公开(公告)号：US09202795B2

公开(公告)日：2015-12-01

申请号：US13530068

申请日：2012-06-21

申请人： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

发明人： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC分类号： H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  C09J7/02 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L24/27 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L23/29 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  Y10T428/2826 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00

摘要： Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s or more and 1×104 Pa·s or less.

摘要翻译： 提供一种层叠膜，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的层压膜是用于填充通过构件或连接电连接的半导体元件之间的空间的层压膜，该膜包括其中压敏粘合剂层层压在基材上的切割片和 层压在粘合剂层上的固化膜，其中固化膜在50〜200℃下的熔融粘度最低为1×102Pa·s以上且1×104Pa·s以下。

公开(公告)号：US09128238B2

公开(公告)日：2015-09-08

申请号：US13639124

申请日：2011-04-04

申请人： Tadahiro Sunaga ,  Takashi Oda ,  Hirofumi Io ,  Keisuke Kawashima ,  Yasuhiro Koike

发明人： Tadahiro Sunaga ,  Takashi Oda ,  Hirofumi Io ,  Keisuke Kawashima ,  Yasuhiro Koike

IPC分类号： C08F32/00 ,  C08F32/08 ,  G02B1/04

CPC分类号： G02B1/04 ,  C08G2261/3324 ,  C08G2261/3325 ,  C08G2261/418 ,  C08G2261/724 ,  C08L23/18

摘要： Disclosed is an optical material including a cyclic olefin copolymer containing at least a repeating structural unit [A] represented by the general formula (1) and a repeating structural unit [B] represented by the general formula (2) and having a molar ratio [A]/[B] of from 95/5 to 1/99, wherein the absolute value of the ratio ΔOB/ΔF is from 0.001 to 0.250 in which ΔOB represents the amount of a change in the absolute value of the orientation birefringence calculated from the phase difference (nm) at a wavelength of 633 nm/film thickness (μm) in a stretched film obtained from the optical material, and ΔF represents the amount of a change in the absolute value of the orientation coefficient determined from the dichroic ratio of parallel light intensity I∥ to perpendicular light intensity I⊥, each relative to the orientation direction according to Raman spectroscopy.

摘要翻译： 公开了包含至少包含由通式（1）表示的重复结构单元[A]和由通式（2）表示的重复结构单元[B]并且具有摩尔比[ A] / [B]为95/5〜1/99，其中，比率＆Dgr; OB /＆Dgr; F的绝对值为0.001〜0.250，其中Dgr; OB表示绝对值的变化量 由从光学材料获得的拉伸膜中的波长633nm /膜厚度（μm）的相位差（nm）计算出的取向双折射，＆Dgr; F表示从光学材料获得的拉伸膜中的 取向系数由平行光强度I∥的二向色度与垂直光强度I⊥确定，各自相对于根据拉曼光谱的取向方向。

公开(公告)号：US08985818B2

公开(公告)日：2015-03-24

申请号：US13508676

申请日：2010-11-26

申请人： Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

发明人： Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

IPC分类号： H05K1/03 ,  C08L27/18 ,  H01L23/373 ,  H01L33/60 ,  H01L33/64 ,  H05K3/00

CPC分类号： H05K1/0373 ,  C08L27/18 ,  H01L23/3735 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

摘要翻译： 本发明的LED安装基板包括由含有氮化硼粉末和氟树脂的组合物构成的导热层（导热片（10）），氟树脂含有聚四氟乙烯。 导热层的导热率为2W /（m·K）以上。 导热层在380nm，470nm和650nm的波长处具有0.80以上的反射率。

