利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

116 条记录 (耗时 0.038 秒)

    Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling
    52.
    发明申请
    Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling 失效
    在有机基板中提取和应用电路特征的方法，用于自动化变形建模

    公开(公告)号：US20090313588A1

    公开(公告)日：2009-12-17

    申请号：US12260957

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G06F17/50

    CPC分类号： H05K3/0005 ,  H05K1/0271 ,  H05K2201/09136

    摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.

    摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。

    Characterizing Thermomechanical Properties of an Organic Substrate Using Three-Dimensional Finite Element Analysis
    53.
    发明申请
    Characterizing Thermomechanical Properties of an Organic Substrate Using Three-Dimensional Finite Element Analysis 有权
    使用三维有限元分析表征有机基板的热机械性能

    公开(公告)号：US20090312960A1

    公开(公告)日：2009-12-17

    申请号：US12260718

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Vijaveshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Vijaveshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G01N25/16 ,  G06F19/00 ,  G01L1/00

    CPC分类号： G06F17/5018 ,  G06F2217/80

    摘要： A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.

    摘要翻译： 用于表征有机衬底的热机械性质的方法包括以下步骤：接收衬底的图像，该图像包括衬底的电路层的几何描述; 选择给定的一个电路层进行处理; 将图像转换成给定电路层的2-D FEM图像; 重复选择给定的一个电路层并将该图像转换成所选层的2-D FEM图像，直到所有层已经被处理的步骤; 组合对应于层的所有2-D FEM图像以形成表示基板的至少一部分的3-D FEM图像; 确定3-D FEM图像的热膨胀系数（CTE），模量和/或泊松比; 以及根据3-D FEM图像的CTE，模数和/或泊松比来构造衬底的3-D表示。

    Insulin related transcription factor and uses thereof
    54.
    发明授权
    Insulin related transcription factor and uses thereof 失效
    胰岛素相关转录因子及其用途

    公开(公告)号：US07524492B2

    公开(公告)日：2009-04-28

    申请号：US10232563

    申请日：2002-08-30

    申请人： Arun Sharma

    发明人： Arun Sharma

    IPC分类号： A61K48/00 ,  C12N15/00 ,  C12N5/00 ,  C12N5/02

    CPC分类号： C07K14/705

    摘要： The invention provides isolated mMafA polypeptides, nucleic acids, vectors and host cells containing them, which encode a novel insulin related transcription factor. Diagnostic methods, methods of selecting and differentiating insulin-producing cells, and methods of treatment utilizing compositions of the invention are also provided.

    摘要翻译： 本发明提供了分离的mMafA多肽，核酸，载体和含有它们的宿主细胞，其编码新的胰岛素相关转录因子。 还提供诊断方法，选择和区分胰岛素产生细胞的方法，以及利用本发明组合物的治疗方法。

    Extended read range RFID system
    55.
    发明授权
    Extended read range RFID system 有权
    扩展阅读范围RFID系统

    公开(公告)号：US07515049B2

    公开(公告)日：2009-04-07

    申请号：US11449084

    申请日：2006-06-08

    申请人： Arun Sharma ,  Daniel Fritschen ,  Daniel Liu ,  Norma Riley

    发明人： Arun Sharma ,  Daniel Fritschen ,  Daniel Liu ,  Norma Riley

    IPC分类号： G08B13/14

    CPC分类号： G06K7/0008 ,  G06K7/10178

    摘要： The present invention generally comprises an apparatus that allows an RFID antenna to obtain information from an RFID tag mounted on a container. The apparatus reproduces the RF field generated by the antenna to a location proximate to the RFID tag. In one embodiment, the apparatus comprises a pickup device and a reproduction device electrically coupled with the pickup device. In another embodiment, the apparatus comprises at least one magnetic rod, which creates a magnetic path for the RF field to travel between the antenna and the RFID tag. In another embodiment, the apparatus comprises a pickup antenna and a reproduction antenna for transmitting the RF signal from the antenna proximate to the RFID tag.

    摘要翻译： 本发明通常包括允许RFID天线从安装在容器上的RFID标签获取信息的装置。 该装置将由天线产生的RF场再现到靠近RFID标签的位置。 在一个实施例中，该装置包括拾取装置和与拾取装置电耦合的再现装置。 在另一个实施例中，该装置包括至少一个磁棒，其产生用于RF场在天线和RFID标签之间行进的磁路。 在另一个实施例中，该装置包括拾取天线和用于从靠近RFID标签的天线发送RF信号的再现天线。

    METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT
    59.
    发明申请
    METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT 失效
    用于实时估算和预测微处理器单元热状态的方法和系统

    公开(公告)号：US20080215283A1

    公开(公告)日：2008-09-04

    申请号：US12021242

    申请日：2008-01-28

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Arun Sharma

    IPC分类号： G01K13/00

    CPC分类号： G06F1/206

    摘要： An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.

    摘要翻译： 一种用于预测包括半导体芯片的系统的热状态的装置包括形成在半导体芯片上的用于测量半导体芯片的第一位置处的温度的多个传感器，用于开发用于估计第二位置处的温度的模型的模型显影器 所述半导体芯片不同于所述第一位置，映射单元，用于将与所述芯片相关联的指令高速缓存到热分组的XY分布量子序列中;以及预测单元，用于基于所述芯片的未来温度预测 执行指令缓存中的指令流。