公开(公告)号：US07144629B2

公开(公告)日：2006-12-05

申请号：US10446695

申请日：2003-05-29

申请人： Kenji Itoh

发明人： Kenji Itoh

IPC分类号： B32B9/00

CPC分类号： C04B41/85 ,  C03C17/3441 ,  C03C17/3488 ,  C03C17/42 ,  C04B41/5001 ,  C04B41/52 ,  C04B41/89 ,  C23C16/26 ,  C23C16/509 ,  H01L31/02161 ,  Y10S427/103 ,  Y10S427/104 ,  Y10T428/12931 ,  Y10T428/24983 ,  Y10T428/30

摘要： An abrasion-proof and static-erasing coating is formed on the contact surface of a contact image sensor. The coating comprises a first film having a high hardness and a low conductivity, a second film formed on the first film and having a low hardness and a high conductivity, and a third film having a high hardness and a high resistivity providing an abrasion-proof insulating external surface.

公开(公告)号：US20060191604A1

公开(公告)日：2006-08-31

申请号：US10564721

申请日：2004-07-20

申请人： Kenji Itoh ,  Keijiro Hayashi ,  Toru Iwanaga

发明人： Kenji Itoh ,  Keijiro Hayashi ,  Toru Iwanaga

IPC分类号： C22C37/04

CPC分类号： C22C37/04 ,  C22C37/08 ,  F01N13/16 ,  F01N2530/02

摘要： A heat-resistant, austenitic spheroidal graphite cast iron has a composition comprising 1-4.5% by weight of Mo, and 0.001-0.5% by weight of Sn and/or Sb as (2Sn+Sb). It preferably has a composition comprising 1-3.5% of C, 1-6.5% of Si, 3% or less of Cr, 10-40% of Ni, 1-4.5% of Mo, 0.001-0.5% of Sn and/or Sb as (2Sn+Sb), and 0.1% or less of a graphite-spheroidizing element, on a weight basis.

摘要翻译： 耐热奥氏体球墨铸铁具有包含1-4.5重量％的Mo和0.001-0.5重量％的作为（2Sn + Sb）的Sn和/或Sb的组成。 其优选具有包含1-3.5％的C，1-6.5％的Si，3％或更少的Cr，10-40％的Ni，1-4.5％的Mo，0.001-0.5％的Sn和/或 Sb为（2Sn + Sb），0.1％以下的石墨球化元素。

公开(公告)号：US20050179136A1

公开(公告)日：2005-08-18

申请号：US11108638

申请日：2005-04-19

申请人： Takatoshi Katsura ,  Kenji Itoh ,  Hiroaki Nagano ,  Youji Isota ,  Mitsuhiro Shimozawa ,  Tadashi Takagi ,  Noriharu Suematsu ,  Masayoshi Ono ,  Kenichi Maeda

发明人： Takatoshi Katsura ,  Kenji Itoh ,  Hiroaki Nagano ,  Youji Isota ,  Mitsuhiro Shimozawa ,  Tadashi Takagi ,  Noriharu Suematsu ,  Masayoshi Ono ,  Kenichi Maeda

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/538 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H03H3/00 ,  H03H7/01 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K9/00

CPC分类号： H05K1/0216 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/552 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/15312 ,  H01L2924/3011 ,  H03H3/00 ,  H03H7/01 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/141 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09972 ,  H01L2924/00

摘要： In a multi-layer substrate module receiving from an external earth node (20) supply of a reference potential (Vss) for grounding, a plurality of ground lines (170-1, 170-2, 170-3) are provided respectively corresponding to a plurality of internal circuits (210, 220, 230). Moreover, a common node (Ncmn) for coupling the ground lines (170-1, 170-2, 170-3) is provided in an insulating layer (105C) of the multi-layer substrate module. The common node (Ncmn) is electrically coupled to the earth node 20 through a ground pin terminal 204 shared by the plurality of internal circuits (210, 220, 230). Preferably, the common node (Ncmn) is provided in the lowest insulating layer of the multi-layer substrate module. Thus, parasitic inductance of the portion through which an earth current flows, that is, the portion common to the plurality of internal circuits (210, 220, 230), can be suppressed with a small number of ground pin terminals. Accordingly, the inflow phenomenon of the earth current between the plurality of internal circuits (210, 220, 230) is prevented, enabling stable operation.

