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公开(公告)号：US09691949B2
公开(公告)日：2017-06-27
申请号：US14292331
申请日：2014-05-30
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Sung Chul Joo
IPC: H01L21/00 , H01L33/56 , H01L27/15 , H01L25/075 , H01L23/00 , H01L33/48 , H01L33/62 , H01L33/50 , H01L33/60 , H01L25/16 , H01L33/52
CPC classification number: H01L33/56 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00012
Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.
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公开(公告)号：US09590155B2
公开(公告)日：2017-03-07
申请号：US13828895
申请日：2013-03-14
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , Jesse Colin Reiherzer , Erin Welch
IPC: H01L33/62 , H01L33/60 , H05K3/24 , H01L25/075 , H01L33/64
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H05K3/244 , H05K2201/0341 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H05K2203/073 , H05K2203/1461 , H01L2924/00014
Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.
Abstract translation: 发光器件和衬底具有改进的电镀。 在一个实施例中，发光器件可以包括底座和设置在所述底座上方的一个或多个发光二极管（LED）芯片。 在一个实施例中，底座可以包括铜（Cu）衬底，高度反射性地设置在Cu衬底上的用于增加器件亮度的第一金属材料层，以及设置在Cu衬底和第一衬底之间的第二金属层 用于在其间形成屏障的金属层。
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公开(公告)号：US20170018538A1
公开(公告)日：2017-01-19
申请号：US14802655
申请日：2015-07-17
Applicant: Cree, Inc.
Inventor： Nishant Tiwari , Colin Kelly Blakely , Jesse Colin Reiherzer , Mark Edmond , Arthur Fong-Yuen Pun , Michael Bergmann
CPC classification number: H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/62 , H01L2224/48137 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
Abstract translation: 提供固态发光器件和方法。 固态发光器件可以包括具有上表面和底表面的底座。 至少第一对和第二对导电触点可以设置在底座的底表面上。 第一对触点可以与第二对触点电独立。 该装置还可以包括设置在底座的上表面上的多个发光体。 多个光发射器可以配置成至少第一光发射区，其在与相应的一对触点通电时与第二光发射区电独立。
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公开(公告)号：US20160148860A1
公开(公告)日：2016-05-26
申请号：US14550443
申请日：2014-11-21
Applicant: Cree, Inc.
Inventor： Colin Kelly Blakely , Jesse Colin Reiherzer , Arthur Fong-Yuen Pun
IPC: H01L23/495 , H01L23/13 , H01L25/075
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/4952 , H01L23/49541 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L2224/48091 , H01L2933/0033 , H01L2924/00014
Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.
Abstract translation: 提供基于引线框架的光发射器部件和方法。 在一些方面，基于引线框架的光发射器部件包括引线框架元件，连接到引线框架元件的一部分的电气设备以及封装引线框架元件和连接到其的电气设备的部分的模制杯。 提供基于引线框架的光发射器部件的方法包括提供引线框架元件，将电气设备连接到引线框架元件的一部分，以及在引线框架元件和电气设备的部分上模制主体。
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公开(公告)号：US20160133610A1
公开(公告)日：2016-05-12
申请号：US14538526
申请日：2014-11-11
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Colin Kelly Blakely , Arthur Fong-Yuen Pun , Troy Anthony Trottier
CPC classification number: H01L25/0753 , H01L33/54 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/8592 , H01L2924/0002 , H01L2924/10155 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.
Abstract translation: 公开了发光二极管（LED）组件和相关方法。 LED组件包括底座，在底座的第一表面上的至少一个LED芯片，以及不反射，透光的结构或水坝。 透光堤坝可以提供具有大于115°的视角的部件。 提供LED组件的方法包括提供非金属底座，将至少一个LED芯片附接到所述底座的第一表面，以及在所述底座的所述第一表面周围至少围绕所述至少一个 一个LED芯片，从而提供具有大于115°的视角的部件。
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Patent Agency Ranking
公开(公告)号：USD746240S1
公开(公告)日：2015-12-29
申请号：US29478014
申请日：2013-12-30
Applicant: Cree, Inc.
Designer： Michael Bergmann , Joseph G Clark , Jesse Colin Reiherzer , Jeremy Scott Nevins
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公开(公告)号：US20150349218A1
公开(公告)日：2015-12-03
申请号：US14292331
申请日：2014-05-30
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Sung Chul Joo
CPC classification number: H01L33/56 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00012
Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.
Abstract translation: 公开了基于底座的光发射器部件和相关方法。 在一些方面，光发射器部件包括陶瓷基座，至少第一对电迹线布置在基座的第一侧上，至少第一对电触点设置在基座的第二侧上，至少一个光 设置在所述基座的第一侧上的发射极芯片和设置在所述至少一个发光芯片周围的非陶瓷反射器。 第一对电触点被配置为与第一对电迹线电连通。 至少一个芯片被配置为与第一对电迹线电连通。 反射器的至少一部分被配置为隐藏第一对电迹线的每个迹线的一部分。
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公开(公告)号：USD736725S1
公开(公告)日：2015-08-18
申请号：US29487954
申请日：2014-04-14
Applicant: Cree, Inc.
Designer： Kurt S. Wilcox , Christopher P. Hussell , Jesse Colin Reiherzer
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公开(公告)号：US20140183577A1
公开(公告)日：2014-07-03
申请号：US14148102
申请日：2014-01-06
Applicant: Cree, Inc.
CPC classification number: H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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公开(公告)号：US20130292708A1
公开(公告)日：2013-11-07
申请号：US13829962
申请日：2013-03-14
Applicant: CREE, INC.
Inventor： Jesse Colin Reiherzer , Christopher P. Hussell , Erin Welch
IPC: H01L33/48
CPC classification number: H01L33/486 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.
Abstract translation: 本文提供了基于底座的光发射器部件和方法。 在一个方面，基于基座的光发射器部件可以包括主基座，辅助基座和至少一个光发射器芯片。 所述至少一个光发射器芯片可以设置在主基座上并电连接到次级底座。
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