Field effect transistor and method of manufacturing the same
    42.
    发明授权
    Field effect transistor and method of manufacturing the same 有权
    场效应晶体管及其制造方法

    公开(公告)号:US06504176B2

    公开(公告)日:2003-01-07

    申请号:US09824922

    申请日:2001-04-03

    IPC分类号: H01L310317

    摘要: There are provided a field effect transistor with a high withstand voltage and low loss and a method of manufacturing the same. The field effect transistor includes an n-type substrate, an n-type semiconductor layer formed on the n-type substrate, a p-type semiconductor layer formed on the n-type semiconductor layer, a p-type region embedded in the n-type semiconductor layer, an n-type region embedded in the n-type semiconductor layer and the p-type semiconductor layer, an n-type source region disposed in the p-type semiconductor layer on its surface side, an insulating layer disposed on the p-type semiconductor layer, a gate electrode disposed on the insulating layer, a source electrode, and a drain electrode. The n-type semiconductor layer, the p-type semiconductor layer, and the p-type region are made of wide-gap semiconductors with a bandgap of at least 2 eV, respectively.

    摘要翻译: 提供具有高耐受电压和低损耗的场效应晶体管及其制造方法。 场效应晶体管包括n型衬底,形成在n型衬底上的n型半导体层,形成在n型半导体层上的p型半导体层,嵌入在n型衬底中的p型区域, 埋入n型半导体层和p型半导体层的n型区域,在其表面侧配置在p型半导体层中的n型源极区域,设置在p型半导体层上的绝缘层 p型半导体层,设置在绝缘层上的栅电极,源电极和漏电极。 n型半导体层,p型半导体层和p型区域分别由具有至少2eV的带隙的宽间隙半导体制成。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR
    43.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR 有权
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US20130214288A1

    公开(公告)日:2013-08-22

    申请号:US13880027

    申请日:2012-05-02

    IPC分类号: H01L33/32

    CPC分类号: H01L33/32 H01L33/02 H01L33/16

    摘要: A nitride-based semiconductor light-emitting device of an embodiment includes a semiconductor multilayer structure having a growing plane which is an m-plane and being made of a GaN-based semiconductor. The semiconductor multilayer structure includes a n-type semiconductor layer, a p-type semiconductor layer, a p-side electrode provided on the p-type semiconductor layer, and an active layer interposed between the n-type semiconductor layer and the p-type semiconductor layer. The ratio of the thickness of the active layer to the thickness of the n-type semiconductor layer, D, is in the range of 1.8×10−4≦D≦14.1×10−4. The area of the p-side electrode, S, is in the range of 1×102 μm2≦S≦9×104 μm2. A maximum current density which leads to 88% of a maximum of the external quantum efficiency is not less than 2 A/mm2.

    摘要翻译: 实施方式的氮化物系半导体发光元件具有半导体层叠结构,该半导体层叠结构具有作为m面的生长面并由GaN系半导体构成。 半导体多层结构包括n型半导体层,p型半导体层,设置在p型半导体层上的p侧电极以及介于n型半导体层和p型半导体层之间的有源层 半导体层。 有源层的厚度与n型半导体层的厚度D之比在1.8×10 -4 @ D @ 14.1×10 -4的范围内。 p侧电极S的面积在1×102mum2 @ S @ 9×104mum2的范围内。 导致外部量子效率最大值的88%的最大电流密度不小于2A / mm2。

    Light-emitting diode
    47.
    发明授权
    Light-emitting diode 有权
    发光二极管

    公开(公告)号:US08421054B2

    公开(公告)日:2013-04-16

    申请号:US13351452

    申请日:2012-01-17

    IPC分类号: H01L29/04 H01L29/26

    摘要: A light-emitting diode element includes: an n-type conductive layer 2 being made of a gallium nitride-based compound, a principal surface being an m-plane; a semiconductor multilayer structure 21 provided on a first region 2a of the principal surface of the n-type conductive layer 2, the semiconductor multilayer structure 21 including a p-type conductive layer 4 and an active layer 3; a p-electrode 5 provided on the p-type conductive layer 4; a conductor portion 9 provided on a second region 2b of the principal surface of the n-type conductive layer 2, the conductor portion 9 being in contact with an inner wall of a through hole 8; and an n-type front surface electrode 6 provided on the second region 2b of the principal surface of the n-type conductive layer 2, the n-type front surface electrode 6 being in contact with the conductor portion 9.

