公开(公告)号：US20150162509A1

公开(公告)日：2015-06-11

申请号：US14559923

申请日：2014-12-04

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Akiko YAMASAKI ,  Hirofumi ICHIKAWA ,  Yasunori SHIMIZU ,  Akihiro OTA

IPC: H01L33/56 ,  H01L33/50

CPC classification number: H01L33/56 ,  C09K11/025 ,  C09K11/7774 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device (100) according to the present disclosure includes a base substrate (10) having a recessed portion (15) at its upper surface (11); a light emitting element (20) provided in the recessed portion (15); and a sealing member (30) provided in the recessed portion (15), in which the sealing member (30) contains surface-treated particles (40), or particles (40) coexisting with a dispersing agent, and at least a part of an edge portion of the sealing member (30) is a region located in the vicinity of an edge (17) of the recessed portion, and in which at least one of the particles (40) and aggregates (41) of particles are unevenly distributed.

Abstract translation: 根据本公开的发光器件（100）包括在其上表面（11）处具有凹部（15）的基底（10）。 设置在所述凹部（15）中的发光元件（20）。 以及设置在所述凹部（15）中的密封构件（30），其中所述密封构件（30）包含表面处理颗粒（40）或与分散剂共存的颗粒（40），并且至少部分 密封构件（30）的边缘部分是位于凹部的边缘（17）附近的区域，其中颗粒（40）和颗粒聚集体（41）中的至少一个不均匀分布 。

公开(公告)号：US20150155456A1

公开(公告)日：2015-06-04

申请号：US14555197

申请日：2014-11-26

Applicant: Nichia Corporation

Inventor： Masafumi KURAMOTO ,  Shuji SHIOJI ,  Katsuyuki TSUNANO

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/46 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To provide a light emitting device that can suppress the increase in pits and projections caused by the thermal history of the reflective film on the surface of the reflective film used in the light emitting device, the light emitting device includes: a light emitting element; and a reflective film for reflecting light from the light emitting element, in which the reflective film contains silver as a principal component, and nanoparticles of an oxide.

Abstract translation: 为了提供能够抑制由于在发光器件中使用的反射膜的表面上的反射膜的热历史引起的凹坑和突起的增加的发光器件，发光器件包括：发光元件; 以及反射膜，其用于反射来自发光元件的光，其中反射膜含有银作为主要成分，并且纳米颗粒是氧化物。

公开(公告)号：US20140315338A1

公开(公告)日：2014-10-23

申请号：US14321672

申请日：2014-07-01

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohide MIKI ,  Tomoya TSUKIOKA ,  Tomohisa KISHIMOTO

IPC: H01L33/56 ,  H01L33/36 ,  H01L33/60

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract translation: 公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10） 设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40） 以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。 成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率 。

公开(公告)号：US20140110740A1

公开(公告)日：2014-04-24

申请号：US14144111

申请日：2013-12-30

Applicant: Nichia Corporation

Inventor： Masafumi KURAMOTO ,  Satoru OGAWA ,  Miki NIWA

IPC: H01L33/62 ,  H01L33/44

CPC classification number: H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, temporarily bonding the semiconductor element and the base by applying a pressure or an ultrasonic vibration to the semiconductor element or the base, and permanently bonding the semiconductor element and the base by applying heat having a temperature of 150 to 900° C. to the semiconductor device and the base.

Abstract translation: 本发明的目的是提供一种用于制造具有低电阻的导电构件的方法，并且使用不含粘合剂的低成本稳定的导电材料组合物获得导电构件。 一种制造半导体器件的方法，其中设置在基底表面上的银或氧化银和设置在半导体元件的表面上的银或银氧化物结合，包括以下步骤：将半导体元件布置在基底上，使得银 或设置在半导体元件的表面上的氧化银与设置在基板的表面上的银或氧化银接触，通过向半导体元件或基底施加压力或超声波振动来临时接合半导体元件和基座 并且通过向半导体器件和基底施加温度为150至900℃的热而将半导体元件和基底永久地接合。