公开(公告)号：US09825194B2

公开(公告)日：2017-11-21

申请号：US13904221

申请日：2013-05-29

Applicant: Essence Solar Solutions Ltd.

Inventor： Slava Hasin ,  Ron Helfan

IPC: B21D28/00 ,  H01L31/052 ,  H01L31/18 ,  H01L21/683 ,  H01L31/0232 ,  H01L33/58 ,  B32B3/06 ,  B32B7/12 ,  H05K13/04 ,  H01L31/02 ,  H01L31/054 ,  H05K1/02 ,  H05K1/05

CPC classification number: H01L31/052 ,  B32B3/06 ,  B32B7/12 ,  H01L21/683 ,  H01L31/02008 ,  H01L31/0232 ,  H01L31/0543 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/05 ,  H05K13/0465 ,  H05K2201/10143 ,  Y02E10/52 ,  Y10T29/5313 ,  Y10T428/12382 ,  H01L2924/00014

Abstract: A substrate pad for soldering at least one self-aligning component thereon, wherein at least one edge of a body of the substrate pad is shaped to conform to a corresponding edge of a component pad, and the at least one edge of the body of the substrate pad further include a plurality of pad fingers leading away from the substrate pad. Related apparatus and methods are also described.

公开(公告)号：US20170135215A1

公开(公告)日：2017-05-11

申请号：US15346847

申请日：2016-11-09

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/113 ,  H05K1/118 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/125 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0759 ,  H05K2203/1131

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

公开(公告)号：US09478674B2

公开(公告)日：2016-10-25

申请号：US13896853

申请日：2013-05-17

Applicant: DSM IP ASSETS B.V.

Inventor： Koichi Kumai ,  Ryuji Ueda ,  Kentaro Kubota ,  Shigeki Kudo ,  Minoru Kawasaki

IPC: H05K3/02 ,  H01L31/02 ,  H05K3/20 ,  H05K1/02 ,  H01L31/05

CPC classification number: H01L31/02008 ,  H01L31/02021 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract translation: 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。

公开(公告)号：US20160013337A1

公开(公告)日：2016-01-14

申请号：US14795653

申请日：2015-07-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami

IPC: H01L31/0392 ,  H05K3/30 ,  H02S40/34

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/34 ,  H02S40/42 ,  H05K1/0204 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/142 ,  H05K1/144 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/046 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/10121 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

Abstract translation: 光伏模块包括：柔性印刷电路; 以及安装在柔性印刷电路上的多个发电元件，其中柔性印刷电路包括转动部分，并且位于转动部分的相对侧上的柔性印刷电路的条形部分被对准以便对准 彼此。

公开(公告)号：US20160005904A1

公开(公告)日：2016-01-07

申请号：US14857581

申请日：2015-09-17

Applicant: LG ELECTRONICS INC.

Inventor： Jongkyoung HONG ,  Jongdae KIM

IPC: H01L31/05 ,  H01L31/054 ,  H01L31/0216 ,  H01L31/0224

CPC classification number: H01L31/0508 ,  H01L31/02168 ,  H01L31/022433 ,  H01L31/048 ,  H01L31/0512 ,  H01L31/0547 ,  H05K3/323 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A solar cell panel is discussed. The solar cell panel includes a plurality of solar cells each including a substrate and an electrode part positioned on a surface of the substrate, an interconnector for electrically connecting at least one of the plurality of solar cells to another of the plurality of solar cells, and a conductive adhesive film including a resin and a plurality of conductive particles dispersed in the resin. The conductive adhesive film is positioned between the electrode part of the at least one of the plurality of solar cells and the interconnector to electrically connect the electrode part of the at least one of the plurality of solar cells to the interconnector. A width of the interconnector is equal to or greater than a width of the conductive adhesive film.

Abstract translation: 讨论了太阳能电池板。 太阳能电池面板包括多个太阳能电池，每个太阳能电池包括基板和位于基板的表面上的电极部分，用于将多个太阳能电池中的至少一个太阳能电池电连接到多个太阳能电池中的另一个的互连器，以及 包含分散在树脂中的树脂和多个导电颗粒的导电粘合膜。 导电粘合剂膜位于多个太阳能电池中的至少一个太阳能电池的电极部分和互连器之间，以将多个太阳能电池中的至少一个的电极部分电连接到互连器。 互连器的宽度等于或大于导电粘合膜的宽度。