公开(公告)号：US20130327493A1

公开(公告)日：2013-12-12

申请号：US14000223

申请日：2012-02-27

申请人： Takashi Oda ,  Hisamune Tanaka ,  Takeshi Shiraki ,  Norio Yamamoto

发明人： Takashi Oda ,  Hisamune Tanaka ,  Takeshi Shiraki ,  Norio Yamamoto

IPC分类号： B22D7/06 ,  B22D47/00

CPC分类号： B22D7/005 ,  B22D7/06 ,  B22D7/064 ,  B22D9/006 ,  B22D11/001 ,  B22D11/0403 ,  B22D11/0406 ,  B22D11/041 ,  B22D11/055 ,  B22D11/124 ,  B22D11/1243 ,  B22D11/1245 ,  B22D11/141 ,  B22D11/147 ,  B22D21/005 ,  B22D41/015 ,  B22D47/00 ,  F27B7/00 ,  F27B14/06 ,  F27B14/0806 ,  F27B14/14 ,  F27B19/04 ,  F27B2014/008 ,  F27B2014/0812 ,  F27B2014/0818 ,  F27D3/14 ,  F27D11/12

摘要： In production of a reactive metal using a melting furnace for producing metal having a hearth, ingots can be efficiently produced by efficiently cooling the ingots extracted from the mold provided in the melting furnace. In addition, an apparatus structure in which multiple ingots can be produced with high efficiency and high quality from one hearth, is provided. A melting furnace for producing metal is provided, the furnace has a hearth for having molten metal formed by melting raw material, a mold in which the molten metal is poured, an extracting jig which is provided below the mold for extracting ingot cooled and solidified downwardly, a cooling member for cooling the ingot extracted downwardly of the mold, and an outer case for keeping the hearth, the mold, the extracting jig, and the cooling member separated from the air, wherein at least one mold and extracting jig are provided in the outer case, and the cooling member is provided between the outer case and the ingot, or between the multiple ingots.

摘要翻译： 在使用用于制造具有炉床的金属的熔炉的反应性金属的制造中，可以通过有效地冷却从设置在熔化炉中的模具中提取的锭而有效地制造锭。 此外，提供了一种可以从一个炉膛以高效率和高质量生产多个锭的装置结构。 提供了一种用于生产金属的熔化炉，炉具有一个炉底，用于熔化原材料形成的熔融金属，一个熔融金属浇注的模具，一个提取夹具，该模具设置在模具下方，用于将铸锭向下冷却和固化 ，用于冷却从模具向下抽出的铸锭的冷却部件，以及用于保持与空气分离的炉床，模具，提取夹具和冷却部件的外壳，其中至少一个模具和提取夹具设置在 外壳和冷却构件设置在外壳和锭之间，或者在多个锭之间。

公开(公告)号：US08183093B2

公开(公告)日：2012-05-22

申请号：US12732767

申请日：2010-03-26

申请人： Naoko Yoshida ,  Takashi Oda ,  Shigenori Morita

发明人： Naoko Yoshida ,  Takashi Oda ,  Shigenori Morita

IPC分类号： H01L21/00

CPC分类号： H01L24/03 ,  H01L21/6835 ,  H01L2221/68372 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.

摘要翻译： 具有至少布线部分和绝缘部分的布线电路层2，其顶表面和底表面（20A，20B）是粘合表面，以使得层2可以从金属支撑基板1上剥离的方式形成在金属支撑基板1上 基板1.暴露在布线电路层2的第一粘合面20A中的是第一连接导体部21，其与晶片状态的第一半导体元件3的电极31连接。 在将电路层2层压并连接到元件3之后，金属支撑基板1从布线电路层2剥离，得到半导体器件4.另一个元件可以连接到暴露在元件3上的另一个粘合表面20B 剥皮

公开(公告)号：US20110311835A1

公开(公告)日：2011-12-22

申请号：US13148395

申请日：2010-02-08

申请人： Kazuhiro Takahashi ,  Tomonori Kunieda ,  Kenichi Mori ,  Hiroaki Otsuka ,  Hideki Fujii ,  Yoshihiro Fujii ,  Yoshimasa Miyazaki ,  Takashi Oda ,  Hisamune Tanaka ,  Osamu Tada