    摘要翻译: 发光二极管元件包括:n型导电层2,其由氮化镓基化合物制成,主表面为m面; 设置在n型导电层2的主表面的第一区域2a上的半导体多层结构21,包括p型导电层4和活性层3的半导体多层结构21; 设置在p型导电层4上的p电极5; 设置在n型导电层2的主表面的第二区域2b上的导体部分9,导体部分9与通孔8的内壁接触; 以及设置在n型导电层2的主表面的第二区域2b上的n型正面电极6,n型正面电极6与导体部分9接触。

    Nitride semiconductor laser and method for fabricating the same
    49.
    发明授权
    Nitride semiconductor laser and method for fabricating the same 失效
    氮化物半导体激光器及其制造方法

    公开(公告)号:US08198637B2

    公开(公告)日:2012-06-12

    申请号:US11872071

    申请日:2007-10-15

    IPC分类号: H01L27/15

    摘要: A semiconductor laser includes a nitride semiconductor substrate with a striped raised portion that extends in a resonant cavity length direction, a masking layer, which has been defined on the principal surface of the nitride semiconductor substrate and which has a striped opening in a selected area on the upper surface of the striped raised portion, and a nitride semiconductor multilayer structure, which has been grown on the selected area on the upper surface of the striped raised portion. The nitride semiconductor multilayer structure is thicker than nitride semiconductors on the masking layer, and the nitride semiconductor multilayer structure is broader in width than the striped opening of the masking layer and includes portions that have grown laterally onto the masking layer.

    摘要翻译: 半导体激光器包括具有在共振腔长度方向上延伸的条纹凸起部分的氮化物半导体衬底,已经限定在氮化物半导体衬底的主表面上并且在选定区域中具有条纹开口的掩模层 条状隆起部分的上表面和氮化物半导体多层结构,其已经在条纹凸起部分的上表面上的选定区域上生长。 氮化物半导体多层结构比掩模层上的氮化物半导体更厚,并且氮化物半导体多层结构的宽度比掩蔽层的条纹开口宽,并且包括在掩模层上横向生长的部分。

    LIGHT-EMITTING DIODE
    50.
    发明申请
    LIGHT-EMITTING DIODE 有权
    发光二极管

    公开(公告)号:US20120113656A1

    公开(公告)日:2012-05-10

    申请号:US13351452

    申请日:2012-01-17

    IPC分类号: F21V21/00 H01L33/38

    摘要: A light-emitting diode element includes: an n-type conductive layer 2 being made of a gallium nitride-based compound, a principal surface being an m-plane; a semiconductor multilayer structure 21 provided on a first region 2a of the principal surface of the n-type conductive layer 2, the semiconductor multilayer structure 21 including a p-type conductive layer 4 and an active layer 3; a p-electrode 5 provided on the p-type conductive layer 4; a conductor portion 9 provided on a second region 2b of the principal surface of the n-type conductive layer 2, the conductor portion 9 being in contact with an inner wall of a through hole 8; and an n-type front surface electrode 6 provided on the second region 2b of the principal surface of the n-type conductive layer 2, the n-type front surface electrode 6 being in contact with the conductor portion 9.

    摘要翻译: 发光二极管元件包括:n型导电层2,其由氮化镓基化合物制成,主表面为m面; 设置在n型导电层2的主表面的第一区域2a上的半导体多层结构21,包括p型导电层4和活性层3的半导体多层结构21; 设置在p型导电层4上的p电极5; 设置在n型导电层2的主表面的第二区域2b上的导体部分9,导体部分9与通孔8的内壁接触; 以及设置在n型导电层2的主表面的第二区域2b上的n型正面电极6,n型正面电极6与导体部分9接触。