MODIFIED NAPHTHOL RESIN AND PREPARATION METHOD THEREOF

    公开(公告)号:US20250011527A1

    公开(公告)日:2025-01-09

    申请号:US18459456

    申请日:2023-09-01

    Abstract: A preparation method of a modified naphthol resin includes the following. A nitration reaction and a hydrogenation reaction are sequentially performed on a naphthol resin to form a modified naphthol resin with an amino group in a structure. A solvent used in the hydrogenation reaction includes tetrahydrofuran, toluene, isopropanol, an amide solvent, or an above-mentioned co-solvent.

    Method for producing plasticizer
    42.
    发明授权

    公开(公告)号:US12180332B2

    公开(公告)日:2024-12-31

    申请号:US17377531

    申请日:2021-07-16

    Abstract: A plasticizer and a method for producing the same are provided. The method for producing the plasticizer includes: reacting a reaction mixture at each of a plurality of temperature holding stages in a heating process to form a semi-finished product; and purifying the semi-finished product at each of a plurality of low pressure stages of a decompression process to obtain a plasticizer. A temperature range of the heating process is from 140° C. to 220° C., a pressure range of the decompression process is from 750 Torr to 20 Torr, and the reaction mixture contains dibasic acid (e.g., adipic acid), diol (e.g. 1,4-butanediol), monohydric alcohol (e.g., 2-ethylhexanol), and catalyst (e.g., titanium catalyst).

    RESIN COMPOSITION
    48.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240174849A1

    公开(公告)日:2024-05-30

    申请号:US18071629

    申请日:2022-11-30

    CPC classification number: C08L47/00 C08J5/244 C08J2347/00 C08J2471/12

    Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

    RESIN COMPOSITION
    50.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240158632A1

    公开(公告)日:2024-05-16

    申请号:US18074526

    申请日:2022-12-05

    CPC classification number: C08L71/123 C08L2205/03

    Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

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