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    Digital-to-analog conversion circuitry incorporating a simplified testing circuit
    31.
    发明授权
    Digital-to-analog conversion circuitry incorporating a simplified testing circuit 失效
    包含简化测试电路的数模转换电路

    公开(公告)号：US06693570B2

    公开(公告)日：2004-02-17

    申请号：US10283097

    申请日：2002-10-30

    申请人： Shinsuke Ohnishi ,  Daisuke Takagi

    发明人： Shinsuke Ohnishi ,  Daisuke Takagi

    IPC分类号： H03M110

    CPC分类号： H03M1/109 ,  H03M1/66

    摘要： Digital-to-analog (DA) conversion circuitry with a simplified testing circuit includes a DA converter to which test data, initially “0”, may be applied. The DA converter feeds an analog voltage corresponding to the test data to a voltage holding circuit. Subsequently the test data is incremented to “1” and then converted to a corresponding analog voltage by the DA converter. A comparator compares the analog voltage corresponding to the test data “1” with the previous analog voltage held in the voltage holding circuit and corresponding to the test data “0”. When the test data is sequentially incremented by 1 (one) at intervals, the voltage output from the DA converter is higher than the voltage held in the voltage holding circuit while the DA converter operates normally. The function of the DA converter can be easily, rapidly tested by monitoring the output of the comparator.

    摘要翻译： 具有简化测试电路的数模（DA）转换电路包括DA转换器，可以应用测试数据，最初为“0”。 DA转换器将对应于测试数据的模拟电压馈送到电压保持电路。 随后，测试数据增加到“1”，然后由DA转换器转换成相应的模拟电压。 比较器将对应于测试数据“1”的模拟电压与保持在电压保持电路中的先前的模拟电压进行比较，并对应于测试数据“0”。 当测试数据间隔地顺序增加1（1）时，DA转换器输出的电压高于保持在电压保持电路中的电压，而DA转换器正常工作。 DA转换器的功能可以通过监视比较器的输出来轻松快速地测试。

    Pick-up style utility vehicle with expandable cargo bed
    36.
    发明授权
    Pick-up style utility vehicle with expandable cargo bed 有权
    带可扩张式货物的起重式多功能车

    公开(公告)号：US08235443B2

    公开(公告)日：2012-08-07

    申请号：US12649839

    申请日：2009-12-30

    申请人： Manabu Kokawa ,  Satoshi Morotomi ,  Daisuke Takagi ,  Naohisa Masuda ,  Shigeru Yamashita ,  Masahiro Kawahara ,  Hirokazu Morita ,  Masashi Sakata ,  Hideyuki Kato

    发明人： Manabu Kokawa ,  Satoshi Morotomi ,  Daisuke Takagi ,  Naohisa Masuda ,  Shigeru Yamashita ,  Masahiro Kawahara ,  Hirokazu Morita ,  Masashi Sakata ,  Hideyuki Kato

    IPC分类号： B62D33/08

    CPC分类号： B62D33/08 ,  B60N2/24 ,  B60N2/36 ,  B60P3/423 ,  B62D33/0273 ,  B62D47/003

    摘要： A pick-up style utility vehicle has a front seat and a rear seat surrounded by a cabin frame, and a cargo bed in this order from the vehicle front, a screen shield partitioning the cargo bed and a riding space in front of the cargo bed. The cargo bed is changeable between an expanded state in which the cargo bed is expanded into the riding space of the rear seat and a non-expanded state not occupying the riding space of the rear seat. The screen shield is supported by the upper portion of the cabin frame and is changeable between an expanded position in which the cargo bed and the riding space in front of the cargo bed are partitioned and a non-expanded position in which the cargo bed and the riding space in front of the cargo bed are partitioned without the necessity of detaching the screen shield from the cabin frame.

