公开(公告)号：US11691173B2

公开(公告)日：2023-07-04

申请号：US17276996

申请日：2019-09-30

Applicant: LG Chem, Ltd.

Inventor： Do-Hyun Lee ,  Cheol-Woo Kim ,  Sang-Hoon Choy

IPC: B05C5/02 ,  B05C9/06 ,  B05C11/02 ,  B05C11/10 ,  H01M4/04

CPC classification number: B05C5/0262 ,  B05C9/06 ,  B05C11/02 ,  B05C11/1002 ,  H01M4/0404

Abstract: Disclosed is a slot die coater adjusting device, which adjusts a slot die coater including a lower die having a lower discharge hole for discharging a first active material slurry and an upper die having an upper discharge hole for discharging a second active material slurry, to adjust a distance between the lower discharge hole and the upper discharge hole by allowing the upper die to move. The slot die coater adjusting device includes pressing block assemblies respectively provided to both longitudinal sides of the slot die coater and fixed to the upper die; a linear motion (LM) guide disposed at a lower portion of the pressing block assembly and connected to the pressing block assembly to guide a movement of the pressing block assembly; a servo motor configured to give a power for moving the LM guide; and a reducer connected between the servo motor and the LM guide.

公开(公告)号：US11686740B2

公开(公告)日：2023-06-27

申请号：US16020962

申请日：2018-06-27

Applicant: Ventana Medical Systems, Inc.

Inventor： Christopher Lawrence Donat ,  Timothy James Keller

IPC: G01N1/00 ,  G01N35/10 ,  G01N1/31 ,  G02B21/34 ,  B01L7/00 ,  B05C11/02 ,  G01N35/00 ,  B01F33/30 ,  B01L3/02 ,  B01L3/00

CPC classification number: G01N35/1002 ,  B01L7/52 ,  B05C11/02 ,  G01N1/312 ,  G01N35/00029 ,  G02B21/34 ,  B01F33/3035 ,  B01L3/0293 ,  B01L3/502 ,  B01L2300/0822 ,  B01L2300/0861 ,  B01L2300/1827 ,  B01L2300/1894 ,  B01L2400/0406 ,  G01N2035/00138 ,  G01N2035/1034

Abstract: The present disclosure is directed to opposables including a body having a plurality of cavities disposed therein. Each cavity can be designed to contain one or more reagents, liquids, or fluids which may be applied to a specimen-bearing surface. In some embodiments, the cavities include one or more reagent chambers, the reagent chambers can have one or more seals such that the reagents, liquids, or fluids contained therein may be stored and released to the specimen-bearing surface.

公开(公告)号：US20180207673A1

公开(公告)日：2018-07-26

申请号：US15869645

申请日：2018-01-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Younggil CHOI ,  Boseok SEOK

IPC: B05C11/02 ,  B05C5/02 ,  H05K3/00

CPC classification number: B05C11/02 ,  B05C5/0212 ,  H05K3/0091 ,  H05K3/284 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2203/0759

Abstract: Disclosed herein is a printed circuit board having a structure for preventing coating liquid overflow. In the printed circuit board on which an electronic component is mounted and in which a connection hole for joining the electronic component and another component to each other is formed, a land region to which lead may be applied is formed adjacent to the connection hole.

公开(公告)号：US20170113242A1

公开(公告)日：2017-04-27

申请号：US14924125

申请日：2015-10-27

Applicant: Hamilton Sundstrand Corporation

Inventor： Diana Giulietti ,  Kiley J. Verslys

IPC: B05C11/02

CPC classification number: B05C11/02 ,  B05C11/023 ,  B22F2003/1056 ,  B29C41/12 ,  B29C64/153 ,  B29C64/165 ,  B29C64/20 ,  B33Y30/00 ,  B33Y40/00

Abstract: A cap for an additive manufacturing recoater rake includes a clip portion defining a slot configured to receive a side edge portion of a recoater rake, and an angled surface extending from the clip portion. The angled surface is configured to contain powder pushed by the recoater rake on the powder bed.

