公开(公告)号：US06611012B2

公开(公告)日：2003-08-26

申请号：US10050950

申请日：2002-01-22

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L25065

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10897 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US06531768B2

公开(公告)日：2003-03-11

申请号：US09951981

申请日：2001-09-14

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： H01L2324

CPC分类号： H01L21/2885 ,  H01L21/288 ,  H01L21/76802 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1369 ,  H01L2224/16105 ,  H01L2224/45124 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48

摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

摘要翻译： 在重排之前，将激光束照射到形成在电极部上的光固化树脂层上。 通过扫描在重排之前从电极部分延伸到凸块电极接触区域的金属布线形成区域的周边上的树脂被固化。 结果，形成了用作引导层的固化树脂部分和用于保护金属布线形成区域具有中空形状的金属线的保护膜。 此后，金属线形成在固化树脂部分的内部。

公开(公告)号：US5412455A

公开(公告)日：1995-05-02

申请号：US10848

申请日：1993-01-29

申请人： Kazuaki Ono ,  Koichi Tanigawa ,  Akihiko Takeuchi ,  Hajime Motoyama ,  Toshio Miyamoto

发明人： Kazuaki Ono ,  Koichi Tanigawa ,  Akihiko Takeuchi ,  Hajime Motoyama ,  Toshio Miyamoto

IPC分类号： G03G15/02

CPC分类号： G03G15/0216 ,  G03G15/0283

摘要： A charging device includes a member to be charged; a charging member, provided connectable to the member to be charged, for charging the member to be a power source for supplying the oscillating voltage to the charging member; a constant voltage element connected electrically in parallel with the portion for generating the oscillating voltage.

摘要翻译： 充电装置包括要充电的构件; 充电构件，可连接到要充电的构件，用于将构件充电成用于向充电构件提供振荡电压的电源; 与用于产生振荡电压的部分并联电连接的恒压元件。

公开(公告)号：US5202729A

公开(公告)日：1993-04-13

申请号：US783184

申请日：1991-10-28

申请人： Toshio Miyamoto ,  Yasushi Sato ,  Akihiko Takeuchi ,  Hiroshi Sasame ,  Katsuhiko Nishimura ,  Hiroto Hasegawa ,  Hideyuki Yano ,  Tatsunori Ishiyama ,  Hideo Nanataki ,  Harumi Kugoh

发明人： Toshio Miyamoto ,  Yasushi Sato ,  Akihiko Takeuchi ,  Hiroshi Sasame ,  Katsuhiko Nishimura ,  Hiroto Hasegawa ,  Hideyuki Yano ,  Tatsunori Ishiyama ,  Hideo Nanataki ,  Harumi Kugoh

IPC分类号： G03G15/09

CPC分类号： G03G15/0942 ,  G03G15/0928

摘要： A developing apparatus having a container for containing a one component developer, and a rotatable developing roller disposed facing an image bearing member to carry developer from the container to a development zone where it is supplied to an electrostatic latent image carried on an image bearing member. The developing roller includes a metal base member and a resin coating layer thereon in which fine conductive particles are dispersed. The developing roller has a surface including an end region adjacent an end of the roller, and an intermediate region. In the end region, the base member is not roughened and the resin layer is not provided. In the intermediate region, inside the end region, the base member is roughened and is coated with the resin layer. A sealing member is provided for preventing leakage of the developer from the container at the end of the developing roller, the sealing member being faced to the end region of the developing roller.

摘要翻译： 一种具有用于容纳单组分显影剂的容器的显影装置和面向图像承载部件设置以将显影剂从容器运送到显影区域的可旋转显影辊，在显影区域将其供应到承载在图像承载部件上的静电潜像。 显影辊在其上分散有导电性微粒的金属基材和树脂被覆层。 显影辊具有包括邻近辊的端部的端部区域和中间区域的表面。 在端部区域中，基材不粗化，不设置树脂层。 在中间区域中，在端部区域内部，基底部件被粗糙化并涂覆有树脂层。 提供一种密封构件，用于防止显影剂在显影辊端部从容器泄漏，密封构件面向显影辊的端部区域。

公开(公告)号：US5185496A

公开(公告)日：1993-02-09

申请号：US664227

申请日：1991-03-04

申请人： Katsuhiko Nishimura ,  Keiji Okano ,  Toshio Miyamoto ,  Tatsunori Ishiyama

发明人： Katsuhiko Nishimura ,  Keiji Okano ,  Toshio Miyamoto ,  Tatsunori Ishiyama

IPC分类号： G03G15/09

CPC分类号： G03G15/0928

摘要： An electrostatic latent image developing apparatus includes a movable developer carrying member for carrying developer to a developing zone where an electrostatic latent image on an image bearing member is developed. There is an outer coating layer on the developer carrying member wherein the coating layer is of resin in which conductive fine particles are dispersed and which is abraded.