发明人： Kazuhiro Takahashi ,  Tomonori Kunieda ,  Kenichi Mori ,  Hiroaki Otsuka ,  Hideki Fujii ,  Yoshihiro Fujii ,  Yoshimasa Miyazaki ,  Takashi Oda ,  Hisamune Tanaka ,  Osamu Tada

IPC分类号： B22D7/00 ,  B22D25/02 ,  B21B1/02

CPC分类号： C22B34/1295 ,  B22D11/00 ,  B22D11/041 ,  B22D11/115 ,  B22D21/005 ,  C22C14/00 ,  C22F1/183 ,  Y10T428/12229

摘要： The present invention provides a titanium slab for hot rolling which can be fed into a general purpose hot-rolling mill for producing strip coil, without passage through a breakdown process such as blooming or a straightening process, and can further suppress surface defect occurrence of the hot-rolled strip coil, and a method of producing and a method of rolling the same, characterized in that in the cast titanium slab an angle θ formed by the crystal growth direction (solidification direction) from the surface layer toward the interior and a direction parallel to the slab casting direction (longitudinal direction) is 45 to 90°, and moreover, there is a surface layer structure of 10 mm or greater whose θ is 70 to 90°, and further characterized in that a crystal grain layer of 10 mm or greater is formed whose C-axis direction inclination of a titanium a phase is, as viewed from the side of the slab to be hot rolled, in the range of 35 to 90° from the normal direction of the surface to be hot rolled. The titanium slab concerned is produced using an electron beam melting furnace by casting at an extraction rate of 1.0 cm/min or greater.

摘要翻译： 本发明提供一种用于热轧的钛板坯，其可以被供给到用于生产带状线圈的通用热轧机中，而不通过诸如起霜或矫直工艺的击穿工艺，并且可以进一步抑制 热轧带钢卷料及其制造方法及其轧制方法，其特征在于，在铸钛板坯中具有角度和角度; 由表面层朝向内部的晶体生长方向（凝固方向）和与板坯铸造方向（长度方向）平行的方向形成为45〜90°，另外，表面层结构为10mm以上 他们的 为70〜90°，进一步的特征在于，形成10mm以上的晶粒层，其中从相对于待热轧的板坯的侧面观察钛a相的C轴方向倾斜为 从要热轧的表面的法线方向的35至90°的范围。 使用电子束熔融炉，以1.0cm / min以上的萃取率进行铸造，制造有关的钛板坯。

公开(公告)号：US20110301313A1

公开(公告)日：2011-12-08

申请号：US13201973

申请日：2010-02-25

申请人： Tadahiro Sunaga ,  Takashi Oda ,  Hitoshi Onishi

发明人： Tadahiro Sunaga ,  Takashi Oda ,  Hitoshi Onishi

IPC分类号： C08F36/20 ,  B29C59/16 ,  B29C59/02 ,  B29C33/42

CPC分类号： B29C59/005 ,  B82Y10/00 ,  B82Y40/00 ,  C08G61/08 ,  C08G2261/146 ,  C08G2261/3324 ,  C08G2261/418 ,  C08L65/00 ,  G02B3/0031 ,  G03F7/0002

摘要： Provided is an imprint product, which is for transcribing a fine pattern of a mold surface and which contains a fluorine-containing cyclic olefin polymer containing repeating unit represented by formula (1) and having a fluorine atom content rate of 40% to 75% by mass.

