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    Memory module, memory module socket and mainboard using same
    41.
    发明授权
    Memory module, memory module socket and mainboard using same 有权
    内存模块，内存模块插座和主板使用相同

    公开(公告)号：US07540743B2

    公开(公告)日：2009-06-02

    申请号：US11836286

    申请日：2007-08-09

    Applicant: Sung-Joo Park ,  Kyoung-Sun Kim ,  Jung-Joon Lee ,  Jea-Eun Lee

    Inventor： Sung-Joo Park ,  Kyoung-Sun Kim ,  Jung-Joon Lee ,  Jea-Eun Lee

    IPC: H01R12/00

    CPC classification number: H01R12/83 ,  H01R13/62988 ,  H01R13/631 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/09954 ,  H05K2201/10159

    Abstract: A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.

    Abstract translation: 存储模块插座，设置在主板的主表面上，并且适于机械地接收和电连接存储器模块与主板，所述存储器模块插座包括第一单元插座，所述第一单元插座具有多个第一插座引脚，所述第一插座引脚适于电连接第一 连接器，其设置在存储器模块的边缘上，以及第二单元插座，其具有多个第二插座引脚，其适于电连接到设置在与第一连接器正交的存储器模块上的第二连接器，其中存储器模块安装在存储器 模块插座平行于主板的主表面。

    Memory module having improved arrangement of discrete devices
    42.
    发明申请
    Memory module having improved arrangement of discrete devices 审中-公开
    具有改进的离散器件布置的存储器模块

    公开(公告)号：US20080030943A1

    公开(公告)日：2008-02-07

    申请号：US11708591

    申请日：2007-02-21

    Applicant: Kyoung-sun Kim ,  Sung-joo Park ,  Jung-joon Lee ,  Jea-eun Lee

    Inventor： Kyoung-sun Kim ,  Sung-joo Park ,  Jung-joon Lee ,  Jea-eun Lee

    IPC: H05K1/14

    CPC classification number: H05K1/181 ,  G11C5/04 ,  H01L2224/16225 ,  H05K1/023 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2203/1572 ,  Y02P70/611

    Abstract: Embodiments of the invention provide memory module having an improved arrangement of discrete devices. In one embodiment, the invention provides a memory module comprising a board; a plurality of tabs disposed adjacent to a first edge of the board and disposed on a first surface of the board; and a memory pad region disposed on the first surface and comprising memory chip pads, wherein each memory chip pad is electrically connected to at least one of the tabs. The memory module further comprises discrete devices corresponding to the memory pad region, wherein the discrete devices corresponding to the memory pad region are disposed on only one side of the memory pad region. In the memory module, each of the discrete devices is electrically connected to at least one of the tabs and at least one of the memory chip pads.

    Abstract translation: 本发明的实施例提供了具有改进的离散设备布置的存储器模块。 在一个实施例中，本发明提供一种包括板的存储器模块; 多个突出部，其布置成邻近所述板的第一边缘并且设置在所述板的第一表面上; 以及存储器焊盘区域，其设置在所述第一表面上并且包括存储器芯片焊盘，其中每个存储器芯片焊盘电连接到所述突片中的至少一个。 存储器模块还包括对应于存储器焊盘区域的离散器件，其中对应于存储器焊盘区域的分立器件仅设置在存储器焊盘区域的一侧。 在存储器模块中，每个分立器件电连接到至少一个接头片和至少一个存储器芯片焊盘。

    Extract of Acanthopanax koreanum for the treatment or prevention of hepatitis or the liver protective drug
    44.
    发明授权
    Extract of Acanthopanax koreanum for the treatment or prevention of hepatitis or the liver protective drug 失效
    刺五加提取物用于治疗或预防肝炎或肝脏保护性药物

    公开(公告)号：US07309504B2

    公开(公告)日：2007-12-18

    申请号：US10502140

    申请日：2003-01-24

    Applicant: Jung Joon Lee ,  Jeong-Hyung Lee ,  Young Soo Hong ,  Young Ho Kim ,  Jeong Bum Nam ,  Dong Hwan Shon ,  Hang Sub Kim

