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1.发明申请公开(公告)号：US20060261340A1
公开(公告)日：2006-11-23
申请号：US11494453
申请日：2006-07-28
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L29/04 , H01L33/00 , H01L29/768 , H01L27/148 , H01L31/0203
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。
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公开(公告)号：US20060113682A1
公开(公告)日：2006-06-01
申请号：US11333662
申请日：2006-01-17
申请人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
发明人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
CPC分类号： H01L21/561 , B33Y70/00 , B33Y80/00 , H01L21/563 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2221/68331 , H01L2224/02372 , H01L2224/0401 , H01L2224/05111 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/13005 , H01L2224/13006 , H01L2224/13009 , H01L2224/13024 , H01L2224/13099 , H01L2224/16145 , H01L2224/73204 , H01L2224/97 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06596 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/18161 , H01L2924/19015 , H01L2924/19041 , H01L2924/351 , H01L2924/207 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.
摘要翻译： 半导体部件包括基模和层叠在基模上的二次模。 基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。 该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。 该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板 终端接触。 一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。
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公开(公告)号：US20050275084A1
公开(公告)日：2005-12-15
申请号：US11152513
申请日：2005-06-14
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R1/073 , H01L21/66 , H01L23/48 , H01L23/498 , H01L23/58 , H01R13/24 , H05K3/32 , H05K3/40 , H05K7/06 , H05K7/10
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译： 提供了柔性接触销组件和接触器卡系统。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。
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4.发明申请公开(公告)号：US20050275048A1
公开(公告)日：2005-12-15
申请号：US10867352
申请日：2004-06-14
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L21/00 , H01L23/02 , H01L23/48 , H01L27/14 , H01L27/146 , H01L31/00 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。
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公开(公告)号：US20050194180A1
公开(公告)日：2005-09-08
申请号：US10791195
申请日：2004-03-02
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R1/073 , H01L21/66 , H01L23/48 , H01L23/498 , H01L23/58 , H01R13/24 , H05K3/32 , H05K3/40 , H05K7/06 , H05K7/10
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译： 提供了兼容的接触针组件，接触器卡，测试系统以及制造和测试方法。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料并且在另一个实施例中通过柔性柔性部分的基底。
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公开(公告)号：US20050233482A1
公开(公告)日：2005-10-20
申请号：US11152433
申请日：2005-06-14
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R1/073 , H01L21/66 , H01L23/48 , H01L23/498 , H01L23/58 , H01R13/24 , H05K3/32 , H05K3/40 , H05K7/06 , H05K7/10
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin contactor card method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译： 提供一种兼容的接触针接触器卡制造方法。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。
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7.发明申请公开(公告)号：US20070132104A1
公开(公告)日：2007-06-14
申请号：US11701927
申请日：2007-02-02
申请人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
发明人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
CPC分类号： H01L21/561 , B33Y70/00 , B33Y80/00 , H01L21/563 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2221/68331 , H01L2224/02372 , H01L2224/0401 , H01L2224/05111 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/13005 , H01L2224/13006 , H01L2224/13009 , H01L2224/13024 , H01L2224/13099 , H01L2224/16145 , H01L2224/73204 , H01L2224/97 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06596 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/18161 , H01L2924/19015 , H01L2924/19041 , H01L2924/351 , H01L2924/207 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.
摘要翻译： 半导体部件包括基模和层叠在基模上的二次模。 基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。 该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。 该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板 终端接触。 一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。
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公开(公告)号：US20060244475A1
公开(公告)日：2006-11-02
申请号：US11477217
申请日：2006-06-29
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R31/26
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译： 提供了一种柔性接触销组件和接触器卡以及用于测试的方法。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。
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公开(公告)号：US20060011809A1
公开(公告)日：2006-01-19
申请号：US10894262
申请日：2004-07-19
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
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公开(公告)号：US20050275083A1
公开(公告)日：2005-12-15
申请号：US11151923
申请日：2005-06-14
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R1/073 , H01L21/66 , H01L23/48 , H01L23/498 , H01L23/58 , H01R13/24 , H05K3/32 , H05K3/40 , H05K7/06 , H05K7/10
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
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