公开(公告)号：US20090045502A1

公开(公告)日：2009-02-19

申请号：US11838917

申请日：2007-08-15

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Edmund J. Sprogis

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Edmund J. Sprogis

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L23/3157 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor chip scale package formed with through-vias, which can be either isolated or electrically connected to a substrate, and a method of producing the semiconductor chip scale package with through-vias, which can be isolated or electrically connected to the substrate.

Abstract translation: 形成有可以与衬底隔离或电连接的通孔形成的半导体芯片级封装，以及可以隔离或电连接到衬底的具有通孔的半导体芯片级封装的制造方法。

公开(公告)号：US07491992B2

公开(公告)日：2009-02-17

申请号：US11619024

申请日：2007-01-02

Applicant: James W. Adkisson ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Richard J. Rassel ,  Jeffrey P. Gambino

Inventor： James W. Adkisson ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Richard J. Rassel ,  Jeffrey P. Gambino

IPC: H01L31/62 ,  H01L31/113

CPC classification number: H01L27/14609 ,  H01L27/1463 ,  H01L27/14641 ,  H01L27/14643 ,  H01L31/035281

Abstract: A structure (and method for forming the same) for an image sensor cell. The method includes providing a semiconductor substrate. Then, a charge collection well is formed in the semiconductor substrate, the charge collection well comprising dopants of a first doping polarity. Next, a surface pinning layer is formed in the charge collection well, the surface pinning layer comprising dopants of a second doping polarity opposite to the first doping polarity. Then, an electrically conductive push electrode is formed in direct physical contact with the surface pinning layer but not in direct physical contact with the charge collection well. Then, a transfer transistor is formed on the semiconductor substrate. The transfer transistor includes first and second source/drain regions and a channel region. The first and second source/drain regions comprise dopants of the first doping polarity. The first source/drain region is in direct physical contact with the charge collection well.

Abstract translation: 用于图像传感器单元的结构（及其形成方法）。 该方法包括提供半导体衬底。 然后，在半导体衬底中形成电荷收集阱，电荷收集阱包含第一掺杂极性的掺杂剂。 接下来，在电荷收集阱中形成表面钉扎层，表面钉扎层包括与第一掺杂极性相反的第二掺杂极性的掺杂剂。 然后，导电的推动电极形成为与表面钉扎层直接物理接触，但不与电荷收集阱直接物理接触。 然后，在半导体衬底上形成传输晶体管。 传输晶体管包括第一和第二源极/漏极区域和沟道区域。 第一和第二源/漏区包括第一掺杂极性的掺杂剂。 第一源极/漏极区域与电荷收集阱直接物理接触。

公开(公告)号：US20090001427A1

公开(公告)日：2009-01-01

申请号：US11770843

申请日：2007-06-29

Applicant: James W. Adkisson ,  John J. Ellis-Monaghan ,  Jeffrey P. Gambino ,  Mark D. Jaffe

Inventor： James W. Adkisson ,  John J. Ellis-Monaghan ,  Jeffrey P. Gambino ,  Mark D. Jaffe

IPC: H01L27/148 ,  H01L31/113 ,  H01L31/18

CPC classification number: H01L27/14689 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14643

Abstract: A pixel sensor structure, method of manufacture and method of operating. Disclosed is a buffer pixel cell comprising a barrier region for preventing stray charge carriers from arriving at a dark current correction pixel cell. The buffer pixel cell is located in the vicinity of the dark current correction pixel cell and the buffer pixel cell resembles an active pixel cell. Thus, an environment surrounding the dark current correction pixel cell is similar to the environment surrounding an active pixel cell.

Abstract translation: 像素传感器结构，制造方法和操作方法。 公开了一种缓冲像素单元，其包括用于防止杂散电荷载流子到达暗电流校正像素单元的阻挡区域。 缓冲像素单元位于暗电流校正像素单元附近，并且缓冲像素单元类似于有源像素单元。 因此，围绕暗电流校正像素单元的环境与有源像素单元周围的环境相似。

公开(公告)号：US20080088014A1

公开(公告)日：2008-04-17

申请号：US11528227

申请日：2006-09-26

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Stephen E. Luce ,  Richard J. Rassel ,  Edmund J. Sprogis

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Stephen E. Luce ,  Richard J. Rassel ,  Edmund J. Sprogis

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L27/14618 ,  H01L25/0657 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An imaging system for use in a digital camera or cell phone utilizes one chip for logic and one chip for image processing. The chips are interconnected using around-the-edge or through via conductors extending from bond pads on the active surface of the imaging chip to backside metallurgy on the imaging chip. The backside metallurgy of the imaging chip is connected to metallurgy on the active surface of the logic chip using an array of solder bumps in BGA fashion. The interconnection arrangement provides a CSP which matches the space constraints of a cell phone, for example. The arrangement also utilizes minimal wire lengths for reduced noise. Connection of the CSP to a carrier package may be either by conductive through vias or wire bonding. The CSP is such that the imaging chip may readily be mounted across an aperture in the wall of a cell phone, for example, so as to expose the light sensitive pixels on the active surface of said imaging chip to light.