公开(公告)号：US20150228832A1

公开(公告)日：2015-08-13

申请号：US14625033

申请日：2015-02-18

Applicant: Sharp Kabushiki Kaisha

Inventor： Yasushi FUNAKOSHI

IPC: H01L31/05

CPC classification number: H01L31/0516 ,  B32B17/10018 ,  B32B17/10788 ,  B32B17/10871 ,  H01L31/02013 ,  H01L31/022441 ,  H02S40/34 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/10143 ,  Y02E10/50

Abstract: Provided is a solar battery module wherein solar battery cells are electrically connected to each other by using a wiring board having a predetermined wiring pattern formed on a resin base material. A method for manufacturing such solar battery module is also provided. In the wiring board of the solar battery module, a direction wherein a design margin is small is permitted to be a direction wherein the thermal contraction ratio of the resin base material is small, by the shape of an electrode pattern on the solar battery cell and that of the wiring pattern on the wiring board. At the time of manufacturing such solar battery module, temperature in a heat treatment step is set at 100° C. or higher but not higher than 180° C. Electrode designing at a fine pitch is made possible and the solar battery module exhibits high solar battery characteristics, even when the solar battery cells are connected by using wiring boards composed of various types of resin materials having thermal compression ratio not sufficiently low.

Abstract translation: 提供一种太阳能电池模块，其中通过使用具有形成在树脂基材上的预定布线图案的布线板将太阳能电池单元彼此电连接。 还提供了一种制造这种太阳能电池模块的方法。 在太阳能电池模块的配线基板中，通过太阳能电池单元上的电极图案的形状，允许树脂基材的热收缩率小的方向，设计边缘小的方向为 布线板上的布线图案。 在制造这种太阳能电池模块时，热处理步骤中的温度设定在100℃以上但不高于180℃。可以以细间距设计电极，并且太阳能电池模块展现出高太阳能 电池特性，即使通过使用由热压缩比不足够低的各种树脂材料构成的布线板来连接太阳能电池单元。

公开(公告)号：US08900911B2

公开(公告)日：2014-12-02

申请号：US13904205

申请日：2013-05-29

Applicant: Essence Solar Solutions Ltd.

Inventor： Slava Hasin ,  Ron Helfan

IPC: H01L21/00 ,  B32B7/12 ,  H01L31/18 ,  H05K13/04 ,  H01L31/0232 ,  H01L21/683 ,  H01L33/58 ,  H01L31/052 ,  B32B3/06

CPC classification number: H01L31/052 ,  B32B3/06 ,  B32B7/12 ,  H01L21/683 ,  H01L31/02008 ,  H01L31/0232 ,  H01L31/0543 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/05 ,  H05K13/0465 ,  H05K2201/10143 ,  Y02E10/52 ,  Y10T29/5313 ,  Y10T428/12382 ,  H01L2924/00014

Abstract: A method of assembling an optical element on top of an active component in a substrate, by providing a substrate with active component and an optical element with a base and lateral base walls, fixating a bottom surface of a frame holder with opening and lateral frame walls arranged in a polygonal structure to the substrate so that the opening is positioned over the active component, and mounting the optical element in the opening so the lateral frame walls apply lateral confining mechanical force on the lateral base walls.

Abstract translation: 通过提供具有有源部件的基板和具有基部和侧部底壁的光学元件来将光学元件组装在基板上的有源部件的顶部上的方法，将框架保持器的底表面固定在开口和侧框架壁 以多边形结构布置到基板上，使得开口定位在有源部件上方，并将光学元件安装在开口中，使得侧框架壁在侧壁上施加横向限制机械力。

公开(公告)号：US20140272198A1

公开(公告)日：2014-09-18

申请号：US14216211

申请日：2014-03-17

Applicant: Stuart Bowden ,  Mikhael Reginevich ,  Stanislau Herasimenka

Inventor： Stuart Bowden ,  Mikhael Reginevich ,  Stanislau Herasimenka

IPC: H01L31/18 ,  C23C14/14 ,  C23C14/54

CPC classification number: H01L31/18 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/0676 ,  B23K26/0736 ,  B23K26/0846 ,  B23K26/0869 ,  B23K26/32 ,  B23K26/342 ,  B23K2101/40 ,  B23K2103/50 ,  C23C14/048 ,  C23C14/14 ,  C23C14/28 ,  C23C14/54 ,  H01L31/022425 ,  H05K3/14 ,  H05K2201/10143 ,  H05K2203/107 ,  Y02E10/50

Abstract: Systems, methods, and media for forming metallization for solar cells are provided. In some embodiments, a system for forming metallization on a substrate is provided, the system comprising: a first laser; a second laser; and a hardware processor programmed to: rotate a target at a predetermined speed; cause the first laser to emit a laser pulse that causes a material to be ablated from the rotating target toward a surface of a substrate; causing a continuous laser beam emitted by the second laser to pass through the ablated material and heat clusters in ablated material prior to the clusters landing on the surface of the substrate; and causing the continuous laser beam to heat deposited clusters from the plume of ablated material that have landed on the surface of the substrate to form a metallization line.

Abstract translation: 提供了用于形成用于太阳能电池的金属化的系统，方法和介质。 在一些实施例中，提供了一种用于在衬底上形成金属化的系统，所述系统包括：第一激光器; 第二激光器 以及硬件处理器，其被编程为：以预定速度旋转目标; 使得第一激光器发射激光脉冲，其使材料从旋转靶朝向衬底的表面被烧蚀; 使得由第二激光器发出的连续的激光束穿过烧蚀的材料，并且在簇落在衬底的表面之前在烧蚀的材料中加热簇; 并且使连续的激光束从已经降落在衬底的表面上的消融材料的羽流中加热沉积的簇以形成金属化线。

公开(公告)号：US20130320376A1

公开(公告)日：2013-12-05

申请号：US13904205

申请日：2013-05-29

Applicant: Essence Solar Solutions Ltd.

Inventor： Slava HASIN ,  Ron Helfan

IPC: H01L21/683 ,  H01L31/18 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L31/052 ,  B32B3/06 ,  B32B7/12 ,  H01L21/683 ,  H01L31/02008 ,  H01L31/0232 ,  H01L31/0543 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/05 ,  H05K13/0465 ,  H05K2201/10143 ,  Y02E10/52 ,  Y10T29/5313 ,  Y10T428/12382 ,  H01L2924/00014

Abstract: A method of assembling an optical element on top of an active component in a substrate, by providing a substrate with active component and an optical element with a base and lateral base walls, fixating a bottom surface of a frame holder with opening and lateral frame walls arranged in a polygonal structure to the substrate so that the opening is positioned over the active component, and mounting the optical element in the opening so the lateral frame walls apply lateral confining mechanical force on the lateral base walls.

Abstract translation: 通过提供具有有源部件的基板和具有基部和侧部底壁的光学元件来将光学元件组装在基板上的有源部件的顶部上的方法，将框架保持器的底表面固定在开口和侧框架壁 以多边形结构布置到基板上，使得开口定位在有源部件上方，并将光学元件安装在开口中，使得侧框架壁在侧壁上施加横向限制机械力。

公开(公告)号：US20130319507A1

公开(公告)日：2013-12-05

申请号：US13904251

申请日：2013-05-29

Applicant: Essence Solar Solutions Ltd.

Inventor： Slava HASIN ,  Ron Helfan

IPC: H01L31/052 ,  H01L31/18

CPC classification number: H01L31/052 ,  B32B3/06 ,  B32B7/12 ,  H01L21/683 ,  H01L31/02008 ,  H01L31/0232 ,  H01L31/0543 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/05 ,  H05K13/0465 ,  H05K2201/10143 ,  Y02E10/52 ,  Y10T29/5313 ,  Y10T428/12382 ,  H01L2924/00014

Abstract: A concentrated photovoltaic receiver and backplane assembly is described herein. A thermally conductive heat spreader is configured between the receiver and the backplane for dissipating at least a portion of the thermal energy in a direction including a horizontal component towards a portion of the heat spreader which is not directly in contact with a receiver portion. In some embodiments, the heat spreader is electrically conductive and is adapted for conducting current from the receiver to the backplane. In some embodiments, a surface area of a receiver substrate is less than 5 times larger than a surface area of a solar cell that is mounted onto the receiver substrate. In some embodiments, the receiver substrate comprises vias for conducting current from a top face to a bottom face of the receiver.

Abstract translation: 这里描述了集中的光电接收器和背板组件。 导热散热器配置在接收器和背板之间，用于在包括水平分量的方向上朝向不直接与接收器部分接触的散热器的一部分散热至少一部分热能。 在一些实施例中，散热器是导电的并且适于将电流从接收器传导到背板。 在一些实施例中，接收器基板的表面积小于安装在接收器基板上的太阳能电池的表面积的5倍。 在一些实施例中，接收器基板包括用于从接收器的顶面到底面传导电流的通孔。