公开(公告)号：US09278372B2

公开(公告)日：2016-03-08

申请号：US13435093

申请日：2012-03-30

Applicant: Michael Whitener

Inventor： Michael Whitener

IPC: B05C11/02 ,  B05D3/12 ,  B32B33/00 ,  C23C14/54 ,  C23C16/52 ,  B65D90/24

CPC classification number: B05C11/02 ,  B05D3/12 ,  B32B33/00 ,  B65D90/24 ,  C23C14/54 ,  C23C16/52 ,  D06N3/009 ,  D06N3/14 ,  D06N2209/108 ,  D06N2211/06 ,  D06N2211/066 ,  D06N2211/16 ,  Y10T428/24355

Abstract: A method of manufacturing a plurality of secondary containment panels and assembling and installing the panels in a secondary containment system of an above-ground liquid storage tank or other retention facility includes forming a plurality of flexible substrate pieces. A liquid impermeable coating is applied to the upper surface of each piece such that an edge segment of the piece remains uncoated. The coating is applied to the substrate piece in an indoor enclosure using a computer controlled robotic sprayer that applies a uniform coating. Metal plates are embedded in the floor used for quality control testing of the coating thickness using magnetic gauges. At least a pair of the pieces are juxtaposed relative to one another such that a first one of the pieces overlaps the uncoated segment of the second piece to form a seam.

Abstract translation: 一种制造多个次级容纳面板的方法，并且将面板组装和安装在地上液体储存罐或其它保持设备的二次容纳系统中的方法包括形成多个柔性衬底片。 将液体不可渗透的涂层施加到每个部件的上表面，使得该部件的边缘部分保持未涂覆。 使用应用均匀涂层的计算机控制的机器人喷雾器将涂层施加到室内机壳中的基片上。 金属板嵌入地板，用于使用磁性计量器进行涂层厚度的质量控制测试。 至少一对片相对于彼此并置，使得第一片与第二片的未涂层片重叠以形成接缝。

公开(公告)号：US09248466B2

公开(公告)日：2016-02-02

申请号：US13891644

申请日：2013-05-10

Applicant: Infineon Technologies AG

Inventor： Karl Pilch ,  Hans Leitner ,  Michael Kalin

IPC: H01L21/00 ,  B05C11/02 ,  B05D1/00 ,  B05D3/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: B05B12/02 ,  B05B13/02 ,  B05C11/02 ,  B05D1/002 ,  B05D3/007 ,  H01L21/02282 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/6835 ,  H01L2221/68327 ,  Y10T156/10

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract translation: 各种实施例涉及将流体施加到基底。 例如，将流体局部加热以获得所需的厚度分布。

公开(公告)号：US09176387B2

公开(公告)日：2015-11-03

申请号：US14159647

申请日：2014-01-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Wei-Chieh Huang ,  Hung Chang Hsieh

IPC: G03F7/30 ,  H01L21/67 ,  B05C11/08 ,  B05C13/00 ,  B05C9/12 ,  B05C11/02

CPC classification number: G03F7/3021 ,  B05C9/12 ,  B05C11/02 ,  B05C11/023 ,  B05C11/08 ,  B05C13/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.

Abstract translation: 本公开提供了制造半导体器件的方法。 该方法包括将液体分配在晶片上。 该方法包括升高晶片。 该方法包括在升高之后降低晶片。 晶片在降低时旋转，从而从晶片去除至少一部分液体。 本公开还提供了一种用于制造半导体器件的装置。 该装置包括可操作以保持半导体晶片并将晶片固定到其上的晶片卡盘。 晶片具有前表面和后表面。 该装置包括可操作以将液体分配到晶片的前表面的分配器。 该装置包括机械结构，其可操作以：在水平方向上旋转晶片卡盘; 并且在晶片卡盘旋转的同时沿着垂直方向向下移动晶片卡盘。

公开(公告)号：US20140356530A1

公开(公告)日：2014-12-04

申请号：US14294190

申请日：2014-06-03

Applicant: Johnson Matthey Public Limited Company

Inventor： Dale Albert ROBERTS ,  Andrew Michael BORTZ ,  Daniel L. TROLAND ,  Richard Peter ROSE ,  R. Bradford FORTNER

IPC: B01J37/02 ,  B05D3/02 ,  B05C11/02 ,  B05C7/04 ,  B05C7/02 ,  B05D3/04 ,  B05D7/22

CPC classification number: B05C7/04 ,  B01J35/04 ,  B01J37/0215 ,  B01J37/0234 ,  B05C7/02 ,  B05C11/02 ,  B05C11/023 ,  B05C13/00 ,  B05D3/0245 ,  B05D3/0493 ,  B05D7/22 ,  B05D2254/04 ,  B65D7/22

Abstract: A method of coating a substrate with a liquid comprising a catalyst component, which substrate comprises a plurality of channels, wherein the method comprises: (a) holding the substrate vertically; (b) introducing the liquid into the substrate through the open ends of the channels at a lower end of the substrate; and (c) after the lower end of the substrate has been part-filled with the liquid, applying a vacuum to the open ends of the channels at the upper end of the substrate while introducing the liquid into the substrate.

