公开(公告)号：US20210058308A1

公开(公告)日：2021-02-25

申请号：US17015479

申请日：2020-09-09

Applicant: Intel Corporation

Inventor： Matthew Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael Crocker

IPC: H04L12/26 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L12/24 ,  H04L12/931 ,  H04L12/947 ,  H04L29/08 ,  H04L29/06 ,  H04Q11/00 ,  H05K7/14

Abstract: Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

公开(公告)号：US10922148B2

公开(公告)日：2021-02-16

申请号：US16091206

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Myles Wilde ,  William R. Wheeler ,  Michael F. Fallon ,  Aaron Gorius ,  Amit Kumar ,  Chengda Yang

IPC: G06F9/54 ,  G06F9/451 ,  G06F9/445 ,  G06F13/12 ,  G06F13/38 ,  G06F9/48 ,  G06F13/362 ,  G06F13/42

Abstract: Techniques for implementing assess to Android applications and native Window application on Android devices and systems. A processor board includes a processor that is configured to run a full version of a Windows operating system and Windows applications. The processor board is configured to be communicatively coupled to the processor board in an Android device, such as a Smartphone or tablet. Upon operations and when the processor board is communicatively coupled to the Android device, a user of the Android device is enabled to selectively run Android applications and Windows applications, with the Windows applications being executed natively on the processor board. The processor board may be implemented in a computing card that is approximately the size of a credit card or smaller, which in turn may be coupled to the Android device via a backpack or similar means. The processor board may also be disposed within the same housing as the Android device.

公开(公告)号：US10788630B2

公开(公告)日：2020-09-29

申请号：US15396041

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  H04Q11/00 ,  G06F1/20 ,  H04W4/80 ,  G06F1/18 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/38 ,  G06F9/4401 ,  G06F9/50 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04 ,  G08C17/02 ,  G11C7/10 ,  G11C11/56 ,  H03M7/30 ,  H03M7/40 ,  H04B10/25 ,  H04L12/24 ,  H04L12/26 ,  H04L12/851 ,  H04L12/811 ,  H04L12/931 ,  H04L29/08 ,  H04L29/06 ,  H05K5/02 ,  H05K7/14 ,  H04L12/911 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947

Abstract: Technologies for blind mating of optical connectors in a rack of a data center are disclosed. In the illustrative embodiment, a sled can be slid into a rack and an optical connector on the sled will blindly mate with a corresponding optical connector on the rack. The illustrative optical connector on the sled includes two guide post receivers which mate with corresponding guide posts on the optical connector on the rack such that, when mated, optical fibers of the optical connector on the rack will be aligned and optically coupled with corresponding optical fibers on the optical connector of the sled.

公开(公告)号：US10757487B2

公开(公告)日：2020-08-25

申请号：US15396151

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Mohan J. Kumar ,  Murugasamy K. Nachimuthu ,  Aaron Gorius ,  Michael Crocker

IPC: G06F9/46 ,  H04Q11/00 ,  G06F1/20 ,  G06F16/901 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/38 ,  G06F9/4401 ,  G06F9/50 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04B10/25 ,  H04L12/24 ,  H04L12/26 ,  H04L12/851 ,  H04L12/811 ,  H04L12/931 ,  H04L29/08 ,  H04L29/06 ,  H05K5/02 ,  H05K7/14 ,  H04L12/911 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04

Abstract: Examples may include techniques to allocate physical accelerator resources from pools of accelerator resources. In particular, virtual computing devices can be composed from physical resources and physical accelerator resources dynamically allocated to the virtual computing devices. The present disclosure provides that physical accelerator resources can be dynamically allocated, or composed, to a virtual computing device despite not being physically coupled to other components in the virtual device.

公开(公告)号：US10674238B2

公开(公告)日：2020-06-02

申请号：US15423467

申请日：2017-02-02

Applicant: INTEL CORPORATION

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K1/02 ,  G06F1/20 ,  H04Q11/00 ,  H03M7/30 ,  H03M7/40 ,  G06F16/901 ,  G06F3/06 ,  H04L12/811 ,  G11C7/10 ,  H05K7/14 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  G06F9/50 ,  H04L12/911 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  G06F9/30 ,  G06F9/38 ,  G06F9/54 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04

Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.

公开(公告)号：US10541941B2

公开(公告)日：2020-01-21

申请号：US15947028

申请日：2018-04-06

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04L12/933 ,  H05K7/14 ,  H04B1/40 ,  H04L12/931 ,  H04L29/08

Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

公开(公告)号：US10374726B2

公开(公告)日：2019-08-06

申请号：US15874499

申请日：2018-01-18

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04B10/80 ,  H01P3/10 ,  H01P5/00 ,  H04B10/40 ,  H01P5/02 ,  H04B1/40 ,  H04B10/90 ,  H04L12/931 ,  H04Q11/00 ,  H04B3/52 ,  H04B5/00

Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

公开(公告)号：US10365708B2

公开(公告)日：2019-07-30

申请号：US15379283

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Simon N. Peffers ,  Sean M. Gulley ,  Thomas L. Dmukauskas ,  Aaron Gorius ,  Vinodh Gopal

IPC: G06F11/24 ,  G06F1/3296 ,  G01R31/28 ,  G06F1/324 ,  G06F1/3206

Abstract: Methods and apparatuses related to guardband recovery using in situ characterization are disclosed. In one example, a system includes a target circuit, a voltage regulator to provide a variable voltage to, a phase-locked loop (PLL) to provide a variable clock to, and a temperature sensor to sense a temperature of the target circuit, and a control circuit, wherein the control circuit is to set up a characterization environment by setting a temperature, voltage, clock frequency, and workload of the target circuit, execute a plurality of tests on the target circuit, when the target circuit passes the plurality of tests, adjust the variable voltage to increase a likelihood of the target circuit failing the plurality of tests and repeat the plurality of tests, and when the target circuit fails the plurality of tests, adjust the variable voltage to decrease a likelihood of the target circuit failing the plurality of tests.

公开(公告)号：US10348327B2

公开(公告)日：2019-07-09

申请号：US15396652

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/14 ,  H03M7/30 ,  H03M7/40 ,  G06F3/06 ,  G11C7/10 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  H04Q11/00 ,  G06F9/50 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  G06F17/30 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/911 ,  H04L12/811 ,  H04W4/80 ,  H04L12/781 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04 ,  H04L12/933 ,  H04L12/947

Abstract: A rack for supporting sleds includes a pair of elongated support posts and pairs of elongated support arms that extend from the elongated support posts. Each pair of the elongated support arms defines a sled slot to receive a corresponding sled. A power supply is attached to an elongated support arm of each pair of elongated support arms to provide power to a corresponding sled. The power supply may include a chassis-less circuit board substrate that is removable from a power supply housing coupled to the corresponding elongated support arm.

公开(公告)号：US20190065112A1

公开(公告)日：2019-02-28

申请号：US15859364

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Mark A. Schmisseur ,  Aaron Gorius

IPC: G06F3/06

Abstract: Technologies for utilizing a split memory pool include a compute sled. The compute sled includes multiple processors communicatively coupled together through a processor communication link. Each processor is to communicate with a different memory sled through a respective memory network dedicated to the corresponding processor and memory sled. The compute sled includes a compute engine to generate a memory access request to access a memory address in far memory. The far memory includes memory located on one of the memory sleds. The compute engine is also to determine, as a function of the memory address and a map of memory address ranges to the memory sleds, the memory sled on which to access the far memory, and send the memory access request to the determined memory sled to access the far memory associated with the memory address.