Abstract:
In some examples, a memory device may be configured to use shared read circuitry to sample a voltage drop across both a bit cell and a resistive circuit in order to perform a comparison that produces an output corresponding to the bit stored in the bit cell. The shared read circuitry can include a shared sense amplifier as well as shared N-MOS and P-MOS followers used to apply read voltages across the bit cell and resistive circuit.
Abstract:
In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.
Abstract:
In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on a state associated with one or more shorted bit cells. For instance, the memory device may be configured to identify a shorted bit cell within a memory array and to store the data in the memory array, such that a state of the data bit stored in the shorted bit cell matches the state associated with the shorted bit cell.
Abstract:
A cell bias control circuit maximizes the performance of devices in the read/write path of memory cells (magnetic tunnel junction device+transistor) without exceeding leakage current or reliability limits by automatically adjusting multiple control inputs of the read/write path at the memory array according to predefined profiles over supply voltage, temperature, and process corner variations by applying any specific reference parameter profiles to the memory array.
Abstract:
A memory device includes memory arrays configured to store pages of data organized into multiple ECC words. The memory device also includes at least one input/output pad for each ECC word associated with a page, such that a first level of error correction may be performed by the memory device on each of the ECC words associated with a page and a second level of error correction is performed on the data output by each of the input/output pads during a particular period of time.
Abstract:
In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on a state associated with one or more shorted bit cells. For instance, the memory device may be configured to identify a shorted bit cell within a memory array and to store the data in the memory array, such that a state of the data bit stored in the shorted bit cell matches the state associated with the shorted bit cell.
Abstract:
In response to a tamper-attempt indication, a memory device selectively disables one or more memory operations. Disabling can be accomplished by different techniques, including altering bias voltages associated with performing the memory operation, gating off a current needed for performing the memory operation, and limiting the needed current to a magnitude below the threshold magnitude required for the operation. After disabling the memory operation, a mock current can be generated. The mock current is intended to mimic the current normally expended during the memory operation when not disabled, thereby leading a user to believe that the device is continuing to operate normally even though the memory operation that is being attempted is not actually being performed.
Abstract:
A memory system and memory controller for interleaving volatile and non-volatile memory accesses are described. In the memory system, the memory controller is coupled to the volatile and non-volatile memories using a shared address bus. Activate latencies for the volatile and non-volatile memories are different, and registers are included on the memory controller for storing latency values. Additional registers on the memory controller store precharge latencies for the memories as well as page size for the non-volatile memory. A memory access sequencer on the memory controller asserts appropriate chip select signals to the memories to initiate operations therein.
Abstract:
In some examples, a memory device may be configured to utilize differential bit cells formed from two or more tunnel junctions. In some cases, the tunnel junctions forming the differential bit cell may be arranged to utilize shared read circuitry to reduce device mismatch. For instance, the read operations associated with both tunnel junction may be time multiplexed such that the same preamplifier circuitry may sense voltages representative of the tunnel junctions.
Abstract:
In a spin-torque magnetic random access memory (MRAM) that includes local source lines, auto-booting of the word line is used to conserve power consumption by reusing charge already present from driving a plurality of bit lines during writing operations. Auto-booting is accomplished by first driving the word line to a first word line voltage. After such driving, the word line isolated. Subsequent driving of the plurality of bit lines that are capacitively coupled to the word line causes the word line voltage to be increased to a level desired to allow sufficient current to flow through a selected memory cell to write information into the selected memory cell. Additional embodiments include the use of a supplemental voltage provider that is able to further boost or hold the isolated word line at the needed voltage level.