摘要翻译： 在从外部接地节点（20）接收用于接地的参考电位（Vss）的多层衬底模块中，分别提供多个接地线（170-1,170-2,170-3），其对应于 多个内部电路（210,220,230）。 此外，用于耦合接地线（170-1,170-2,170-3）的公共节点（Ncmn）设置在多层衬底模块的绝缘层（105C）中。 公共节点（Ncmn）通过由多个内部电路（210,220,230）共享的接地引脚端子204电耦合到接地节点20。 优选地，公共节点（Ncmn）设置在多层基板模块的最低绝缘层中。 因此，可以用少量的接地引脚端子来抑制接地电流流过的部分的寄生电感，即多个内部电路（210,220,230）共同的部分的寄生电感。 因此，防止了多个内部电路（210,220,230）之间的接地电流的流入现象，从而能够稳定地工作。

公开(公告)号：US20050161798A1

公开(公告)日：2005-07-28

申请号：US10509689

申请日：2002-07-24

申请人： Keiji Ninomiya ,  Kenji Itoh ,  Hiroyuki Joba

发明人： Keiji Ninomiya ,  Kenji Itoh ,  Hiroyuki Joba

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a semiconductor device and, more particularly, has for its object to provide a technique for improving the performance of a semiconductor device having a ground terminal and a plurality of signal terminals arranged around the ground terminal. To attain the object, the present invention features isolation between a ground terminal (5, 35) connected to a functional block (11) and a ground terminal (6, 36) connected to a functional block (12). Thus, a ground potential applied to one of the functional blocks through the corresponding ground terminal is prevented from varying depending on the magnitude of a current flowing through the other functional block. This improves the performance of each functional block to improve the performance of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，更具体地说，本发明的目的是提供一种用于提高具有接地端子和布置在接地端子周围的多个信号端子的半导体器件的性能的技术。 为了实现该目的，本发明的特征在于连接到功能块（11）的接地端子（5,35）与连接到功能块（12）的接地端子（6,36）之间的隔离。 因此，防止通过对应的接地端子施加到功能块之一的接地电位根据流过另一个功能块的电流的大小而变化。 这提高了每个功能块的性能，以提高半导体器件的性能。

公开(公告)号：US06553647B1

公开(公告)日：2003-04-29

申请号：US09630861

申请日：2000-08-02

申请人： Kenji Itoh ,  Hiroyasu Tsuchida ,  Tatsushi Yoshida ,  Yoskio Uematsu ,  Tetsuji Ono

发明人： Kenji Itoh ,  Hiroyasu Tsuchida ,  Tatsushi Yoshida ,  Yoskio Uematsu ,  Tetsuji Ono

IPC分类号： G11B5127

CPC分类号： G11B5/486 ,  G11B5/4806 ,  Y10T29/49002 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49179 ,  Y10T29/49181 ,  Y10T29/49192

摘要： A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.

摘要翻译： 接线头悬挂组件的方法包括固定将多根电线装在悬挂组件上的管，以及将从固定管延伸的电线固定在悬架上，同时使它们到达悬架的顶侧。 悬架具有带有第一和第二框架的接片框架。 引导到悬架的顶侧的每根导线被接合到凸片框架的第二框架上。 从电线的每个连接部分去除绝缘膜，以将电线连接到滑块的相应连接焊盘。 第一框架基本上垂直于悬架弯曲，并且第二框架基本上垂直于第一框架弯曲，从而将绑定到第二框架的线定位在滑块上的连接垫上。 然后将电线超声波焊接到滑块上的各个连接焊盘。

公开(公告)号：US06493189B1

公开(公告)日：2002-12-10

申请号：US09560325

申请日：2000-04-28

申请人： Kenji Itoh ,  Yasuhiro Mita ,  Masaaki Nanba ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Yasuhiro Mita ,  Masaaki Nanba ,  Tatsushi Yoshida

