High pressure apparatus with stackable rings
    44.
    发明授权
    High pressure apparatus with stackable rings 有权
    高压装置带有可堆叠环

    公开(公告)号:US08435347B2

    公开(公告)日:2013-05-07

    申请号:US12891668

    申请日:2010-09-27

    Abstract: A high pressure apparatus and related methods for processing supercritical fluids is described. The apparatus includes a capsule, a heater, at least one ceramic ring with one or more scribe marks and/or cracks present. The apparatus optionally has a metal sleeve containing each ceramic ring. The apparatus also has a high-strength enclosure, end flanges with associated insulation, and a power control system. The apparatus is capable of accessing pressures and temperatures of 0.2-2 GPa and 400-1200° C., respectively.

    Abstract translation: 描述了用于加工超临界流体的高压装置和相关方法。 该装置包括胶囊,加热器,至少一个具有一个或多个划痕和/或裂纹的陶瓷环。 该装置可选地具有包含每个陶瓷环的金属套筒。 该设备还具有高强度外壳,具有相关绝缘的端部法兰和电源控制系统。 该装置能够分别获得0.2-2GPa和400-1200℃的压力和温度。

    High pressure apparatus and method for nitride crystal growth
    45.
    发明授权
    High pressure apparatus and method for nitride crystal growth 有权
    用于氮化物晶体生长的高压装置和方法

    公开(公告)号:US08303710B2

    公开(公告)日:2012-11-06

    申请号:US12478736

    申请日:2009-06-04

    Inventor: Mark P. D'Evelyn

    Abstract: A high pressure apparatus and related methods for processing supercritical fluids. In a specific embodiment, the present apparatus includes a capsule, a heater, at least one ceramic ring but can be multiple rings, optionally, with one or more scribe marks and/or cracks present. In a specific embodiment, the apparatus optionally has a metal sleeve containing each ceramic ring. The apparatus also has a high-strength enclosure, end flanges with associated insulation, and a power control system. In a specific embodiment, the apparatus is capable of accessing pressures and temperatures of 0.2-2 GPa and 400-1200° C., respectively.

    Abstract translation: 一种用于加工超临界流体的高压装置及相关方法。 在具体实施例中,本装置包括胶囊,加热器,至少一个陶瓷环,但可以是多个环,任选地,存在一个或多个划痕和/或裂纹。 在具体实施例中,该装置可选地具有包含每个陶瓷环的金属套筒。 该设备还具有高强度外壳,具有相关绝缘的端部法兰和电源控制系统。 在具体实施例中,该装置能够分别访问0.2-2GPa和400-1200℃的压力和温度。

    High Pressure Apparatus and Method for Nitride Crystal Growth
    47.
    发明申请
    High Pressure Apparatus and Method for Nitride Crystal Growth 有权
    高压设备和氮化物晶体生长方法

    公开(公告)号:US20120118223A1

    公开(公告)日:2012-05-17

    申请号:US13343563

    申请日:2012-01-04

    Inventor: Mark P. D'Evelyn

    Abstract: A high pressure apparatus and related methods for processing supercritical fluids. In a specific embodiment, the present apparatus includes a capsule, a heater, at least one ceramic ring but can be multiple rings, optionally, with one or more scribe marks and/or cracks present. In a specific embodiment, the apparatus optionally has a metal sleeve containing each ceramic ring. The apparatus also has a high-strength enclosure, end flanges with associated insulation, and a power control system. In a specific embodiment, the apparatus is capable of accessing pressures and temperatures of 0.2-2 GPa and 400-1200° C., respectively.

    Abstract translation: 一种用于加工超临界流体的高压装置及相关方法。 在具体实施例中,本装置包括胶囊,加热器,至少一个陶瓷环,但可以是多个环,任选地,存在一个或多个划痕和/或裂纹。 在具体实施例中,该装置可选地具有包含每个陶瓷环的金属套筒。 该设备还具有高强度外壳,具有相关绝缘的端部法兰和电源控制系统。 在具体实施例中,该装置能够分别访问0.2-2GPa和400-1200℃的压力和温度。

    Flip-chip light emitting diode
    49.
    发明授权
    Flip-chip light emitting diode 失效
    倒装芯片发光二极管

    公开(公告)号:US07119372B2

    公开(公告)日:2006-10-10

    申请号:US10693126

    申请日:2003-10-24

    CPC classification number: H01L33/405 H01L33/387 H01L2933/0083

    Abstract: A flip chip light emitting diode die (10, 10′, 10″) includes a light-transmissive substrate (12, 12′, 12″) and semiconductor layers (14, 14′, 14″) that are selectively patterned to define a device mesa (30, 30′, 30″). A reflective electrode (34, 34′, 34″) is disposed on the device mesa (30, 30′, 30″). The reflective electrode (34, 34′, 34″) includes a light-transmissive insulating grid (42, 42′, 60, 80) disposed over the device mesa (30, 30′, 30″), an ohmic material (44, 44′, 44″, 62) disposed at openings of the insulating grid (42, 42′, 60, 80) and making ohmic contact with the device mesa (30, 30′, 30″), and an electrically conductive reflective film (46, 46′, 46″) disposed over the insulating grid (42, 42′, 60, 80) and the ohmic material (44, 44′, 44″, 62). The electrically conductive reflective film (46, 46′, 46″) electrically communicates with the ohmic material (44, 44′, 44″, 62).

    Abstract translation: 倒装芯片发光二极管管芯(10,10',10“)包括透光衬底(12,12',12”)和半导体层(14,14',14“),其被选择性地图案化 以限定装置台面(30,30',30“)。 反射电极(34,34',34“)设置在器件台面(30,30',30”)上。 反射电极(34,34',34“)包括设置在器件台面(30,30',30”)上方的透光绝缘栅极(42,42',60,80),欧姆材料 44,44',44“,62)设置在绝缘栅极(42,42',60,80)的开口处并与器件台面(30,30',30”)形成欧姆接触, 设置在绝缘栅极(42,42',60,80)上的导电反射膜(46,46',46“)和欧姆材料(44,44',44”,62)。 导电反射膜(46,46',46“)与欧姆材料(44,44',44”,62)电连通。

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