Abstract translation: 用于数码相机或手机的成像系统利用一个芯片用于逻辑和一个芯片用于图像处理。 这些芯片使用围绕成像芯片的有源表面上的接合焊盘的边缘或通孔导体互连，从而在成像芯片上进行背面冶金。 成像芯片的背面冶金采用BGA焊料凸块阵列与逻辑芯片的有源表面上的冶金连接。 互连装置提供例如与手机的空间限制相匹配的CSP。 该布置还利用最小的线长度来降低噪声。 将CSP连接到载体封装可以通过通孔或引线键合导电。 CSP使得成像芯片可以容易地安装在例如手机的壁中的孔之间，以便将所述成像芯片的有效表面上的光敏像素曝光到光。

公开(公告)号：US07193289B2

公开(公告)日：2007-03-20

申请号：US10904807

申请日：2004-11-30

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Anthony K. Stamper

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Anthony K. Stamper

IPC: H01L27/14

CPC classification number: H01L27/14685 ,  H01L21/76819 ,  H01L21/76834 ,  H01L21/76838 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14687

Abstract: An image sensor array and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack with improved thickness uniformity to result in a pixel array exhibiting increased light sensitivity. In the sensor array, each Cu metallization level includes a Cu metal wire structure formed at locations between each array pixel and, a barrier material layer is formed on top each Cu metal wire structure that traverses the pixel optical path. By implementing a single mask or self-aligned mask methodology, a single etch is conducted to completely remove the interlevel dielectric and barrier layers that traverse the optical path. The etched opening is then refilled with dielectric material. Prior to depositing the refill dielectric, a layer of either reflective or absorptive material is formed along the sidewalls of the etched opening to improve sensitivity of the pixels by either reflecting light to the underlying photodiode or by eliminating light reflections.

Abstract translation: 一种图像传感器阵列和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合更薄的层间电介质叠层，改进的厚度均匀性，以产生呈现增加的光敏度的像素阵列。 在传感器阵列中，每个Cu金属化层包括在每个阵列像素之间的位置处形成的Cu金属线结构，并且阻挡材料层形成在穿过像素光路的每个Cu金属线结构上。 通过实现单掩模或自对准掩模方法，进行单次蚀刻以完全去除穿过光路的层间电介质层和阻挡层。 然后将蚀刻的开口用电介质材料重新填充。 在沉积再充填电介质之前，沿蚀刻开口的侧壁形成反射或吸收材料层，以通过将光反射到下面的光电二极管或通过消除光反射来提高像素的灵敏度。

公开(公告)号：US09543356B2

公开(公告)日：2017-01-10

申请号：US12538194

申请日：2009-08-10

Applicant: Jeffrey P. Gambino ,  Mark D. Jaffe ,  John Ellis-Monaghan ,  Richard Rassel

Inventor： Jeffrey P. Gambino ,  Mark D. Jaffe ,  John Ellis-Monaghan ,  Richard Rassel

IPC: H01L27/148 ,  H01L27/146

CPC classification number: H01L27/14689 ,  H01L27/14609 ,  H01L27/14623 ,  H01L27/1464

Abstract: CMOS image sensor pixel sensor cells, methods for fabricating the pixel sensor cells and design structures for fabricating the pixel sensor cells are designed to allow for back side illumination in global shutter mode by providing light shielding from back side illumination of at least one transistor within the pixel sensor cells. In a first particular generalized embodiment, a light shielding layer is located and formed interposed between a first semiconductor layer that includes a photoactive region and a second semiconductor layer that includes the at least a second transistor, or a floating diffusion, that is shielded by the light blocking layer. In a second generalized embodiment, a thin film transistor and a metal-insulator-metal capacitor are used in place of a floating diffusion, and located shielded in a dielectric isolated metallization stack over a carrier substrate.

Abstract translation: CMOS图像传感器像素传感器单元，用于制造像素传感器单元的方法和用于制造像素传感器单元的设计结构被设计成允许在全局快门模式中进行背面照明，通过提供来自至少一个晶体管的背侧照明的光屏蔽 像素传感器单元。 在第一特定广义实施例中，遮光层位于包括光活性区的第一半导体层和包括至少第二晶体管的第二半导体层之间并形成，或者浮置扩散部被屏蔽 遮光层。 在第二广义实施例中，使用薄膜晶体管和金属 - 绝缘体 - 金属电容器来代替浮动扩散，并且被定位在载体衬底上的介电隔离金属化堆叠中。

公开(公告)号：US08796130B2

公开(公告)日：2014-08-05

申请号：US13352851

申请日：2012-01-18

Applicant: Jeffrey P. Gambino ,  Russell T. Herrin ,  Mark D. Jaffe ,  Laura J. Schutz

Inventor： Jeffrey P. Gambino ,  Russell T. Herrin ,  Mark D. Jaffe ,  Laura J. Schutz