IPC分类号： G11B548

CPC分类号： G11B5/486 ,  Y10T29/4903

摘要： A head gimbal assembly is provided with a slider that flies above the surface of a disk, and a head for reading/writing data from/onto the surface of the disk. One or more conductive wires are connected to the head and are used to transmit data. A load beam supports the wire(s) thereon and holds the head/slider near a front end of the load beam. Each wire forms a wire loop between the head connecting point edge and the wire fixing point. A predetermined portion of each wire loop is pressed from above on the surface of the load beam, and then pushed toward the head connecting point edge, thereby plastically deforming a section between the head connecting point edge and the predetermined portion of the wire loop.

摘要翻译： 头部万向节组件设置有在盘的表面上方飞行的滑块，以及用于从/从盘的表面读取/写入数据的头部。 一个或多个导线连接到头部并用于传输数据。 负载梁支撑其上的线，并将头/滑块保持在负载梁的前端附近。 每个线在头连接点边缘和线固定点之间形成线环。 每个线环的预定部分从负载梁的表面上方按压，然后被推向头部连接点边缘，从而使头部连接点边缘和线环的预定部分之间的部分塑性变形。

公开(公告)号：US06461968B1

公开(公告)日：2002-10-08

申请号：US09362994

申请日：1999-07-30

申请人： Motohiro Toyota ,  Kenji Itoh

发明人： Motohiro Toyota ,  Kenji Itoh

IPC分类号： H01L21461

CPC分类号： H01L21/02071 ,  C23F4/00 ,  H01L21/32136 ,  H01L21/32137 ,  H01L29/66765 ,  H01L29/78609 ,  H01L29/78669 ,  H01L29/78696

摘要： A method for fabricating a semiconductor device including a semiconductor layer structure, a source electrode and, a drain electrode formed on the semiconductor layer structure, and a source interconnection connected to the source electrode is provided. The method includes the steps of: (a) forming the semiconductor layer structure on a substrate; (b) forming a metal layer structure so as to cover the semiconductor layer structure; (c) forming a resist layer having a predetermined pattern on the metal layer structure: (d) performing a first etching process for the metal layer structure using the resist layer as a mask so as to form the source electrode, the drain electrode and the source interconnection; and (e) performing a second etching process for the semiconductor layer structure using the resist layer as a mask so as to form a transistor gap portion between the source electrode and the drain electrode. The respective first and second etching processes in the steps (d) and (e) are performed using the same resist layer as the mask in the same chamber.

摘要翻译： 提供一种制造半导体器件的方法，该半导体器件包括形成在半导体层结构上的半导体层结构，源电极和漏电极以及与源极连接的源极互连。 该方法包括以下步骤：（a）在衬底上形成半导体层结构; （b）形成金属层结构以覆盖半导体层结构; （c）在金属层结构上形成具有预定图案的抗蚀剂层：（d）使用抗蚀剂层作为掩模对金属层结构进行第一蚀刻处理，以形成源电极，漏电极和 源互连; 以及（e）使用所述抗蚀剂层作为掩模对所述半导体层结构进行第二蚀刻处理，以在所述源电极和所述漏电极之间形成晶体管间隙部分。 步骤（d）和（e）中的相应的第一和第二蚀刻工艺使用与同一腔室中的掩模相同的抗蚀剂层进行。

公开(公告)号：US6093225A

公开(公告)日：2000-07-25

申请号：US419977

申请日：1999-10-18

申请人： Kenji Itoh

发明人： Kenji Itoh

IPC分类号： B24D3/02 ,  B24D3/14 ,  B24D3/28 ,  B24D5/04 ,  B24D7/04 ,  B24D18/00 ,  B24D3/18 ,  B24D3/34 ,  B24D17/00

CPC分类号： B24D3/28 ,  B24D18/0027 ,  B24D5/04 ,  B24D7/04

摘要： An abrasive vitreous bonded solid mass having a vitrified abrasive structure comprising abrasive grains which are held together by an inorganic bonding agent, the abrasive structure is impregnated with a composition which comprises a thermosetting synthetic resin and a surfactant. The abrasive solid mass is manufactured by preparing the composition including the resin and the surfactant, impregnating the vitrified abrasive structure with the composition, and curing the composition.