    摘要翻译： 拾起式多功能车具有前座椅和后座，由车厢框架包围，并且从车辆前面依次包括货物床，分隔货物床的屏蔽屏蔽和货物床前面的骑乘空间 。 货物床可以在货舱扩展到后排座椅的乘坐空间的扩张状态与不占据后排座椅的乘坐空间的非扩张状态之间变化。 屏蔽罩由机舱框架的上部支撑，并且在货舱和货舱前面的乘坐空间被分隔的扩展位置和不扩展位置之间是变化的，在该位置中货舱和 在货物舱前面的乘坐空间被分隔，而不需要将屏蔽罩从舱架上拆下。

    LIQUID EJECTION HEAD AND IMAGE FORMING APPARATUS INCLUDING THE LIQUID EJECTION HEAD
    37.
    发明申请
    LIQUID EJECTION HEAD AND IMAGE FORMING APPARATUS INCLUDING THE LIQUID EJECTION HEAD 有权
    液体喷射头和图像形成装置，包括液体喷射头

    公开(公告)号：US20120069093A1

    公开(公告)日：2012-03-22

    申请号：US13231464

    申请日：2011-09-13

    申请人： Masahiro KUWATA ,  Daisuke Takagi ,  Kazuo Haida

    发明人： Masahiro KUWATA ,  Daisuke Takagi ,  Kazuo Haida

    IPC分类号： B41J2/14 ,  B67D7/06 ,  B32B37/14 ,  B32B38/10 ,  B32B37/02 ,  B32B37/12

    CPC分类号： B41J2/14274 ,  B41J2/055 ,  B41J2002/14419

    摘要： A liquid ejection head includes a common-chamber formation member including a common chamber to supply liquid to pressure chambers communicating nozzles for ejecting liquid droplets, a flexible thin-film member to form part of a wall face of the common chamber, and a thin-film support member bonded to the thin-film member with glue. The support member has an opening or a recessed portion at least partially having a shape that is broad in an area proximal to a first surface of the support member bonded to the thin-film member and becomes narrower as an area of the opening or the recessed portion is more distant from the first surface. The opening or the recessed portion is sealed with the thin-film member. A portion of the thin-film member corresponding to the opening or the recessed portion has the glue on only a periphery area of the portion that contacts the support member.

    摘要翻译： 液体喷射头包括共用室形成构件，其包括公共室以将液体供应到用于喷射液滴的连通喷嘴的压力室，形成公共室的壁面的一部分的柔性薄膜构件， 薄膜支撑构件用胶粘在薄膜构件上。 支撑构件具有开口或凹部，该开口或凹部至少部分地具有在接近薄膜构件的支撑构件的第一表面附近的区域中宽的形状，并且作为开口的面积变窄或凹入 部分距离第一表面更远。 开口部或凹部用薄膜部件密封。 对应于开口或凹部的薄膜构件的一部分仅在与支撑构件接触的部分的周边区域上具有胶水。

    Optical semiconductor module and method of producing the same
    39.
    发明授权
    Optical semiconductor module and method of producing the same 失效
    光半导体模块及其制造方法

    公开(公告)号：US06855566B2

    公开(公告)日：2005-02-15

    申请号：US10381460

    申请日：2002-04-06

    申请人： Nobuyoshi Tatoh ,  Daisuke Takagi ,  Shinya Nishina

    发明人： Nobuyoshi Tatoh ,  Daisuke Takagi ,  Shinya Nishina

    IPC分类号： H01L23/38 ,  H01L35/32 ,  H01S5/022 ,  H01S5/024 ,  H01L21/00

    CPC分类号： H01S5/02415 ,  H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H01S5/02208 ,  H01L2924/00

    摘要： An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

    摘要翻译： 即使封装的底板的面积相同，也可以设置具有大的吸热量的电子冷却元件的光学半导体模块。 包装11包括安装在其中的两个或更多个电子冷却元件16。 电子冷却元件的每个单元通过包装11的陶瓷馈通件的内凸起14a和底板13之间的空间插入并固定到底板。 多个单元的电子冷却元件通过一个或多个铜片串联连接。 电子冷却元件的两个或多个单元与封装11的底板区域之间的接合面积占底板面积的75％以上。 因此，可以增加底板和电子冷却元件之间的整体面积与封装底板的面积的比率。