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    PROBE HEAD ASSEMBLIES, COMPONENTS THEREOF, TEST SYSTEMS INCLUDING THE SAME, AND METHODS OF OPERATING THE SAME
    42.
    发明申请
    PROBE HEAD ASSEMBLIES, COMPONENTS THEREOF, TEST SYSTEMS INCLUDING THE SAME, AND METHODS OF OPERATING THE SAME 有权
    探头组件及其组件，包括其的测试系统及其操作方法

    公开(公告)号：US20160103153A1

    公开(公告)日：2016-04-14

    申请号：US14972705

    申请日：2015-12-17

    Applicant: Cascade Microtech, Inc.

    Inventor： Koby Duckworth ,  Eric Hill

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

    Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

    Abstract translation: 探针头组件，探针头组件的组件，包括探针头组件和/或其部件的测试系统及其操作方法。 探针头组件被配置为将多个测试信号传送到和/或从被测设备，并且包括空间变换器，接触组件和立管，空间变换器与接触组件空间上分离并传送多个 在空间变压器和接触组件之间测试信号。 接触组件可以包括限定孔的框架，并且具有与被测器件的阈值差的阈值差的热膨胀系数，附接到框架的柔性电介质体，由框架保持张力， 并且延伸穿过该孔，以及多个导电探针。 多个导电探针可以包括双面探针尖端。

    METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS
    44.
    发明申请
    METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS 有权
    用于在定义的热条件下在探测器中验证测试基板的方法

    公开(公告)号：US20140239991A1

    公开(公告)日：2014-08-28

    申请号：US14243640

    申请日：2014-04-02

    Applicant: CASCADE MICROTECH, INC.

    Inventor： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

    IPC: G01R1/04

    CPC classification number: G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

    Abstract translation: 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。

    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER
    45.
    发明申请
    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER 有权
    在定义的热条件和热调节探头下测试测试基板的方法

    公开(公告)号：US20140028337A1

    公开(公告)日：2014-01-30

    申请号：US13953545

    申请日：2013-07-29

    Applicant: Cascade Microtech, Inc.

    Inventor： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

    IPC: G01R31/28

    CPC classification number: G01R31/2891 ,  G01R31/2874

    Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

    Abstract translation: 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。

    Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test
    47.
    发明授权
    Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test 有权

    公开(公告)号：US10571487B2

    公开(公告)日：2020-02-25

    申请号：US15821101

    申请日：2017-11-22

    Applicant: Cascade Microtech, Inc.

    Inventor： Daniel Mark Bock ,  Tim Cleary

    IPC: G01R1/073 ,  G01R31/302

    Abstract: Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test (DUT). A contact engine includes a flexible dielectric membrane having a first surface and a second surface and a plurality of probes supported by the flexible dielectric membrane. The plurality of probes are oriented to contact a plurality of contact locations on the DUT. Each probe in the plurality of probes includes a corresponding probe tip that projects from the second surface of the flexible dielectric membrane and is configured to electrically and physically contact a corresponding contact location of the plurality of contact locations. The contact engine further includes at least one membrane antenna supported by the flexible dielectric membrane. A probe head assembly includes the contact engine. A probe system includes the probe head assembly. Associated methods include methods of utilizing the contact engine.

    Probe head assemblies and probe systems for testing integrated circuit devices
    49.
    发明授权
    Probe head assemblies and probe systems for testing integrated circuit devices 有权

    公开(公告)号：US10120020B2

    公开(公告)日：2018-11-06

    申请号：US15184374

    申请日：2016-06-16

    Applicant: Cascade Microtech, Inc.

    Inventor： Jay Salmon ,  Roy E. Swart ,  Brandon Liew

    IPC: G01R31/28 ,  G01R1/073

    Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.

    PROBE SYSTEMS AND METHODS INCLUDING ELECTRIC CONTACT DETECTION
    50.
    发明申请
    PROBE SYSTEMS AND METHODS INCLUDING ELECTRIC CONTACT DETECTION 审中-公开

    公开(公告)号：US20180284155A1

    公开(公告)日：2018-10-04

    申请号：US15934672

    申请日：2018-03-23

    Applicant: Cascade Microtech, Inc.

    Inventor： Sia Choon Beng ,  Kazuki Negishi

    IPC: G01R1/073 ,  G01R31/28 ,  G01R1/067

    CPC classification number: G01R1/07342 ,  G01R1/06777 ,  G01R1/07314 ,  G01R31/2886 ,  G01R31/2887 ,  G01R31/2891

    Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

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