Abstract translation: 一种用包含催化剂组分的液体涂覆基材的方法，该基材包括多个通道，其中所述方法包括：（a）垂直地保持所述基材; （b）通过基底的下端处的通道的开口端将液体引入基底; 和（c）在衬底的下端部分地填充有液体之后，在将衬底导入液体的同时在衬底的上端向通道的开口端施加真空。

公开(公告)号：US08852369B2

公开(公告)日：2014-10-07

申请号：US13285228

申请日：2011-10-31

Applicant: Alberto Piva

Inventor： Alberto Piva

IPC: B29C65/00 ,  B31B1/60 ,  B32B37/00 ,  B27G11/02 ,  B29C65/02 ,  B31F5/04 ,  G05G15/00 ,  B32B38/04 ,  B05C11/02 ,  B32B37/02 ,  B05C13/00 ,  B05D5/10 ,  B32B38/00 ,  B32B37/24

CPC classification number: B05C11/02 ,  B05C13/00 ,  B05D5/10 ,  B32B37/02 ,  B32B38/164 ,  B32B2037/243 ,  B32B2038/0076 ,  B32B2451/00 ,  Y10T156/10

Abstract: A method of manufacturing a multilayer coating for decoration of surfaces includes the successive steps of providing a supporting substrate, applying a protective layer on that substrate, applying at least one first decorative layer on the protective layer to transfer a first ornamental patter thereto, depositing at least one adhesive layer on the first decorative layer to form a multilayer coating configured to be applied on a surface to be decorated. The substrate is a film of a polymeric material configured to be removed from the protective layer after application of the multilayer coating on the surface to be decorated. A system of manufacturing a multilayer coating for the decoration of surfaces.

Abstract translation: 制造用于装饰表面的多层涂层的方法包括提供支撑基底，在该基底上施加保护层的连续步骤，在保护层上施加至少一个第一装饰层以将第一装饰图案转移到其上， 在第一装饰层上的至少一个粘合剂层，以形成被涂覆在待装饰的表面上的多层涂层。 基底是聚合物材料的膜，其被配置为在将待装饰的表面上施加多层涂层之后从保护层移除。 制造用于表面装饰的多层涂层的系统。

公开(公告)号：US08597735B2

公开(公告)日：2013-12-03

申请号：US13032006

申请日：2011-02-22

Applicant: Keiji Inoue ,  Makoto Oishi ,  Yuya Furukawa ,  Yoshihiro Ikebe

Inventor： Keiji Inoue ,  Makoto Oishi ,  Yuya Furukawa ,  Yoshihiro Ikebe

IPC: B05D1/06 ,  B05D3/02

CPC classification number: H02K15/12 ,  B05B5/081 ,  B05B5/084 ,  B05B12/16 ,  B05B14/45 ,  B05B14/48 ,  B05C11/02 ,  B05D1/06 ,  B05D3/0281 ,  B05D2202/00 ,  B05D2504/00 ,  B65G33/06 ,  Y02P70/36

Abstract: Workpieces, which are conveyed by a conveying device along a conveying path, are heated by a heating and degreasing coil. Then, resin powder is downwardly sprayed from a nozzle of a coating device to each corresponding one of the workpieces, which are conveyed by the conveying device. The workpieces are thereafter heated by a heating and curing coil. At each of the heating coils, a dummy member, which is made of an electrically conductive material, is displaced from a retracted position to a forward position, which is located between the corresponding heating coil and a corresponding adjacent part of the conveying path of the conveying device, when an empty one of mount locations of the conveying device reaches the forward position of the dummy member.

Abstract translation: 由输送装置沿输送路径输送的工件由加热脱脂线圈加热。 然后，将树脂粉末从涂覆装置的喷嘴向下喷射到由输送装置输送的每个对应的一个工件上。 然后通过加热和固化线圈加热工件。 在每个加热线圈中，由导电材料制成的虚拟构件从缩回位置移动到前进位置，该位置位于相应的加热线圈和相应的加热线圈的相应的相邻部分之间 当输送装置的空的一个安装位置到达虚拟构件的向前位置时，输送装置。