Plasma CVD method
    53.
    发明授权
    Plasma CVD method 失效
    等离子体CVD法

    公开(公告)号:US06281147B1

    公开(公告)日:2001-08-28

    申请号:US09457128

    申请日:1999-12-07

    IPC分类号: H01L2131

    摘要: In a process of forming a silicon oxide film 116 that constitutes an interlayer insulating film with TEOS as a raw material through the plasma CVD method, the RF output is oscillated at 50 W, and the RF output is gradually increased from 50 W to 250 W (an output value at the time of forming a film) after discharging (after the generation of O2-plasma). A TEOS gas is supplied to start the film formation simultaneously when the RF output becomes 250 W, or while the timing is shifted. As a result, because the RF power supply is oscillated at a low output when starting discharging, a voltage between the RF electrodes can be prevented from changing transitionally and largely.

    摘要翻译: 在通过等离子体CVD法形成以TEOS为原料的层间绝缘膜形成氧化硅膜116的过程中,RF输出以50W振荡,RF输出从50W逐渐升高到250W (形成膜时的输出值)(放电后)(O 2等离子体生成后)。 当RF输出变为250W时,或当定时偏移时,提供TEOS气体同时开始成膜。 结果,由于在开始放电时RF电源以低输出振荡,因此可以防止RF电极之间的电压在很大程度上发生变化。

    Method of manufacturing a semiconductor device
    54.
    发明授权
    Method of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US06228751B1

    公开(公告)日:2001-05-08

    申请号:US08706667

    申请日:1996-09-06

    IPC分类号: H01L27108

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。

    Method of manufacturing a semiconductor device
    58.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07393723B2

    公开(公告)日:2008-07-01

    申请号:US10793909

    申请日:2004-03-08

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。