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    High power light emitting diode package
    51.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE43200E1

    公开(公告)日：2012-02-21

    申请号：US12029220

    申请日：2008-02-11

    Applicant: Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    Inventor： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC: H01L33/00 ,  H01L29/22 ,  H01L23/48

    CPC classification number: H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    Abstract translation: 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

    Chip coated light emitting diode package and manufacturing method thereof
    52.
    发明授权
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US08013352B2

    公开(公告)日：2011-09-06

    申请号：US12684614

    申请日：2010-01-08

    Applicant: Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    Inventor： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC: H01L33/00

    CPC classification number: H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    Abstract translation: 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    LED package
    53.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US07683470B2

    公开(公告)日：2010-03-23

    申请号：US11709154

    申请日：2007-02-22

    Applicant: Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    Inventor： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    IPC: H01L33/00 ,  H01L21/00

    CPC classification number: H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

    Abstract: A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

    Abstract translation: 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。

    LED housing and fabrication method thereof
    54.
    发明授权
    LED housing and fabrication method thereof 有权
    LED外壳及其制造方法

    公开(公告)号：US07678592B2

    公开(公告)日：2010-03-16

    申请号：US11680847

    申请日：2007-03-01

    Applicant: Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    Inventor： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    IPC: H01L21/00

    CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

    Abstract: In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

    Abstract translation: 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。

    LED PACKAGE
    55.
    发明申请
    LED PACKAGE 有权
    LED封装

    公开(公告)号：US20100047937A1

    公开(公告)日：2010-02-25

    申请号：US12612334

    申请日：2009-11-04

    Applicant: Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    Inventor： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    IPC: H01L21/50

    CPC classification number: H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

    Abstract: A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

    Abstract translation: 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。

    High power light emitting diode package and fabrication method thereof
    56.
    发明授权
    High power light emitting diode package and fabrication method thereof 失效
    大功率发光二极管封装及其制造方法

    公开(公告)号：US07663199B2

    公开(公告)日：2010-02-16

    申请号：US11442414

    申请日：2006-05-30

    Applicant: Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Young Jae Song ,  Young Sam Park ,  Chang Ho Song

    Inventor： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Young Jae Song ,  Young Sam Park ,  Chang Ho Song

    IPC: H01L29/78

    CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.

    Abstract translation: 本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部 导热部件和引线部分。 导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。 本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

    Light emitting diode package with diffuser and method of manufacturing the same
    57.
    发明授权
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US07501656B2

    公开(公告)日：2009-03-10

    申请号：US11491947

    申请日：2006-07-25

    Applicant: Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    Inventor： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC classification number: H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    Abstract translation: 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    LED package
    59.
    发明申请
    LED package 审中-公开
    LED封装

    公开(公告)号：US20080179616A1

    公开(公告)日：2008-07-31

    申请号：US12007371

    申请日：2008-01-09

    Applicant: Seon Goo Lee ,  Geun Chang Ryo ,  Yong Tae Kim ,  Young Jae Song

    Inventor： Seon Goo Lee ,  Geun Chang Ryo ,  Yong Tae Kim ,  Young Jae Song

    IPC: H01L33/00

    CPC classification number: H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: There is provided an LED package. An LED package according to an aspect of the invention includes a package body including a concave part formed as a mounting section, first and second lead frames mounted to the package body to be exposed at a lower surface of the concave part, an LED chip mounted to the lower surface of the concave part to be electrically connected to the first and second lead frames, and an encapsulant formed by mixing transparent resin and a phosphor and formed inside the concave part to encapsulate the LED chip. Here, a height from an upper surface of the LED chip and an upper surface of the encapsulant is 1 to 5 times larger than that of the LED chip.

    Abstract translation: 提供了一个LED封装。 根据本发明的一个LED封装包括：封装体，包括形成为安装部分的凹部;安装到封装体上的第一和第二引线框，以暴露在凹部的下表面; LED芯片， 到与第一引线框架和第二引线框架电连接的凹部的下表面，以及通过将透明树脂和荧光体混合形成并形成在凹部内部以封装LED芯片的密封剂。 这里，从LED芯片的上表面和密封剂的上表面的高度是LED芯片的1〜5倍。

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