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公开(公告)号:US20180366176A1
公开(公告)日:2018-12-20
申请号:US16111021
申请日:2018-08-23
Applicant: Micron Technology, Inc.
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.
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公开(公告)号:US20180358076A1
公开(公告)日:2018-12-13
申请号:US16044310
申请日:2018-07-24
Applicant: Micron Technology, Inc.
Inventor: Alessandro Calderoni , Durai Vishak Nirmal Ramaswamy
IPC: G11C11/22
Abstract: Methods, systems, and devices for memory array operation are described. A series of pulses may be applied to a fatigued memory cell to improve performance of memory cell. For example, a ferroelectric memory cell may enter a fatigue state after a number of access operations are performed at an access rate. After the number of access operations have been performed at the access rate, a fatigue state of the ferroelectric memory cell may be identified and the series of pulses may be applied to the ferroelectric capacitor at a different (e.g., higher) rate. For instance, a delay between pulses of the series of pulses may be shorter than the delay between access operations of the ferroelectric memory cell.
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公开(公告)号:US09721639B1
公开(公告)日:2017-08-01
申请号:US15188886
申请日:2016-06-21
Applicant: Micron Technology, Inc.
CPC classification number: G11C11/2275 , G06F11/1048 , G06F11/1068 , G11C11/221 , G11C11/2273 , G11C29/52
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.
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公开(公告)号:US09613676B1
公开(公告)日:2017-04-04
申请号:US15197416
申请日:2016-06-29
Applicant: Micron Technology, Inc.
Inventor: Bei Wang , Alessandro Calderoni , Wayne Kinney , Adam Johnson , Durai Vishak Nirmal Ramaswamy
IPC: G11C11/22 , G11C11/56 , H01L27/11507 , G11C14/00 , H01L27/11502
CPC classification number: G11C11/2275 , G11C11/22 , G11C11/221 , G11C11/2253 , G11C11/2273 , G11C11/5657 , G11C14/00 , H01L27/11502 , H01L27/11507
Abstract: Methods, systems, and devices for preventing disturb of untargeted memory cells during repeated access operations of target memory cells are described for a non-volatile memory array. Multiple memory cells may be in electronic communication with a common conductive line, and each memory cell may have an electrically non-linear selection component. Following an access operation (e.g., a read or write operation) of a target memory cell, untargeted memory cells may be discharged by applying a discharge voltage to the common conductive line. The discharge voltage may, for example, have a polarity opposite to the access voltage. In other examples, a delay may be instituted between access attempts in order to discharge the untargeted memory cells.
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公开(公告)号:US09245620B2
公开(公告)日:2016-01-26
申请号:US14750525
申请日:2015-06-25
Applicant: Micron Technology, Inc.
Inventor: Alessandro Calderoni , Massimo Ferro , Paolo Fantini
CPC classification number: G11C13/004 , G11C11/00 , G11C11/5678 , G11C13/0002 , G11C13/0004 , G11C13/0035 , G11C13/0069 , G11C13/0097 , G11C29/006 , G11C29/50008 , G11C2013/0052 , G11C2013/0057
Abstract: The present disclosure includes apparatuses and methods including drift acceleration in resistance variable memory. A number of embodiments include applying a programming signal to the resistance variable memory cell to program the cell to a target state, subsequently applying a pre-read signal to the resistance variable memory cell to accelerate a drift of a resistance of the programmed cell, and subsequently applying a read signal to the resistance variable memory cell.
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公开(公告)号:US09099174B2
公开(公告)日:2015-08-04
申请号:US13647527
申请日:2012-10-09
Applicant: Micron Technology, Inc.
Inventor: Alessandro Calderoni , Massimo Ferro , Paolo Fantini
IPC: G11C11/00
CPC classification number: G11C13/004 , G11C11/00 , G11C11/5678 , G11C13/0002 , G11C13/0004 , G11C13/0035 , G11C13/0069 , G11C13/0097 , G11C29/006 , G11C29/50008 , G11C2013/0052 , G11C2013/0057
Abstract: The present disclosure includes apparatuses and methods including drift acceleration in resistance variable memory. A number of embodiments include applying a programming signal to the resistance variable memory cell to program the cell to a target state, subsequently applying a pre-read signal to the resistance variable memory cell to accelerate a drift of a resistance of the programmed cell, and subsequently applying a read signal to the resistance variable memory cell.
Abstract translation: 本公开包括包括电阻变化存储器中的漂移加速度的装置和方法。 许多实施例包括将编程信号施加到电阻可变存储单元以将该单元编程到目标状态,随后将预读信号施加到电阻可变存储单元以加速编程单元电阻的漂移,以及 随后向电阻变化存储单元施加读取信号。
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公开(公告)号:US09058875B2
公开(公告)日:2015-06-16
申请号:US13921951
申请日:2013-06-19
Applicant: Micron Technology, Inc.
