摘要:
A multi-layer bearing consists of a backing steel plate, a layer of Cu--Pb bearing alloy comprising, by weight, 1 to 20% of Ni and containing Pb-phase grains dispersed in the matrix, and an overlay of Pb alloy containing In. In in the overlay is diffused into the Pb-phase grains in the bearing alloy layer and forms a diffusion layer of high corrosion resistance in which In coexists with the Pb-phase grains, in an area of 30 to 200 .mu.m from the interface to the overlay. Even if the overlay is worn and the Cu--Pb bearing alloy layer is exposed, high corrosion resistance will be maintained.
摘要:
A copper-alloy slide bearing for a low-rigidity housing having a three-layer structure of a steel back-metal, a copper-alloy layer and an overlay, the back metal containing 0.03 to 0.26% by weight of carbon. During the production of the slide bearing, a bimetal is prepared in such a manner that a back-metal portion is rolled at a total rolling reduction of 10 to 35%, and the resultant bimetal is heat-treated at a relatively low temperature, so that the slide bearing includes a back metal having a 0.01% elastic limit of not less than 300 N/mm.sup.2. When the copper-alloy slide bearing is used in a low-rigidity housing of an internal combustion engine, the slide bearing is capable of more excellently following the deformation of the housing, as well as capable of providing more excellent intimate contact and more excellent fretting resistance, than a conventional multi-layer slide bearing.
摘要:
A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.
摘要:
A multilayered sliding material of lead bronze containing graphite in the form of a bimetal, comprising a steel plate or a steel plate having a copper plating coating and a sintered copper alloy bonded to the steel plate, the sintered copper alloy having a composition consisting of 5 to 16 wt % Sn, 2 to 20 wt % Pb, 0.03 to 1 wt % P, 0.5 to 3.9 wt % graphite, and the balance Cu, wherein hardness of the alloy exceeds Hv 100.
摘要:
4-Methyl-5-[(2-aminoethyl)-thiomethyl]-imidazole can be effectively produced by causing 4-methylimidazole or a salt thereof to react with at least one member selected from the group consisting of (a) a formaldehyde adduct of cysteamine, (b) 2-aminoethanethiol sulfuric acid and formaldehyde or a formaldehyde oligomer, and (c) thiazolidine or a salt thereof, in the presence of a mineral acid, removing a portion of reaction liquid out of the reaction system while maintaining molar concentration of 4-methyl-5-[(2-aminoethyl)-thiomethyl]-imidazole in the reaction system not exceeding 70 mol % based on total mol numbers of 4-methylimidazole and 4-methyl-5-[(2-aminoethyl)-thiomethyl]-imidazole, then separating a liquid containing 4-methyl-5-[(2-aminoethyl)-thiomethyl]-imidazole from the removed portion of reaction liquid, and recycling the remainder into the reaction system.
摘要:
An electrophotographic photosensitive material is disclosed. The material is comprised of a conductive support base. On the surface of the base is a photoconductive layer. On a surface of the photoconductive layer is an interlayer comprised of organic metal compound as its main component. On top of the interlayer is a low-resistant protective layer. The material can achieve electrostatic contrast greatly superior to that of conventional photosensitive materials.
摘要:
A portable cutter used to cut structural materials at a construction site. The material to be cut is clamped between a fixing rod and a bed frame and is cut by means of a grinder mounted so as to be slidable longitudinally along a machine frame. The fixing rod and the machine frame are adapted to be fastened to the bed frame.
摘要:
Provided are a light source circuit unit that improves light extraction efficiency, as well as an illuminator and a display that include such a light source circuit unit. The light source circuit unit includes: a circuit substrate having a wiring pattern on a surface thereof, the wiring pattern having light reflectivity, a circular pedestal provided on the circuit substrate, a water-repelling region provided at least from a peripheral edge portion of the pedestal to a part of a side face of the pedestal, and one or two or more light-emitting device chips mounted on the pedestal, and driven by a current that flows through the wiring pattern.
摘要:
To achieve efficient and proper transmission of an impact load from a floor frame on one side of a vehicle body to a floor frame on the other side to thereby protect a battery unit from damage, an automotive floor structure includes a first cross member upper and a first cross member lower. the first cross member upper extends in a lateral direction of the vehicle body and has ends attached to left and right side sills, respectively. The first cross member lower extends in the lateral direction below a front floor panel at a position under the first cross member upper, and has ends secured to the left and right floor frames, respectively. The first cross member upper and the first cross member lower vertically sandwich the battery unit therebetween.
摘要:
There are provided a light-source circuit unit, an illumination device, and a display device which are capable of extracting light emitted from the back surface of a light-emitting element chip to the front surface, suppressing a reduction in reflectance, and reducing cost, with a simple configuration. The light-source circuit unit includes a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.