    Inventor： Jung Joon Lee ,  Jeong-Hyung Lee ,  Young Soo Hong ,  Young Ho Kim ,  Jeong Bum Nam ,  Dong Hwan Shon ,  Hang Sub Kim

    IPC: A61K36/25 ,  A61K36/00

    CPC classification number: A61K36/254

    Abstract: The disclosure concerns an extract of Acanthopanax koreanum and its use. More particularly, it concerns the extract of Acanthopanax koreanum comprising 1) the extract of Acanthopanax koreanum extracted from water, 2) among the water extract, the extract of Acanthopanax koreanum only containing ethanol insoluble part obtained by precipitating ethanol, 3) among the ethanol insoluble part, the extract of Acanthopanax koreanum containing polysaccaride with a molecular weight larger than range of 12,000˜14,000, or 4) among the ethanol insoluble part, the extract of Acanthopanax koreanum containing polysaccaride with a molecular weight larger than 100,000, which is respectively obtained from the root or stem of Acanthopanax koreanum. The extract of the present invention shows a high inhibitory activity against hepatitis and protects the liver, and thus, can be used for the treatment or prevention of hepatitis, or as a liver protective drug.

    Abstract translation: 本公开涉及刺五加的提取物及其用途。 更具体地说，涉及刺五加提取物，其包括1）从水中提取的刺五加提取物，2）在水提取物中，仅含有通过沉淀乙醇获得的乙醇不溶部分的刺五加的提取物，3）乙醇不溶性 一部分含有分子量大于12,000〜14,000范围的多糖的刺五加提取物，或4）在乙醇不溶部分中，含有分子量大于100,000的多糖的刺五加提取物分别从 刺五加的根或茎。 本发明的提取物显示出对肝炎的高抑制活性并保护肝脏，因此可用于治疗或预防肝炎，或用作肝保护药物。

    Memory module and a method of arranging a signal line of the same
    46.
    发明授权
    Memory module and a method of arranging a signal line of the same 失效
    存储器模块及其配置信号线的方法

    公开(公告)号：US07106613B2

    公开(公告)日：2006-09-12

    申请号：US11064671

    申请日：2005-02-24

    Applicant: Chil-Nam Yoon ,  Byung-Se So ,  Jung-Joon Lee ,  Jae-Jun Lee ,  Young-Jun Park ,  Il-Sung Yu

    Inventor： Chil-Nam Yoon ,  Byung-Se So ,  Jung-Joon Lee ,  Jae-Jun Lee ,  Young-Jun Park ,  Il-Sung Yu

    IPC: G11C5/06

    CPC classification number: G11C5/063 ,  H05K1/181 ,  H05K2201/09254 ,  Y02P70/611

    Abstract: The present invention discloses a memory module and a method of arranging a signal line of the same. The method of arranging a signal line of a memory module comprises: classifying a plurality of memories into a first group including an odd number of memories and a second group including an even number of memories; arranging first branch points corresponding to the plurality of memories and respectively connecting the first branch points to the plurality of memories through first signal lines; arranging a second branch point located at a middle of the second group for respectively connecting between the first branch points adjacent to each other of the second group and between the first branch points adjacent to the second branch points and the second branch point through second signal lines; arranging a third branch point located at a middle of the second group, receiving an external signal, and connecting the third branch point and the second branch point of the second group through a third signal line; and connecting between the second branch point of the second group and the first branch point of the first group through a fourth signal line.

