摘要:
A plasma processing method is arranged to supply a predetermined process gas into a plasma generation space in which a target substrate is placed, and turn the process gas into plasma. The substrate is subjected to a predetermined plasma process by this plasma. The spatial distribution of density of the plasma and the spatial distribution of density of radicals in the plasma are controlled independently of each other relative to the substrate by a facing portion opposite the substrate to form a predetermined process state over the entire target surface of the substrate.
摘要:
A rear portion structure (100) of a motorcycle (1) comprises a chassis frame (5); a rear wheel (17) positioned below the rear portion of the chassis frame (5); a fender main body portion (110) anchored to the rear portion of the chassis frame (5) and positioned above the rear wheel (17); a fender hanging portion (120) configured separately from the fender main body portion (110) and covering at least a portion of the rear wheel (17); and a support stay (130) anchored to the rear end portion of the chassis frame (5) (rear end frame portion (5a), extending aft approximately horizontally from the rear end portion, and supporting the fender hanging portion (120).
摘要:
A cowling structure includes a head pipe mounted to the front of a body frame, a steering gear held such that it is capable of pivoting about the axis of the head pipe, side cowls each arranged at the transverse outside of the body frame, together with an opening so formed in each side cowl that it communicates with the transverse outside and inside of each side cowl. When viewed in a side view, the side cowls are lengthened up to the fore of the head pipe, and the opening is in such a position that it is level with the head pipe and overlaps with the steering gear in the fore of the head pipe. Such cowling structure permits less damages to the external appearance while providing the improvement in the lightness of banking at the time in the early stage of turning of a vehicle body.
摘要:
To provide a fluid control apparatus capable of reducing the space, while reducing the cost.A fluid control apparatus 1 has a fluid controlling unit 2 and a fluid introducing unit 3. The fluid introducing unit 3 is divided into three parts: a first and a second inlet-side shutoff/open parts 5, 6 disposed on the inlet side, each made up of 2×N/2 on-off valves 23, and a fluid controlling unit-side shutoff/open part 7 made up of 4×M on-off valves 23, disposed between the first and second inlet-side shutoff/open parts 5, 6 and the fluid controlling unit 2.
摘要:
A plasma processing apparatus includes a process container configured to have a vacuum atmosphere therein. A first upper electrode is disposed to have a ring shape and to face a target substrate placed within the process container. A second upper electrode is disposed radially inside the first upper electrode and electrically insulated therefrom. A first electric feeder is configured to supply a first RF output from a first RF power supply to the first upper electrode at a first power value. A second electric feeder branches from the first electric feeder and is configured to supply the first RF output from the first RF power supply to the second upper electrode at a second power value smaller than the first power value.
摘要:
A focus ring and a plasma processing apparatus capable of improving an in-surface uniformity of a surface and reducing occurrences of deposition on a backside surface of a peripheral portion of a semiconductor wafer compared to a conventional case are provided. Installed in a vacuum chamber is a susceptor for mounting the semiconductor wafer thereon and a focus ring is installed to surround the semiconductor wafer mounted on the susceptor. The focus ring includes an annular lower member made of a dielectric, and an annular upper member made of a conductive material and mounted on the lower member. The upper member includes a flat portion which is an outer peripheral portion having a top surface positioned higher than a surface to be processed of the semiconductor wafer W, and an inclined portion which is an inner peripheral portion inclined inwardly.
摘要:
A vacuum process system comprises: a load port on which an object to be processed is set; a common transfer chamber disposed adjacent to the load port, having an internal space set at an atmospheric pressure level, and including a first transfer device that is movable and transfers the object into/from the load port, the first transfer device being disposed within the internal space; and a process unit having one process chamber for subjecting the object to a predetermined process, and a vacuum transfer chamber connected to the process chamber, having an internal space set at a vacuum pressure level, and including a second transfer device for transferring the object into/from the process chamber, the second transfer device being disposed within the internal space. The process units are individually connected to the common transfer chamber such that the process units are substantially parallel to each other. The vacuum chamber of each process unit is connected to the common transfer chamber. Each process unit extends linearly in a direction substantially perpendicular to the common transfer chamber. The object is transferred into/from the vacuum transfer chamber by means of the first transfer device.
摘要:
A plasma processing apparatus includes a process container configured to have a vacuum atmosphere therein. An upper electrode is disposed to face a target substrate placed within the process container. An electric feeder includes a first cylindrical conductive member continuously connected to the upper electrode in an annular direction. The electric feeder is configured to supply a first RF output from a first RF power supply to the upper electrode.
摘要:
The present invention provides glass compositions that can be used instead of known glass compositions containing a large amount of PbO in applications such as coating ceramic substrates, e.g., alumina, or sealing fluorescent tubes or the like. The invention also provides glass forming materials containing the glass compositions as a primary component for glass formation. Glass compositions provided by the present invention are comprises essentially of primary oxide components. The primary oxide components include ZnO, B2O3 and P2O5 as essential components and Al2O3, MgO, CaO and BaO as optional components. The amount of the primary oxide components is 85 wt % or more (preferably 90 wt % or more) of the total weight of the glass composition. Typically, the primary oxide components include 45 to 80% of ZnO, 5 to 45% of B2O3, 1 to 35% of P2O5, 0 to 10% of Al2O3, 0 to 15% of MgO, 0 to 10% of CaO, and 0 to 5% of BaO.
摘要:
An eccentric orbiting type speed reducer for the joint of the industrial machine has a plurality of crankshafts, a rotational driving force being input into one crankshaft alone among the plurality of crankshafts, in which the bearing capacity for one crankshaft among the plurality of crankshafts is greater than the bearing capacities for other crankshafts.