IPC: H01L21/3205

CPC classification number: H01L21/823842 ,  H01L21/28052

Abstract: A method patterns a polysilicon gate over two immediately adjacent, opposite polarity transistor devices. The method patterns a mask over the polysilicon gate. The mask has an opening in a location where the opposite polarity transistor devices abut one another. The method then removes some (a portion) of the polysilicon gate through the opening to form at least a partial recess (or potentially a complete opening) in the polysilicon gate. The recess separates the polysilicon gate into a first polysilicon gate and a second polysilicon gate. After forming the recess, the method dopes the first polysilicon gate using a first polarity dopant and dopes the second polysilicon gate using a second polarity dopant having an opposite polarity of the first polarity dopant.

Abstract translation: 一种在两个紧邻的相反极性的晶体管器件上形成多晶硅栅极的方法。 该方法在多晶硅栅极上形成掩模。 掩模在相反极性晶体管器件彼此邻接的位置处具有开口。 然后，该方法通过开口去除多晶硅栅极的一些（一部分），以在多晶硅栅极中形成至少一个部分凹槽（或潜在的完整开口）。 凹槽将多晶硅栅极分离成第一多晶硅栅极和第二多晶硅栅极。 在形成凹槽之后，该方法使用第一极性掺杂剂掺杂第一多晶硅栅极，并使用具有与第一极性掺杂剂相反极性的第二极性掺杂剂掺杂第二多晶硅栅极。

公开(公告)号：US08741739B2

公开(公告)日：2014-06-03

申请号：US13342697

申请日：2012-01-03

Applicant: Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph

Inventor： Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph

IPC: H01L21/30

CPC classification number: H01L29/16 ,  H01L21/76254

Abstract: A semiconductor structure and a method of forming the same. In one embodiment, a method of forming a silicon-on-insulator (SOI) wafer substrate includes: providing a handle substrate; forming a high resistivity material layer over the handle substrate, the high resistivity material layer including one of an amorphous silicon carbide (SiC), a polycrystalline SiC, an amorphous diamond, or a polycrystalline diamond; forming an insulator layer over the high resistivity material layer; and bonding a donor wafer to a top surface of the insulator layer to form the SOI wafer substrate.

Abstract translation: 半导体结构及其形成方法。 在一个实施例中，形成绝缘体上硅（SOI）晶片衬底的方法包括：提供处理衬底; 在所述手柄衬底上形成高电阻率材料层，所述高电阻率材料层包括非晶碳化硅（SiC），多晶SiC，无定形金刚石或多晶金刚石中的一种; 在所述高电阻率材料层上形成绝缘体层; 并将施主晶片接合到绝缘体层的顶表面以形成SOI晶片衬底。

公开(公告)号：US08729664B2

公开(公告)日：2014-05-20

申请号：US13437273

申请日：2012-04-02

Applicant: Jeffrey P. Gambino ,  Mark D. Jaffe ,  Mark D. Levy ,  John C. Malinowski

Inventor： Jeffrey P. Gambino ,  Mark D. Jaffe ,  Mark D. Levy ,  John C. Malinowski

IPC: H01L29/15 ,  H01L23/52 ,  H01L29/47 ,  H01L27/095

CPC classification number: H01L29/0619 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit chip comprising a guard ring formed on a semiconductor substrate that surrounds the active region of the integrated circuit chip and extends from the semiconductor substrate through one or more of a plurality of wiring levels. The guard ring comprises stacked metal lines with spaces breaking up each respective metal line. Each space may be formed such that it partially overlies the space in the metal line directly below but does not overlie any other space. Alternatively, each space may also be formed such that each space is at least completely overlying the space in the metal line below it.

Abstract translation: 一种集成电路芯片，包括形成在半导体衬底上的保护环，所述保护环围绕所述集成电路芯片的有源区并从所述半导体衬底延伸穿过多个布线层中的一个或多个。 保护环包括堆叠金属线，空间分开各个金属线。 每个空间可以被形成为使得其部分地覆盖金属线中的空间直接在下方，但不覆盖任何其它空间。 或者，每个空间也可以形成为使得每个空间至少完全覆盖在其下面的金属线中的空间。

公开(公告)号：US08723392B2

公开(公告)日：2014-05-13

申请号：US13183977

申请日：2011-07-15

Applicant: James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Anthony K. Stamper ,  Randy L. Wolf

Inventor： James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Anthony K. Stamper ,  Randy L. Wolf

IPC: H03H9/25

CPC classification number: H03H9/14538 ,  H03H3/08

Abstract: Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate; a planar barrier layer disposed above the piezoelectric substrate, and at least one conductor buried in the piezoelectric substrate and the planar barrier layer.

Abstract translation: 本文公开了一种表面声波（SAW）滤波器及其制造方法。 SAW滤波器包括压电基片; 设置在所述压电基板上方的平面阻挡层，以及埋设在所述压电基板和所述平面阻挡层中的至少一个导体。