公开(公告)号：US20050040846A1

公开(公告)日：2005-02-24

申请号：US10898874

申请日：2004-07-26

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H01P3/02 ,  G08C19/00 ,  H01P5/02 ,  H01P5/08 ,  H03K17/041 ,  H03K19/0175 ,  H04B3/02 ,  H04L25/02 ,  H04L25/08 ,  H03K19/003

CPC分类号： H04L25/08 ,  H03K17/04106

摘要： To transmit a high-speed digital signal of several tens GHz via a differential line by connecting a differential line referring to the ground to differential lines not referring to the ground, there is provided a signal transmission system which transmits a digital signal between circuit blocks via a signal transmission line, each of the circuit blocks basically including a functional circuit, a reception/transmission circuit formed separately from the functional circuit and an impedance-matched transmission line (115) formed between reception and transmission ends of the reception/transmission circuit; a differential line (105) referring to the ground (110), led out from a differential output driver, being formed from differential signal lines disposed symmetrically with respect to the ground (110) in the circuit block, only differential pair lines (111, 112) not referring to the ground being extended directly from the differential signal lines disposed symmetrically with respect to the ground in the signal transmission line (115).

摘要翻译： 通过将差分线连接到不涉及地面的差分线，通过差分线路传输数十GHz的高速数字信号，提供了一种信号传输系统，其通过电路块之间的数字信号经由 信号传输线，每个电路块基本上包括功能电路，与功能电路分开形成的接收/发送电路和形成在接收/发送电路的接收和发送端之间的阻抗匹配传输线路（115）; 从差分输出驱动器引出的对地（110）的差分线（105）由相对于电路块中的接地（110）对称设置的差分信号线形成，仅差分对线（111， 112），而不是直接从在信号传输线路（115）中相对于地面对称设置的差动信号线延伸的地面。

公开(公告)号：US06731153B2

公开(公告)日：2004-05-04

申请号：US09963500

申请日：2001-09-27

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K1704

CPC分类号： H03K19/01707

摘要： A CMOS line driver is made up of p- and nMOS transistors. A pMOS varactor is interposed between the source of the pMOS transistor and a power supply, while an nMOS varactor is interposed between the source of the nMOS transistor and ground. The sizes of each of these MOS varactors may be the same as those of the p- or nMOS transistor. Alternatively, each of these MOS varactors may have a channel area twice greater than that of the p- or nMOS transistor. The inverted version of a signal input to the line driver is supplied to the gates of the MOS varactors. In this manner, the MOS transistors, making up the line driver, can switch at a high speed.

摘要翻译： CMOS线路驱动器由p-和nMOS晶体管组成。 pMOS变容二极管介于pMOS晶体管的源极和电源之间，而nMOS变容二极管插在nMOS晶体管的源极和地之间。 这些MOS可变电抗器的尺寸可以与p型或nMOS晶体管的尺寸相同。 或者，这些MOS变容二极管中的每一个可以具有比p型或nMOS晶体管的沟道面积的两倍的沟道面积。 将输入到线路驱动器的信号的反相形式提供给MOS可变电抗器的栅极。 以这种方式，构成线路驱动器的MOS晶体管可以高速切换。

公开(公告)号：US06522173B1

公开(公告)日：2003-02-18

申请号：US09280652

申请日：1999-03-29

申请人： Kanji Otsuka

发明人： Kanji Otsuka

IPC分类号： H01P308

CPC分类号： H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0237 ,  H01L2924/00

摘要： An electronic device includes a wiring board, and at least one pair of signal lines that is provided on the wiring board in parallel and has an equal length. A chip is mounted on the wiring board and includes at least one differential driver which outputs complementary digital transmit signals to said at least one of lines. A pair of power system lines is provided to supply first and second power supply voltages to the above-mentioned at least one differential driver. The power system lines are parallel to each other and have an equal length.