摘要翻译： 具有玻璃化磨料结构的磨料玻璃态粘合固体块，其包含由无机粘合剂保持在一起的磨粒，所述研磨结构用包含热固性合成树脂和表面活性剂的组合物浸渍。 通过制备包括树脂和表面活性剂的组合物，用组合物浸渍玻璃化研磨结构并固化组合物来制造磨料固体物质。

公开(公告)号：US5784881A

公开(公告)日：1998-07-28

申请号：US782491

申请日：1997-01-10

申请人： Koki Otsuka ,  Kenji Itoh

发明人： Koki Otsuka ,  Kenji Itoh

IPC分类号： F01N13/10 ,  F01N13/18 ,  F01N7/00

CPC分类号： F01N13/1811 ,  F01N13/10 ,  F01N2260/10

摘要： An exhaust manifold assembly including at least two manifold part members, an annular end projection of one manifold part member receiving an annular end projection of the other manifold part member to form a connection portion, further including (a) an annular slidable tubular member made of a metal material having good heat resistance and oxidation resistance and inserted into a gap between the annular end projections of both manifold part members; and (b) a flexible pipe having a corrugated pipe portion and tubular portions integrally extending from both ends of the corrugated pipe portion, the tubular portions of the flexible pipe being continuously welded to outer surfaces of the manifold part members, whereby the connection portion is completely sealed by the flexible pipe.

摘要翻译： 包括至少两个歧管部件的排气歧管组件，一个歧管部件的环形端部突出部，其接收另一个歧管部件的环形端部突起以形成连接部分，还包括（a）环形可滑动管状部件， 金属材料具有良好的耐热性和抗氧化性，并插入到两个歧管部件的环形端部突起之间的间隙中; 和（b）柔性管，其具有波纹管部和从波纹管部的两端一体延伸的管状部，柔性管的管状部连续地焊接在歧管部件的外表面，由此连接部为 完全由柔性管密封。

公开(公告)号：US5625413A

公开(公告)日：1997-04-29

申请号：US470010

申请日：1995-06-06

申请人： Minoru Katoh ,  Kenji Itoh ,  Hiroyasu Ohtsubo

发明人： Minoru Katoh ,  Kenji Itoh ,  Hiroyasu Ohtsubo

IPC分类号： H04N5/232 ,  H04N5/228 ,  H04N5/335 ,  H04N5/361 ,  H04N5/365 ,  H04N5/367 ,  H04N5/369 ,  H04N5/372 ,  H04N5/378 ,  H04N9/64

CPC分类号： H04N5/367 ,  H04N5/3656 ,  H04N5/372

摘要： When defective pixels of a solid state image pickup device of a video camera are corrected by signal processes, a white spot noise is detected by closing an iris and by comparing the signal level and a level of only a dark current. Further, in this case, a gain of an AGC circuit for controlling a gain of a video signal is raised and a precise detection is executed. By executing such a detecting operation at the time of turn-on or turn-off of a power source, the user is not annoying. In the ordinary photographing, a reference level in detection of a white spot noise is set to an optimum value in accordance with a temperature of the solid state image pickup device or its peripheral temperature or the gain of the AGC circuit so that the white spot noise detection is not influenced by the temperature of the solid state image pickup device or the operating state of the AGC circuit.

摘要翻译： 当通过信号处理校正摄像机的固态图像拾取装置的缺陷像素时，通过闭合光圈并通过比较信号电平和仅暗电流的电平来检测白点噪声。 此外，在这种情况下，提高用于控制视频信号的增益的AGC电路的增益，并且执行精确的检测。 通过在电源的接通或断开时执行这种检测操作，用户不烦人。 在普通拍摄中，根据固体摄像装置的温度或其周围温度或AGC电路的增益，将白点噪声检测的基准电平设定为最佳值，使得白点噪声 检测不受固态图像拾取装置的温度或AGC电路的操作状态的影响。