014-10-14

Applicant: Rambus Inc.

Inventor： Nitin Juneja ,  Wendemagegnehu Beyene ,  David A. Secker ,  Ely K. Tsern

IPC: H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L23/13 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06544 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1436 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/014

Abstract: Disclosed is a package-on-package (PoP) assembly comprises a two-tiered windowed ball grid array (BGA) and a system on a chip (SoC) package. Window openings in the two tiers of the BGA are of different sizes to allow for wirebond landing pads on the first tier. A DRAM die is mounted to the BGA flipped over (i.e., wirebond pads facing the BGA package.) The DRAM die is wirebonded through the window in the BGA. For multi-channel systems and higher memory capacity, the DRAM die will have low-cost through-silicon vias (TSVs) that connect to stacked DRAM die(s). The stacked DRAM dies may be offset or rotated to align active TSVs with passive TSVs thereby enabling unique connections to certain DRAM dies in the stack.

Abstract translation: 公开了一种封装封装（PoP）组件，其包括双层窗口球栅阵列（BGA）和片上系统（SoC）封装。 BGA两层的窗口开口尺寸不同，可以在第一层上使用引线键盘。 DRAM裸片安装到BGA翻转（即，面向BGA封装的引线焊盘）。DRAM裸片通过BGA中的窗口进行引线键合。 对于多通道系统和更高的存储容量，DRAM裸片将具有连接到堆叠的DRAM裸片的低成本的硅通孔（TSV）。 堆叠的DRAM裸片可以偏移或旋转以使有源TSV与无源TSV对准，从而实现与堆叠中的某些DRAM裸片的唯一连接。

公开(公告)号：US20130194854A1

公开(公告)日：2013-08-01

申请号：US13753360

申请日：2013-01-29

Applicant: RAMBUS INC.

Inventor： Ian Shaeffer ,  Lawrence Lai ,  Fan Ho ,  David A. Secker ,  Wayne S. Richardson ,  Akash Bansal ,  Brian S. Leibowitz ,  Kyung Suk Oh

IPC: G11C5/06

CPC classification number: G11C8/12 ,  G11C5/02 ,  G11C5/04 ,  G11C5/06 ,  G11C5/063 ,  G11C7/1012 ,  G11C7/1045 ,  G11C8/18 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins.