公开(公告)号：US08183976B2

公开(公告)日：2012-05-22

申请号：US12779656

申请日：2010-05-13

Applicant: Ta-Wen Lo ,  Wen-Hsiung Liao ,  Wu-Liang Chu ,  Yen-Ting Lin

Inventor： Ta-Wen Lo ,  Wen-Hsiung Liao ,  Wu-Liang Chu ,  Yen-Ting Lin

IPC: H01C1/012

CPC classification number: H01C1/148 ,  H01C7/003 ,  H01C7/13 ,  Y10T29/49082

Abstract: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.

Abstract translation: 电阻器装置包括具有分别设置在其第一侧，第二侧，第三侧和第四侧上的第一孔，第二孔，第三孔和第四孔的电阻板。 第一电极板耦合到电阻器板的第一侧，并且包括设置在第一孔的相对侧的第一测量区和第二测量区; 并且第二电极板耦合到电阻器板的第三侧，并且包括设置在第三孔的相对侧的第三测量区和第四测量区，其中第一测量区和第三测量区设置在相对的两侧 并且第二测量区和第四测量区设置在第四孔的相对侧。

公开(公告)号：US20120112871A1

公开(公告)日：2012-05-10

申请号：US13291884

申请日：2011-11-08

Applicant: Kuo-Shu CHEN ,  Chung-Hsiung WANG

Inventor： Kuo-Shu CHEN ,  Chung-Hsiung WANG

IPC: H01H85/044

CPC classification number: H01H85/044 ,  H01H69/02 ,  H01H69/022 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/055 ,  H01H85/463

Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.

Abstract translation: 保护装置包括基板，两个第一电极，低熔点金属层和辅助层。 第一电极分别布置在基板的两个相对侧。 低熔点金属层布置在两个第一电极上。 辅助层形成在低熔点金属层上。 辅助层的液相线温度低于低熔点金属层的液相线温度，辅助层的液相线温度不低于低于回流焊接工艺的最高工作温度25度的预定温度。

公开(公告)号：US08018318B2

公开(公告)日：2011-09-13

申请号：US12482948

申请日：2009-06-11

Applicant: Chung-Hsiung Wang ,  Hideo Ikuta ,  Wu-Liang Chu ,  Yen-Ting Lin ,  Chih Sheng Kuo ,  Wen-Hsiung Liao

Inventor： Chung-Hsiung Wang ,  Hideo Ikuta ,  Wu-Liang Chu ,  Yen-Ting Lin ,  Chih Sheng Kuo ,  Wen-Hsiung Liao

IPC: H01C7/18

CPC classification number: B32B38/0032 ,  B32B38/10 ,  H01C7/003 ,  H01C7/06 ,  H01C17/006 ,  H01C17/02 ,  H01C17/06533 ,  Y10T156/1052

Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.

Abstract translation: 提供了适合于检测电路中的电流的电阻元件和制造电阻元件的方法。 电阻元件包括载体，电阻层，电极单元，上氧化物层和保护层。 电阻层包括铜合金，并设置在载体上。 电极单元电连接到电阻层。 上部氧化物层设置在电阻层的表面的一部分上并且包括电阻层的氧化物。 保护层覆盖上部氧化物层的至少一部分。

公开(公告)号：US20110057761A1

公开(公告)日：2011-03-10

申请号：US12875771

申请日：2010-09-03

Applicant: Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

IPC: H01H85/48

CPC classification number: H01H85/48 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/0283 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和桥接元件的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 桥接元件跨过金属元件横跨金属元件中的电流流动方向穿过金属元件，其中桥接元件有助于熔化时金属元件的断裂。

公开(公告)号：US20100182114A1

公开(公告)日：2010-07-22

申请号：US12554332

申请日：2009-09-04

Applicant: Yi-Min Huang ,  Roger Hsieh ,  Lan-Chin Hsieh ,  Tsung-Chan Wu

Inventor： Yi-Min Huang ,  Roger Hsieh ,  Lan-Chin Hsieh ,  Tsung-Chan Wu

IPC: H01F27/02

CPC classification number: H01F17/04 ,  H01F3/14 ,  H01F27/2847 ,  H01F27/292

Abstract: A method for adjusting the inductance of a choke is provided by the present invention. The method includes with an unchanged structure and unchanged dimensions of the core of the choke, changing the kind of the magnetic materials composing the cores so as to adjust the magnetic permeability of the magnetic material. In addition, the present invention also provides a method for designing a choke, the method includes determining the structure of a first choke and a second choke, determining the dimensions of the cores of the chokes, and selecting magnetic materials composing the cores.

Abstract translation: 本发明提供一种调节扼流圈电感的方法。 该方法包括具有不变的结构和扼流圈的芯的不变的尺寸，改变构成芯的磁性材料的种类，以便调节磁性材料的磁导率。 此外，本发明还提供一种设计扼流圈的方法，所述方法包括确定第一扼流圈和第二扼流圈的结构，确定扼流圈的芯的尺寸，以及选择构成芯的磁性材料。

公开(公告)号：US20100059870A1

公开(公告)日：2010-03-11

申请号：US12491096

申请日：2009-06-24

Applicant: Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

Inventor： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

Abstract translation: 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US07667565B2

公开(公告)日：2010-02-23

申请号：US11156361

申请日：2005-06-20

Applicant: Chun-Tiao Liu

Inventor： Chun-Tiao Liu

IPC: H01F5/00

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses an inductor that includes a conducting wire composed of an alloy having temperature coefficients of resistance (TCR) 700 ppm/° C. or lower. The inductive coil has a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire intersecting at least twice near said mid-plane.

Abstract translation: 本发明公开了一种电感器，其包括由耐温系数（TCR）为700ppm /℃以下的合金构成的导线。 感应线圈具有绕组配置，其被设置为围绕在基本矩形的盒子中，其具有沿矩形盒的细长方向延伸的中间平面，其中导线在所述中间平面附近至少两次相交。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

Applicant: Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC: H01L23/495

CPC classification number: H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

Abstract translation: 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US20070096293A1

公开(公告)日：2007-05-03

申请号：US11336973

申请日：2006-01-23

Applicant: Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

Inventor： Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

IPC: H01L23/12 ,  H01L23/52

CPC classification number: H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

Abstract translation: 本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。 第一基板包括在其中填充有导体的通孔。 位于第一基板的底表面上的多个引线框架。 位于两个引线框之间的第二基板。 然后，封装以覆盖上述结构的模塑料形成包装装置。 因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁 可以减少封装器件的射频干扰。

公开(公告)号：US06847273B2

公开(公告)日：2005-01-25

申请号：US10422692

申请日：2003-04-25

Applicant: Tseng Shin-Hsuan ,  Lin Cheng-Kuo ,  Wang Yin-Ching ,  Huang Fan-Hsiu ,  Chan Yi-Jen

Inventor： Tseng Shin-Hsuan ,  Lin Cheng-Kuo ,  Wang Yin-Ching ,  Huang Fan-Hsiu ,  Chan Yi-Jen

IPC: H01P1/201 ,  H01P11/00 ,  H01P1/203

CPC classification number: H01P11/007 ,  H01P1/2013 ,  H01P11/003

Abstract: The present invention discloses a miniaturized multi-layer coplanar wave guide low pass filter including: a substrate; a first dielectric layer formed on and enclosing said substrate; a first metallic pattern layer formed on said first dielectric layer; a second dielectric layer formed on said first metallic pattern layer; wherein several via holes being formed on said second dielectric layer; a second metallic pattern layer formed on said second dielectric layer, wherein said via holes formed on said second dielectric layer are filled up with the metal thereof; a third dielectric layer formed on said second metallic pattern layer, wherein several via holes being formed on said third dielectric layer; and a third metallic pattern layer formed on said third dielectric layer, wherein said via holes formed on said third dielectric layer are filled with the metal thereof.

Abstract translation: 本发明公开了一种小型化多层共面波导低通滤波器，包括：基板; 形成在所述衬底上并包围所述衬底的第一电介质层; 形成在所述第一电介质层上的第一金属图案层; 形成在所述第一金属图案层上的第二电介质层; 其中在所述第二电介质层上形成几个通孔; 形成在所述第二电介质层上的第二金属图案层，其中形成在所述第二电介质层上的所述通孔用其金属填充; 形成在所述第二金属图案层上的第三电介质层，其中在所述第三电介质层上形成几个通孔; 以及形成在所述第三电介质层上的第三金属图案层，其中形成在所述第三介电层上的所述通孔被其金属填充。