公开(公告)号：US12062596B2

公开(公告)日：2024-08-13

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4821 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2924/182

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US20230187306A1

公开(公告)日：2023-06-15

申请号：US17547698

申请日：2021-12-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Woochan Kim ,  Patrick Francis Thompson

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3677 ,  H01L25/0655 ,  H01L24/48 ,  H01L21/4882 ,  H01L2224/48138 ,  H01L2224/48158

Abstract: An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.

公开(公告)号：US10199348B2

公开(公告)日：2019-02-05

申请号：US15194293

申请日：2016-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  B29C45/14 ,  B29C45/00 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L23/495

Abstract: The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

公开(公告)号：US20180277461A1

公开(公告)日：2018-09-27

申请号：US15470486

申请日：2017-03-27

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Vikas Gupta

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

公开(公告)号：US09601414B2

公开(公告)日：2017-03-21

申请号：US14968234

申请日：2015-12-14

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/562 ,  H01L24/03 ,  H01L24/04 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635

Abstract: The invention is directed to a method for inhibiting or preventing delamination at the interface of the die attach/mold compound and the die pad of a semiconductor device and a semiconductor device formed by such method. The method includes providing a leadframe having a top surface; coating the top surface of the leadframe with first and second silane coating; heating the silane coatings to form a porous layer having a porosity of at least 10%; applying a die to the porous layer; securing the die to the porous layer by a die attaching compound; and after the curing of die attach material and wire bonding, a mold compound is applied through molding.

公开(公告)号：US20160307866A1

公开(公告)日：2016-10-20

申请号：US15194293

申请日：2016-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/00 ,  C08K7/14 ,  C08K3/36 ,  C08K3/10 ,  H01L23/495 ,  H01B3/40

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 通过从芯片跨越到基板的导线（201）将附接到基板（103）的芯片（101）的组装装载到模具的加热空腔（402）中; 线表面涂覆有杂环化合物（302）的分子的吸附层; 模具的压力室（404）装载有包括可聚合树脂的包装材料的固体颗粒（410），该室连接到空腔; 在填充模具腔之前，在加热固体颗粒以使其半液体并通过流道（403）对其加压的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，由此 通过被吸附的杂环化合物分子将到达空腔的树脂分子交联到电线表面上的绝缘的至少一个单层的聚合物结构。

公开(公告)号：US09305869B1

公开(公告)日：2016-04-05

申请号：US14587629

申请日：2014-12-31

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaged semiconductor device (100) comprising a leadframe having a pad (101) with an assembled semiconductor chip (110), a plurality of straps (102) connecting the pad to side edges of the device package, leads (103), and a package (150) of plastic compound adhering to the leadframe; at least one surface (102a) of the straps covered with a layer (120) of a compound both non-adhesive to polymeric compounds and hydrophobic; the compound (220) selected from a group including fluorinated thiol compounds, fluorinated amine compounds, fluorinated aminesilanes, organosilanes, and their derivatives; or the compound (330) selected from a group including open-pore microcellular metal foams and polymer foams. Further, the package may include an array of holes through the plastic compound, extending from the package surface to the strap surface.

Abstract translation: 一种封装半导体器件（100），包括具有带有组装的半导体芯片（110）的焊盘（101）的引线框架，将焊盘连接到器件封装的侧边缘的多个带（102），引线（103）和 附着在引线框上的塑料复合物的封装（150） 所述带的至少一个表面（102a）覆盖有与所述聚合物非粘合剂和疏水性的化合物的层（120）; 选自含氟化硫醇化合物，氟化胺化合物，氟化胺硅烷，有机硅烷及其衍生物的化合物（220） 或选自包括开孔微孔金属泡沫和聚合物泡沫的组的化合物（330）。 此外，包装可以包括从包装表面延伸到带表面的穿过塑料化合物的孔阵列。

公开(公告)号：US20150069600A1

公开(公告)日：2015-03-12

申请号：US14024840

申请日：2013-09-12

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang

IPC: H01L23/48 ,  H01L21/78

CPC classification number: H01L23/48 ,  H01L23/4924 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0332 ,  H01L2224/03831 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00014

Abstract: A method and apparatus for enhancing the electrical and thermal performance of semiconductor packages effectively, especially for laminated packages, where sinterable materials cannot be used. The concept of this invention is to embed silver or silver-coated nanomaterials, which can be nanoparticles, nanoflakes, nanowires etc., into die backside to improve the interface between die and die attach materials, thus enhancing electrical and thermal performance through sintering and enhancing reliability by improving adhesion.

Abstract translation: 一种用于有效地提高半导体封装的电和热性能的方法和装置，特别是对于不能使用可烧结材料的层压封装。 本发明的概念是将银或银涂覆的纳米材料（其可以是纳米片，纳米线，纳米线等）嵌入模具背面，以改善管芯和管芯附着材料之间的界面，从而通过烧结和增强提高电和热性能 通过改善附着力的可靠性。

公开(公告)号：US20150037938A1

公开(公告)日：2015-02-05

申请号：US14520406

申请日：2014-10-22

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 将芯片连接到基板上，从芯片到基板的导线被装载在模具的加热空腔中。 线表面涂覆有杂环化合物分子的吸附层。 模具的压力室装有包括可聚合树脂的包装材料的固体颗粒。 腔室连接到腔体。 在加热固体颗粒以使其呈半液体并在填充模腔之前通过流道对其进行加压所需的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，其中树脂分子 通过吸附的杂环化合物分子到达空腔中的电绝缘的至少一层聚合物结构在电线表面上。

公开(公告)号：US20130277825A1

公开(公告)日：2013-10-24

申请号：US13751663

申请日：2013-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L21/56 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: The packaging of an electric contact including a semiconductor chip (102) having terminals (101) of a first metal and connecting wires (111, 112) of a second metal, the wires forming at the terminals regions (113) of intermetallic compounds of the first and second metals; a solution of an aromatic azole compound dissolved in ethanol is dispensed onto the surfaces of the wire spans and the intermetallic regions, thereby forming on the surfaces layers (301) of adsorbed molecules of the aromatic azole compound; chip and wire bonds are encapsulated in a polymerizable resin (401), thereby exploiting the adsorbed aromatic azole molecules as catalysts to cross-link resin molecules into polymerized structures (402) having a mesh density capable of inhibiting the diffusion of impurity ions (410) and thus protecting the surface of the intermetallic regions.

Abstract translation: 包括具有第一金属的端子（101）和第二金属的连接线（111,112）的半导体芯片（102）的电接触的包装，在第二金属的金属间化合物的端子区域（113）处形成的电线 第一和第二金属; 将溶解在乙醇中的芳族唑化合物的溶液分配到线跨和金属间区域的表面上，从而在芳族唑化合物的吸附分子的表面（301）上形成; 芯片和引线键被封装在可聚合树脂（401）中，从而利用吸附的芳族唑分子作为催化剂将树脂分子交联成具有能够抑制杂质离子（410）扩散的网孔的聚合结构（402） 从而保护金属间区域的表面。