公开(公告)号：US06373275B1

公开(公告)日：2002-04-16

申请号：US09456303

申请日：1999-12-08

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K19003

CPC分类号： H01L24/49 ,  G06F13/4086 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic device which improves speed of signal transmission in a bus wiring system by specifying circuit configuration of a driver circuit and transmission line characteristic impedance. An input/output circuit combines a differential driver of current switch type with a bus wiring system having a transmission line for transmitting a differential complementary digital signal and a termination end resistor matching the transmission line. An integrated circuit chip including the differential driver is mounted on a wiring board including the transmission line and the termination end resistor. The transmission line includes wires having an equal length which have characteristic impedance of 25&OHgr; or less. In combination with the current switch type differential driver, this transmission line structure restricts attenuation of signal energy during transmission and restricts electromagnetic interference between transmission lines close to each other.

摘要翻译： 一种通过指定驱动电路的电路结构和传输线特性阻抗来提高总线布线系统中的信号传输速度的电子设备。 输入/输出电路将电流开关类型的差分驱动器与具有传输差分互补数字信号的传输线的总线布线系统和匹配传输线的终端电阻相结合。 包括差分驱动器的集成电路芯片安装在包括传输线和端接电阻器的布线板上。 传输线包括具有等于25MEGA或更小的特征阻抗的具有相同长度的导线。 结合当前的开关式差分驱动器，该传输线结构限制了传输期间信号能量的衰减，并限制了彼此靠近的传输线之间的电磁干扰。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5304844A

公开(公告)日：1994-04-19

申请号：US889397

申请日：1992-05-28

申请人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

发明人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L23/49527 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107

摘要： A semiconductor device is provided having a semiconductor pellet that is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base. External terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, as well as inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.

摘要翻译： 提供一种半导体器件，其具有半导体芯片，该半导体芯片布置在薄膜基座的大致中央部分，金属板上覆盖有绝缘构件，而内部引线设置在薄膜基座的周边部分处于 它们与膜基底的金属板电隔离。 用于半导体芯片的外部端子和薄膜基座的金属板的中间部分之间的电源的外部端子以及金属板的内部引线和外围部分之间的用于电源的内部引线被电连接 的接合线。

公开(公告)号：US5258649A

公开(公告)日：1993-11-02

申请号：US918137

申请日：1992-07-23

申请人： Akira Tanaka ,  Kazuji Yamada ,  Tadahiko Miyoshi ,  Kanji Otsuka

发明人： Akira Tanaka ,  Kazuji Yamada ,  Tadahiko Miyoshi ,  Kanji Otsuka

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H05K3/32 ,  H01L23/02 ,  H01L23/48

CPC分类号： H05K3/325 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49833 ,  H01L2224/16245 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1815

摘要： A silicon chip is mounted on a portion a heat dissipation body, and a carrier film is inserted into a resin composition material. Each of input/output electrode portions of the silicon chip is connected electrically to each of lead wires of the carrier film. The electrical connection between the silicon chip and a circuit substrate is carried out by the carrier film. Another portion of the heat dissipation body is exposed on a surface of the resin composition material. A fixing means for fixing the resin composition material is formed integrally to the resin composition material or to the heat dissipation body. The resin composition material is fixed to a circuit substrate through the fixing means. The mechanical fixing between the resin composition material and the circuit substrate is carried out by the fixing means, which is separate from the carrier film. A heat dissipation fin may be provided on the heat dissipation body.

摘要翻译： 将硅芯片安装在散热体的一部分上，并将载体膜插入到树脂组合物材料中。 硅芯片的每个输入/输出电极部分电连接到载体膜的每个引线上。 硅芯片和电路基板之间的电连接由载体膜进行。 散热体的另一部分露出在树脂组合物材料的表面上。 用于固定树脂组合物材料的固定装置与树脂组合物材料或散热体一体地形成。 树脂组合物材料通过固定装置固定到电路基板。 树脂组合物材料和电路基板之间的机械固定由与载体膜分开的固定装置进行。 散热片可以设置在散热体上。

