PHASE-SEPARATED DIELECTRIC STRUCTURE FABRICATION PROCESS
    45.
    发明申请
    PHASE-SEPARATED DIELECTRIC STRUCTURE FABRICATION PROCESS 有权
    相分离电介质结构工艺

    公开(公告)号:US20080242112A1

    公开(公告)日:2008-10-02

    申请号:US11695131

    申请日:2007-04-02

    IPC分类号: H01L21/31

    摘要: A process for fabricating an electronic device including: depositing a layer comprising a semiconductor; liquid depositing a dielectric composition comprising a lower-k dielectric material, a higher-k dielectric material, and a liquid, wherein the lower-k dielectric material and the higher-k dielectric material are not phase separated prior to the liquid depositing; and causing phase separation of the lower-k dielectric material and the higher-k dielectric material to form a phase-separated dielectric structure wherein the lower-k dielectric material is in a higher concentration than the higher-k dielectric material in a region of the dielectric structure closest to the layer comprising the semiconductor, wherein the depositing the layer comprising the semiconductor is prior to the liquid depositing the dielectric composition or subsequent to the causing phase separation.

    摘要翻译: 一种制造电子器件的方法,包括:沉积包含半导体的层; 液体沉积包含低k电介质材料,较高k电介质材料和液体的电介质组合物,其中低k电介质材料和较高k电介质材料在液体沉积之前不相分离; 并引起下部k电介质材料和较高k电介质材料的相分离以形成相分离电介质结构,其中低k电介质材料的浓度高于 绝缘结构最靠近包含半导体的层,其中沉积包含半导体的层在液体沉积电介质组合物之前或之后引起相分离。

    ORGANIC THIN-FILM TRANSISTOR MANUFACTURING METHOD, ORGANIC THIN-FILM TRANSISTOR, AND ORGANIC THIN-FILM TRANSISTOR SHEET
    46.
    发明申请
    ORGANIC THIN-FILM TRANSISTOR MANUFACTURING METHOD, ORGANIC THIN-FILM TRANSISTOR, AND ORGANIC THIN-FILM TRANSISTOR SHEET 审中-公开
    有机薄膜晶体管制造方法,有机薄膜晶体管和有机薄膜晶体管片

    公开(公告)号:US20080230774A1

    公开(公告)日:2008-09-25

    申请号:US12055894

    申请日:2008-03-26

    申请人: Katsura HIRAI

    发明人: Katsura HIRAI

    IPC分类号: H01L29/08

    摘要: An organic thin-film transistor manufacturing method and an organic thin-film transistor manufactured by the method are disclosed, the method comprising the steps of a) forming a gate electrode on a substrate, b) forming a gate insulating layer on the substrate, c) forming an organic semiconductor layer on the substrate, d) forming an organic semiconductor layer protective layer on the organic semiconductor layer, e) removing a part of the organic semiconductor layer protective layer, and f) forming a source electrode and a drain electrode at portions where the organic semiconductor layer protective layer has been removed, so that the source electrode and drain electrode contacts the organic semiconductor layer.

    摘要翻译: 公开了一种通过该方法制造的有机薄膜晶体管制造方法和有机薄膜晶体管,该方法包括以下步骤:a)在衬底上形成栅电极,b)在衬底上形成栅极绝缘层,c )在所述衬底上形成有机半导体层,d)在所述有机半导体层上形成有机半导体层保护层,e)去除所述有机半导体层保护层的一部分,以及f)形成源电极和漏电极 去除了有机半导体层保护层的部分,使得源电极和漏电极接触有机半导体层。

    Organic polymers, electronic devices, and methods
    50.
    发明授权
    Organic polymers, electronic devices, and methods 失效
    有机聚合物,电子器件和方法

    公开(公告)号:US07098525B2

    公开(公告)日:2006-08-29

    申请号:US10434377

    申请日:2003-05-08

    IPC分类号: H01L23/58

    摘要: Organic polymers for use in electronic devices, wherein the polymer includes repeat units of the formula: wherein: each R1 is independently H, an aryl group, Cl, Br, I, or an organic group that includes a crosslinkable group; each R2 is independently H, an aryl group or R4; each R3 is independently H or methyl; each R5 is independently an alkyl group, a halogen, or R4; each R4 is independently an organic group that includes at least one CN group and has a molecular weight of about 30 to about 200 per CN group; and n=0–3; with the proviso that at least one repeat unit in the polymer includes an R4. These polymers are useful in electronic devices such as organic thin film transistors.

    摘要翻译: 用于电子器件的有机聚合物,其中所述聚合物包括下式的重复单元:其中:每个R 1独立地为H,芳基,Cl,Br,I或包括 可交联基团; 每个R 2独立地为H,芳基或R 4; 每个R 3独立地为H或甲基; 每个R 5独立地是烷基,卤素或R 4; 每个R 4独立地是包含至少一个CN基团并且具有每个CN基团约30至约200的分子量的有机基团; 并且n = 0-3; 条件是聚合物中至少一个重复单元包括R 4。 这些聚合物可用于诸如有机薄膜晶体管的电子器件中。