公开(公告)号：US20140339495A1

公开(公告)日：2014-11-20

申请号：US13894255

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L33/50 ,  H01L33/06

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/06 ,  H01L33/502 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/82

Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.

Abstract translation: 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。

公开(公告)号：US20140299837A1

公开(公告)日：2014-10-09

申请号：US14312554

申请日：2014-06-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L27/15

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US20140299572A1

公开(公告)日：2014-10-09

申请号：US14312551

申请日：2014-06-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: B81C1/00

CPC classification number: B81C1/0015 ,  B81B2203/0118 ,  B81C99/002 ,  H01L33/0095

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.

公开(公告)号：US20140241843A1

公开(公告)日：2014-08-28

申请号：US13776158

申请日：2013-02-25

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J15/00 ,  B25J11/00

CPC classification number: B25J9/1015 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  B25J17/0208 ,  H01L21/67144 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/7565 ,  H01L2224/75723 ,  H01L2224/75725 ,  H01L2224/75823 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：US20140196851A1

公开(公告)日：2014-07-17

申请号：US14173693

申请日：2014-02-05

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: B32B38/18

CPC classification number: B32B38/18 ,  B81C99/002 ,  H01L21/6835 ,  H01L23/5384 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  Y10T156/17 ,  H01L2924/00

Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US20140158415A1

公开(公告)日：2014-06-12

申请号：US13710438

申请日：2012-12-10

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H05K1/02

CPC classification number: B81C99/002 ,  H01L21/6835 ,  H01L2221/68354

Abstract: A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer.

Abstract translation: 描述了单极和双极微器件转移头阵列和形成单极和双极微器件转移阵列的方法。 在一个实施例中，微器件转移头阵列包括基底基板，形成在基底基板上的第一绝缘层和台面结构阵列。 可以在台面结构之上形成第二绝缘层，在第二绝缘层上形成图案化金属层，以及覆盖金属层的电介质层。

公开(公告)号：US20130126827A1

公开(公告)日：2013-05-23

申请号：US13708695

申请日：2012-12-07

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/04

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US09773750B2

公开(公告)日：2017-09-26

申请号：US13749647

申请日：2013-01-24

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu ,  Hung-Fai Stephen Law

IPC: B23K5/22 ,  B23K31/02 ,  H01L23/00 ,  H01L21/67

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29183 ,  H01L2224/75261 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75283 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2224/95001 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01082 ,  H01L2924/0103

Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.

公开(公告)号：US09583533B2

公开(公告)日：2017-02-28

申请号：US14210295

申请日：2014-03-13

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L29/06 ,  H01L27/15 ,  H01L33/18 ,  H01L25/075 ,  H01L33/08 ,  H01L33/16 ,  H01L23/00 ,  H01L33/00 ,  H01L33/24

CPC classification number: H01L27/153 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L29/0669 ,  H01L29/0676 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/08 ,  H01L33/16 ,  H01L33/18 ,  H01L33/24

Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.

Abstract translation: 描述了纳米线器件和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件包括基底层和在基底层的第一表面上并远离基底层的多个纳米线。 封装材料横向围绕纳米线装置中的多个纳米线，使得纳米线嵌入封装材料内。

公开(公告)号：US09559142B2

公开(公告)日：2017-01-31

申请号：US14931695

申请日：2015-11-03

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L27/12 ,  H01L25/075 ,  H01L33/20 ,  H01L33/42 ,  H01L23/00 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。