Abstract:
A method for interconnecting two circuit boards includes positioning corresponding shielded land areas on circuit boards, the land areas including conductive core areas and conductive outer areas around the core areas. A block-like signal array is positioned between the first and second circuit boards, the signal array includes shielded conductors with axial and outer conductive elements. A first compressible interface element including a layer of insulating material having a plurality of conductive elements extending through the insulating material layer is postioned intermediate the shielded land area and the signal array. A second compressible interface element is positioned intermediate the shielded land areas on the other circuit board and the other end of the signal array. The two circuit boards are fastened together to compress the respective compressible interface elements between the signal array and the circuit boards for electrically coupling the circuit boards.
Abstract:
A method and apparatus for providing compressive connection with electrostatic discharge dissipative properties is disclosed. A compression connector is formed having an elastomeric material modified to provide a dissipative member, an electrostatically dissipative base member, and a connection to a ground to dissipate the charge generated when tension is applied to or released from the elastomer.
Abstract:
A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive layers and a plurality of insulating layers alternately placed along the length of the conductive element. The conductive element is placed between the edge of the circuit board having the conductive traces and a clasp prior to inserting the circuit board into the clasp. The conductive element is conformed between the circuit board and the clasp. Each conductive trace contacts a conductive layer as a result of the insertion. The backstop conforms an extending portion of the conductive element to be substantially perpendicular to the circuit board. The assembled device can be used to provide charge to a plurality of electrodes on a substrate simultaneously.
Abstract:
A second anisotropic electroconductive sheet 1 has a structure in which third elastomer regions 1B, each of which is electroconductive so as to enable current to flow between the front and the back thereof, are formed on an insulating second elastomer sheet 1A. An anisotropic electroconductive sheet 2 has a structure in which first elastomer regions 2B and second elastomer regions 3B, each of which is electroconductive so as to enable current to flow between the front and the back thereof, are formed on an insulating elastomer sheet 2A. The first elastomer regions 2B are arranged so as to match up with the third elastomer regions 1B. Furthermore, wiring patterns 2C are formed on the elastomer sheet 2A for connecting the first elastomer regions 2B and the second elastomer regions 3B. The second anisotropic electroconductive sheet 1 and the anisotropic electroconductive sheet 2 are layered one upon the other such that the third elastomer regions 1B and the first elastomer regions 2B are in contact with each other.
Abstract:
A connector or connector assembly having a signal array having at least one shielded conductor having opposite ends and including an axial conductive element and an outer conductive element surrounding the axial conductive element and a compressible interface element positioned at least one of the opposite ends of the signal array, the interface element including a layer of insulating material having a plurality of conductive elements extending through the insulating material layer. When compressed between the signal array and a signal bearing component, the compressible interface element maintains the geometric arrangement of the axial conductive element and the outer conductive element to the signal bearing component. A connector assembly may include a circuit board including land areas arranged in a shielded configuration, and corresponding to the shielded land areas on the component and a second compressible interface element. The compressible interface element is coupled between the circuit board and the shielded conductor to pass a signal from the shielded conductor to the land area on the second circuit board.
Abstract:
An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.
Abstract:
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.
Abstract:
A compliant contact pin assembly and a contactor card are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
Abstract:
A compliant contact pin assembly method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
Abstract:
A printhead assembly is provided comprising at least one printhead module comprising at least two printhead integrated circuits, each of which has nozzles formed therein for delivering printing fluid onto the surface of print media, and a support member supporting and carrying the printing fluid for the at least two printhead integrated circuits, and a casing in which the at least one printhead module is removably mounted so as to constrain movement of the at least one printhead module relative to the casing in at least the direction of printing fluid delivery from the nozzles to the print media.