    Abstract translation: 本发明公开了一种存储模块及其配置信号线的方法。 布置存储器模块的信号线的方法包括：将多个存储器分类为包括奇数个存储器的第一组和包括偶数个存储器的第二组; 布置与多个存储器相对应的第一分支点，并通过第一信号线分别将第一分支点连接到多个存储器; 布置位于第二组中间的第二分支点，以分别连接第二组彼此相邻的第一分支点与第二分支点相邻的第一分支点与第二分支点之间通过第二信号线 ; 布置位于第二组中间的第三分支点，接收外部信号，并通过第三信号线连接第二组的第三分支点和第二分支点; 并且通过第四信号线连接第二组的第二分支点和第一组的第一分支点。

    Memory module with memory devices of different capacity
    47.
    发明申请
    Memory module with memory devices of different capacity 审中-公开
    内存模块具有不同容量的内存设备

    公开(公告)号：US20060059298A1

    公开(公告)日：2006-03-16

    申请号：US11102181

    申请日：2005-04-08

    Applicant: Jeong-Hyeon Cho ,  Jung-Joon Lee ,  You-Keun Han ,  Byung-Se So

    Inventor： Jeong-Hyeon Cho ,  Jung-Joon Lee ,  You-Keun Han ,  Byung-Se So

    IPC: G06F12/00

    CPC classification number: G11C5/04

    Abstract: A memory module includes a first set of at least one first type of memory device and a second set of at least one second type of memory device having a higher capacity than the first type. In addition, an additional capacity portion of the first and second sets stores information for an additional function of the memory module, and a remaining capacity portion of the first and second sets forms a rank of the memory module. The memory module avoids an asymmetric topology of signal lines and yet provides additional memory capacity.

    Abstract translation: 存储器模块包括具有比第一类型更高的容量的至少一种第一类型的存储器件的第一组和至少一种第二类型的存储器件的第二组。 此外，第一组和第二组的附加容量部分存储用于存储器模块的附加功能的信息，并且第一组和第二组的剩余容量部分形成存储器模块的等级。 存储器模块避免信号线的不对称拓扑，并提供额外的存储容量。

    Multi in-line memory module and matching electronic component socket
    48.
    发明授权
    Multi in-line memory module and matching electronic component socket 有权
    多行内存模块和匹配电子元件插座

    公开(公告)号：US06421250B1

    公开(公告)日：2002-07-16

    申请号：US09405514

    申请日：1999-09-23

    Applicant: Jong-ryeul Kim ,  Jung-joon Lee ,  Bok-moon Kang

    Inventor： Jong-ryeul Kim ,  Jung-joon Lee ,  Bok-moon Kang

    IPC: H05K111

    CPC classification number: H05K1/144 ,  G11C5/04 ,  H01R12/721 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/0919

    Abstract: A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least two protrusions formed along one edge of the printed circuit board. Each of the protrusions has first and second surfaces for blocks of contact pins. Accordingly, the module can include three or more pin blocks on separate surfaces of the protrusions. The module provides a large number of pins without being significantly larger than a conventional SIMM or DIMM. Alternatively, physical and electrical attachment of multiple circuit boards provides three or more independent pin blocks on the various surfaces of the printed circuit boards. A socket for a module includes dielectric protrusions with two or more gaps between the protrusions and contact pins on side surfaces of the protrusions that are in the gaps. Inserting the protrusions of a multi in-line module into the gaps between the protrusions of the socket creates an electrical connection between contact pins on the module and contact pins of the socket.

    Abstract translation: 提供了一种用于多直列模块的多直列模块和电子组件插座。 多列嵌入式存储器模块的一个实施例包括具有沿着印刷电路板的一个边缘形成的至少两个突起的印刷电路板。 每个突起具有用于接触销块的第一和第二表面。 因此，模块可以在突起的分开的表面上包括三个或更多个销块。 该模块提供大量引脚，而不会显着大于常规SIMM或DIMM。 或者，多个电路板的物理和电连接在印刷电路板的各个表面上提供三个或更多个独立的引脚块。 用于模块的插座包括在突起之间具有两个或更多间隙的电介质突起和位于间隙中的突起的侧表面上的接触销。 将多个在线模块的突起插入到插座的突起之间的间隙中，在模块上的接触销和插座的接触销之间形成电连接。

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