摘要翻译： 静电潜像显影装置包括用于将显影剂携带到图像承载部件上的静电潜像被显影的显影区域的可移动显影剂承载部件。 在显影剂承载构件上存在外涂层，其中涂层是树脂，其中导电细颗粒分散并被磨损。

公开(公告)号：US5120573A

公开(公告)日：1992-06-09

申请号：US416280

申请日：1989-09-27

申请人： Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Yukio Ookoshi ,  Toshio Miyamoto ,  Mikio Aizawa ,  Kazumasa Igarashi ,  Amane Mochizuki

发明人： Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Yukio Ookoshi ,  Toshio Miyamoto ,  Mikio Aizawa ,  Kazumasa Igarashi ,  Amane Mochizuki

IPC分类号： C08G73/10 ,  H01B1/22 ,  H01B3/30 ,  H01L21/48 ,  H05K1/03

CPC分类号： H01B1/22 ,  C08G73/1007 ,  H01B3/306 ,  H01L21/481 ,  H05K1/0346 ,  H01L2224/16225

摘要： The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

公开(公告)号：US4043235A

公开(公告)日：1977-08-23

申请号：US718558

申请日：1976-08-30

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： B42C5/00 ,  B26D3/12

CPC分类号： B42C5/00 ,  Y10S83/934 ,  Y10T83/0267 ,  Y10T83/4453 ,  Y10T83/446 ,  Y10T83/4539 ,  Y10T83/707

摘要： In the process of producing brochures such as account books, textbooks, notebooks and chits, a back-splitting operation which has hitherto been performed by hand is mechanically executed in such a way that a back-splitting cutter knife is attached to a turnable chain and that the cutter knife is thrust into the back portion of sheets of paper for the brochures, whereby the productivity of the process is enhanced and a sharp reduction in the cost thereof is achieved.

摘要翻译： 在制作帐册，教科书，笔记本和小旅行的小册子的过程中，以手工执行的反向拆分操作机械地执行，使得分拆刀具被附接到可转动的链条上， 切割刀被推入用于小册子的纸张的后部，由此提高了该工艺的生产率并且实现了其成本的大幅降低。

公开(公告)号：US4023512A

公开(公告)日：1977-05-17

申请号：US610057

申请日：1975-09-13

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： D05B53/00 ,  B65H51/16 ,  D05B87/00 ,  D05B87/02 ,  D05C11/00 ,  D05C11/16 ,  D05B49/00

CPC分类号： D05B87/00 ,  D05C11/16 ,  D05D2207/04

摘要： A thread feeder for sewing machines is disclosed which feeds the thread from one of the bobbins to an automatic threading machine. It includes a movable table over the sewing machine, bobbins mounted thereon, thread tension regulators for adjusting tension to the thread from the bobbin, and feed rollers for feeding the thread from the thread tension regulator to the automatic threading device on a sewing machine. By such an arrangement, threads of different color or material can be fed conveniently one after another in a desired order.

摘要翻译： 公开了一种用于缝纫机的螺纹进给器，其将线从一个线轴馈送到自动穿线机。 它包括在缝纫机上的可移动的桌子，安装在其上的线轴，用于调节从线轴的线张力的线张力调节器，以及用于将线从线张力调节器馈送到缝纫机上的自动穿线装置的进给辊。 通过这样的布置，可以以期望的顺序一个接一个地方便地进给不同颜色或材料的丝线。

公开(公告)号：US4010702A

公开(公告)日：1977-03-08

申请号：US610058

申请日：1975-09-03

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： D05B87/00 ,  D05C11/16 ,  D05B87/02

CPC分类号： D05B87/00 ,  D05C11/16 ,  D05D2207/04

摘要： An automatic threading device for sewing machines is disclosed which can thread the needle thereon automatically. It carries with a stream of air the thread from a thread feeder through the thread take-up at standstill, guides it to the front of the needle hole, and passes it through the needle by means of a threading tool.

摘要翻译： 公开了一种缝纫机的自动穿线装置，其可以自动地将针头上针。 它带有空气流，螺纹从螺纹给料器穿过螺纹吸收器静止，将其引导到针孔的前部，并通过螺纹工具将其穿过针头。

公开(公告)号：US08629481B2

公开(公告)日：2014-01-14

申请号：US13032009

申请日：2011-02-22

申请人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

发明人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

IPC分类号： H01L23/52

CPC分类号： H01L22/32 ,  G01R31/2884 ,  G01R31/31713 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor integrated circuit device, testing pads (209b) using a conductive layer, such as relocation wiring layers (205) are provided just above or in the neighborhood of terminals like bonding pads (202b) used only for probe inspection at which bump electrodes (208) are not provided. Similar testing pads may be provided even with respect to terminals like bonding pads provided with bump electrodes. A probe test is executed by using these testing pads or under the combined use of under bump metallurgies antecedent to the formation of the bump electrodes together with the testing pads. According to the above, bump electrodes for pads dedicated for probe testing may not be added owing to the use of the testing pads. Further, the use of testing pads provided in the neighborhood of the terminals like the bonding pads and smaller in size than the under bump metallurgies enables a probe test to be executed after a relocation wiring process.

摘要翻译： 在半导体集成电路器件中，使用诸如重定位布线层（205）的导电层的测试焊盘（209b）位于仅用于探针检查的接合焊盘（202b）的正上方或附近，在这些端子处，凸起电极 （208）。 甚至可以提供类似的测试焊盘相对于诸如具有凸起电极的焊盘的端子。 通过使用这些测试垫或者在与测试垫一起形成凸块电极的组合使用底部凸点冶金来执行探针测试。 根据上述，由于使用了测试垫，因此可能不会添加专用于探针测试的焊盘的凸起电极。 此外，使用设置在诸如接合焊盘的端子附近的测试焊盘并且尺寸小于凸块下的金属，使得能够在重新定位布线处理之后执行探针测试。