Inventor: D. V. Nirmal Ramaswamy , Gurtej S. Sandhu , Lei Bi , Adam D. Johnson , Brent Keeth , Alessandro Calderoni , Scott E. Sills
IPC: G11C13/00
CPC classification number: G11C13/004 , G11C11/1673 , G11C13/0069 , G11C2013/0047 , G11C2013/0057
Abstract: The present disclosure includes apparatuses and methods for sensing a resistive memory cell. A number of embodiments include performing a sensing operation on a memory cell to determine a current value associated with the memory cell, applying a programming signal to the memory cell, and determining a data state of the memory cell based on the current value associated with the memory cell before applying the programming signal and a current value associated with the memory cell after applying the programming signal.
Abstract translation: 本公开包括用于感测电阻式存储单元的装置和方法。 许多实施例包括对存储器单元执行感测操作以确定与存储器单元相关联的当前值,将编程信号施加到存储器单元,以及基于与存储器单元相关联的当前值来确定存储器单元的数据状态 在施加编程信号之前应用编程信号的存储单元和与存储器单元相关联的当前值。
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公开(公告)号:US20240164113A1
公开(公告)日:2024-05-16
申请号:US18510464
申请日:2023-11-15
Applicant: Micron Technology, Inc.
Inventor: Alessandro Calderoni , Kamal Karda , Durai Vishak Nirmal Ramaswamy
IPC: H10B53/20 , G11C5/06 , H01L21/28 , H01L29/51 , H01L29/66 , H01L29/78 , H10B51/10 , H10B51/20 , H10B53/10
CPC classification number: H10B53/20 , G11C5/063 , H01L29/40111 , H01L29/516 , H01L29/6684 , H01L29/78391 , H10B51/10 , H10B51/20 , H10B53/10
Abstract: Methods, systems, and devices for memory structures with voids are described. A memory architecture may include voids between adjacent columns of memory cells. For example, a memory array may be manufactured by forming one or more sacrificial structures, as well as a liner material on sidewalls of the sacrificial structures, extending in the column direction. Memory cells may be formed on the sacrificial structures by patterning a conductive material to form bottom electrodes, forming a ferroelectric material adjacent to the bottom electrodes, and forming a set of plate lines over the ferroelectric material. The sacrificial structures may then be removed to form voids between at least some adjacent columns of memory cells.
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公开(公告)号:US20240127877A1
公开(公告)日:2024-04-18
申请号:US18047568
申请日:2022-10-18
Applicant: Micron Technology, Inc.
Inventor: Durai Vishak Nirmal Ramaswamy , Giorgio Servalli , Angelo Visconti , Marcello Mariani , Alessandro Calderoni
CPC classification number: G11C11/2257 , G11C7/067 , G11C11/2297
Abstract: Methods, systems, and devices for differential storage in memory arrays are described. A memory device may include pairs of memory cells configured to store a single logic state (e.g., a single bit of information). Additionally, the memory device may include sense amplifiers configured to sense the logic state based on a difference between a voltage of a first ferroelectric memory cell of the pair of memory cells and a voltage of a second ferroelectric memory cell of the pair of memory cells. In one example, the memory device may include pairs of memory cells within a single memory array on a single level. Here, each memory cell pair may include a memory cells that are each coupled with a same word line and plate line. Additionally, each memory cell pair may include memory cells each coupled with different digit lines.
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公开(公告)号:US11711924B2
公开(公告)日:2023-07-25
申请号:US17693035
申请日:2022-03-11
Applicant: Micron Technology, Inc.
CPC classification number: H10B53/40 , G11C11/221 , G11C11/2295 , H01G4/008 , H01G4/06 , H01G4/40 , H01L28/55 , H01L28/60 , H10B53/10 , H10B53/30
Abstract: Some embodiments include an integrated assembly having first electrodes with top surfaces, and with sidewall surfaces extending downwardly from the top surfaces. The first electrodes are solid pillars. Insulative material is along the sidewall surfaces of the first electrodes. Second electrodes extend along the sidewall surfaces of the first electrodes and are spaced from the sidewall surfaces by the insulative material. Conductive-plate-material extends across the first and second electrodes, and couples the second electrodes to one another. Leaker-devices electrically couple the first electrodes to the conductive-plate-material and are configured to discharge at least a portion of excess charge from the first electrodes to the conductive-plate-material. Some embodiments include methods of forming integrated assemblies.
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