公开(公告)号：US5234866A

公开(公告)日：1993-08-10

申请号：US863060

申请日：1992-04-03

申请人： Takayuki Okinaga ,  Hiroshi Tachi ,  Hiroshi Ozaki ,  Kanji Otsuka ,  Michiaki Furukawa ,  Yasuyuki Yamasaki

发明人： Takayuki Okinaga ,  Hiroshi Tachi ,  Hiroshi Ozaki ,  Kanji Otsuka ,  Michiaki Furukawa ,  Yasuyuki Yamasaki

IPC分类号： H01L21/58 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49586 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121

摘要： According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

摘要翻译： 根据本发明，通过在芯片的电路形成面上或靠近主非易失性存储器的电路形成面上或其附近扩散引线，可以实现在树脂密封半导体器件中内封装树脂与内包层树脂的密合性的提高， 颗粒的电路形成面，以延伸颗粒上或下方的内引线的长度。

公开(公告)号：US08508046B2

公开(公告)日：2013-08-13

申请号：US13371323

申请日：2012-02-10

申请人： Masao Sakuma ,  Kanji Otsuka

发明人： Masao Sakuma ,  Kanji Otsuka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC分类号： H01L24/49 ,  H01L22/22 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/06164 ,  H01L2224/13 ,  H01L2224/13007 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2224/32225 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099

摘要： A circuit substrate is presented. The circuit substrate comprises internal terminal electrode 2; a substrate 1; a wiring layer 21 formed on a portion of the surface of the substrate and having one end thereof connected to the internal terminal electrode; an insulating film contacting as a surface with the wiring layer; and an external terminal electrode 9 connected to the other end of the wiring layer and used for connecting to the exterior. The angle of the cross-section of the wiring layer taken perpendicularly to the surface of the substrate in the edge portion that the wiring layer contains is 55° (55 degree) or less, and the wiring layer that contains multiple mutually independent columnar crystals extending perpendicularly in a direction different from the direction of the surface of the substrate.

摘要翻译： 呈现电路基板。 电路基板包括内部端子电极2; 基板1; 形成在基板表面的一部分并且其一端连接到内部端子电极的布线层21; 与布线层作为表面接触的绝缘膜; 以及连接到布线层的另一端并用于连接到外部的外部端子电极9。 在布线层所包含的边缘部分中垂直于基板表面的布线层的横截面角为55°（55度）以下，并且包含多个相互独立的柱状晶体的布线层延伸 垂直于不同于衬底表面方向的方向。

公开(公告)号：US08373072B2

公开(公告)日：2013-02-12

申请号：US12501931

申请日：2009-07-13

申请人： Daisuke Iguchi ,  Kanji Otsuka ,  Yutaka Akiyama

发明人： Daisuke Iguchi ,  Kanji Otsuka ,  Yutaka Akiyama

IPC分类号： H05K1/03

CPC分类号： H05K9/0084 ,  H05K1/0218 ,  H05K1/0234 ,  H05K1/167 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/09309

摘要： A printed circuit board includes a ground layer, a power source layer, a signal wiring layer, an insulating layer and an electromagnetic radiation suppressing member. The power source layer is provided to be opposed to the ground layer. The signal wiring layer transmits a signal in a predetermined frequency domain. The insulating layer insulates the ground layer, the power source layer and the signal wiring layer from one another. The electromagnetic radiation suppressing member is provided to cover a circumferential edge of the insulating layer. The electromagnetic radiation suppressing member has a negative dielectric constant and a positive magnetic permeability in a frequency domain including the predetermined frequency domain.

摘要翻译： 印刷电路板包括接地层，电源层，信号布线层，绝缘层和电磁辐射抑制构件。 电源层设置成与接地层相对。 信号布线层发送预定频域的信号。 绝缘层使接地层，电源层和信号布线层彼此绝缘。 电磁辐射抑制构件被设置成覆盖绝缘层的周缘。 电磁辐射抑制构件在包括预定频域的频域中具有负介电常数和正磁导率。