摘要翻译： 提供了一种压印产品，其用于转印模具表面的精细图案，并且其包含含有由式（1）表示的重复单元的含氟环状烯烃聚合物，并且具有40％至75％的氟原子含量率由 质量

公开(公告)号：US20110190436A1

公开(公告)日：2011-08-04

申请号：US12738135

申请日：2008-10-15

申请人： Takashi Oda ,  Kenji Tamura

发明人： Takashi Oda ,  Kenji Tamura

IPC分类号： C08K3/22

CPC分类号： C01F7/005 ,  C01G9/00 ,  C01G51/00 ,  C01G53/00 ,  C01P2002/22 ,  C01P2002/78 ,  C08K5/0025 ,  C08K9/04 ,  C09C1/40 ,  C09J133/08

摘要： There is provided an acrylic adhesive composition which comprises: (A) a vinyl polymer comprising a homopolymer or a copolymer of an alkyl (meth)acrylate having a C4 to C14 alkyl group; (B) an organophilic layered double hydroxide organically treated with an organic anion; and (C) a crosslinking agent. Therefore the obtained adhesive composition has sufficient adhesiveness to an object, excellent heat resistance and excellent adhesive properties particularly at higher temperatures, and is substantially free from variations in adhesiveness.

摘要翻译： 提供一种丙烯酸类粘合剂组合物，其包含：（A）包含具有C 4至C 14烷基的（甲基）丙烯酸烷基酯的均聚物或共聚物的乙烯基聚合物; （B）用有机阴离子有机处理的亲有机层状双氢氧化物; 和（C）交联剂。 因此，所得粘合剂组合物对物体具有足够的粘合性，优异的耐热性和优异的粘合性，特别是在较高温度下，并且基本上没有粘合性的变化。

公开(公告)号：US07476440B2

公开(公告)日：2009-01-13

申请号：US11200049

申请日：2005-08-10

申请人： Takashi Oda ,  Yasuaki Kai ,  Tomohiro Ito

发明人： Takashi Oda ,  Yasuaki Kai ,  Tomohiro Ito

IPC分类号： B32B5/16 ,  C04B14/30

CPC分类号： C01F7/02 ,  B82Y30/00 ,  C01F7/34 ,  C01F7/448 ,  C01P2004/04 ,  C01P2004/13 ,  C01P2004/54 ,  Y10T428/257 ,  Y10T428/2982

摘要： An alumina particle (1) of the present invention has an alumina body with a short axis length (b) of 1 to 10 nm, a long axis length (a) of 20 to 400 nm and an aspect ratio (a/b) of 5 to 80. The alumina body is expressed by a Formula I, and n is not less than 0. Al2O3.nH2O  Formula I

摘要翻译： 本发明的氧化铝颗粒（1）具有短轴长（b）为1〜10nm，长轴长（a）为20〜400nm，纵横比（a / b）为 氧化铝体由式I表示，n不小于0. <？in-line-formula description =“In-line formula”end =“lead”？> Al 2 O 3·nH 2 O式I < ？in-line-formula description =“In-line Formulas”end =“tail”？>

公开(公告)号：US07476328B2

公开(公告)日：2009-01-13

申请号：US11317596

申请日：2005-12-23

申请人： Takashi Oda

发明人： Takashi Oda

IPC分类号： H01B13/00

CPC分类号： C25D5/022 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/095

摘要： A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth electrode is provided on the side opposing the AC electrode. More specifically, the printed circuit board is provided outside a sheath layer that is a region having a high plasma density generated in the vicinity of the AC electrode. The frequency of an AC power supply is preferably not more than 1 GHz. The pressure in the device is preferably in the range from 1.33×10−2 Pa to 1.33×102 Pa. The inter-electrode distance between the AC electrode and the earth electrode is preferably not more than 150 mm, more preferably from 40 mm to 100 mm.

摘要翻译： 在绝缘层上形成具有规定导电图案的印刷电路板，与设置在等离子体蚀刻装置中的AC电极间隔开大约20mm。 在与AC电极相对的一侧设置接地电极。 更具体地，印刷电路板设置在作为在交流电极附近产生的具有高等离子体密度的区域的皮层之外。 交流电源的频率优选为1GHz以下。 装置中的压力优选为1.33×10 -2 Pa〜1.33×102Pa的范围，AC电极和接地电极之间的电极间距离优选为150mm以下，更优选为40mm〜100mm 。