Abstract:
In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.
Abstract:
The method and apparatus utilize a laser to heat bond pads. While the bond pads are hot, a wire is bonded to the bond pad. The method and apparatus of the present invention may also be used to heat a lead finger of an integrated circuit lead frame using a laser and to bond a wire to the lead finger while the lead finger is hot.
Abstract:
A device 10 usable in conjunction with a source of constant amplitude high frequency alternating current of known frequency for providing sufficient thermal energy to melt a fusible electrically conductive material 32 includes an integral member formed from strip 12 of a first metal having a carrier strip section 14 and a plurality of fingers 20 initially integrally coextending therefrom. The carrier strip section 14 further has a thin magnetic layer 18 thereon, transforming the carrier strip into a Curie point heater. The fingers 20 including end portions 22 having layers of solder affixed to opposite sides thereof are adapted to receive bare end portions of conductors 36 inserted into slots 28 thereof. The device 10 and the conductors 36 disposed therein are placed on the board 50 with the respective conductors 36 opposed from respective contact pads 52 and separated by the finger end portions 22. Upon subjecting the heater body 14 to the constant current of known frequency, the heater body 14 generates and transfers sufficient thermal energy to the finger end portions 22 to melt the fusible material 32 disposed therealong thereby electrically and mechanically interconnecting the array of conductors to the contact pads 52. The heater body 14 is then detached from the fingers 20 thereby electrically isolating the interconnections.
Abstract:
Apparatus for ultrasonic welding of wires including a hand-held housing with an ultrasonic wave generator, a welding tip connected to said generator, an anvil for clamping the wires to be welded to said welding tip, and a tool for gathering wires disposed between said anvil and welding tips to prevent the wires from splaying during weldment.
Abstract:
An ultrasonic welding apparatus for electrical conductors comprising strands of wire comprising a sonotrode for generating ultrasonic vibrations and a cooperating anvil having movable side walls to compress the wire strands against the head of the sonotrode. The anvil has two moving parts, one moving back and forth parallel to the fixed sonotrode face, and the other moving up and down normal to the fixed face. The moving parts carry the side walls of the anvil and with the fixed face provide an adjustable space for wires of various sizes, the space having a rectangular cross section. The gap between the moving anvil parts and the adjacent fixed face of the sonotrode are accurately controlled.
Abstract:
A fine wire welding machine for cold butt welding small diameter wires through a multiple upset technique. The machine includes a loading mechanism for accurately positioning the fine wire strands for subsequent engagement with the welding dies and the welding dies are movable in a plane parallel to their abutting faces for shearing the wires and aligning the end of the wire from one spool with the end of the wire from another spool for the subsequent welding technique. An improved operating mechanism is incorporated for operating the dies for movement in a predetermined sequence whereby the dies first move into gripping relation with the respective wire ends, the dies then move together to upset the wire ends, next the dies release the wire ends while still held in the upset position and finally the dies retract from their upset position for a repeat of the cycle.
Abstract:
Apparatus for soldering electrical leads to terminals of a magnetic core and coil assembly by providing means for moving the core and coil assembly past a flow of solder to solder the leads and terminals. Predetermined lengths of leads are held in place adjacent to terminal pads on the assembly as the terminals and leads are wetted by providing means for causing at least the ends of the leads to traverse the crest of a cascade of solder. The point of intersection of a lead, a terminal, and a cascade of solder is called a soldering site. The direction of the solder flow is controlled so that solder will not contact the core and coil. A rail of a conveyer both supports the terminal pads and gauges the length of lead inserted in the terminals. The conveyor includes a trough along which the free ends of the leads may slide. The conveyor moves the assembly along a solder emitting orifice. As the terminals traverse the orifice at least the ends of the leads contact the flow of solder to wet the ends of the leads and adjacent portions of the terminals with molten solder.
Abstract:
There is disclosed a method for forming tips on normally sintered material electron-emitting cathodes. The method comprises melting the electron-emitting end of the cathode with an electron beam or other suitable narrow beam heating means, such as a laser, for example. This melting produces a dense fused mass at the end of the cathode. This fused mass can then be polished to a tip having a very small diameter such as substantially less than 5 microns.
Abstract:
A fine wire welding machine for cold butt welding small diameter wires through a multiple upset technique. The machine includes a loading mechanism for accurately positioning the fine wire strands for subsequent engagement with the welding dies and the welding dies are movable in a plane parallel to their abutting faces for shearing the wires and aligning the end of the wire from one spool with the end of the wire from another spool for the subsequent welding technique. An improved operating mechanism is incorporated for operating the dies for movement in a predetermined sequence whereby the dies first move into gripping relation with the respective wire ends, the dies then move together to upset the wire ends, next the dies release the wire ends while still held in the upset position and finally the dies retract from their upset position for a repeat of the cycle.