公开(公告)号：US20080036094A1

公开(公告)日：2008-02-14

申请号：US11896580

申请日：2007-09-04

申请人： Yoshihiro Yoneda

发明人： Yoshihiro Yoneda

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/10 ,  H01L23/13 ,  H01L23/564 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H05K3/303 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/10674 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： This disclosure provides a technique that prevents debonding at an interface between a functional device and a resin on reflow soldering in a functional device-mounted module requiring a hollow structure. Also disclosed is a functional device having a functional portion mounted on a substrate formed with predetermined wiring patterns, wherein the functional portion of the functional device is arranged in a receiving space, and the substrate is provided with a hole which communicates with the receiving space and a solder-introducing portion made of a metallic material compatible with solder. During solder reflowing, the functional device-mounted module is placed on a mounting substrate such that the solder-introducing portion of the functional device-mounted module contacts a solder paste, and solder is melted with heat. Water inside the receiving space is thus discharged, and solder is introduced into the hole due to surface tension, and the interior of the receiving space is sealed.

摘要翻译： 本公开提供了一种在需要中空结构的功能装置安装的模块中防止回流焊上的功能元件与树脂之间的界面脱粘的技术。 还公开了具有安装在形成有预定布线图案的基板上的功能部分的功能装置，其中功能装置的功能部分布置在接收空间中，并且基板设置有与接收空间连通的孔， 由与焊料相容的金属材料制成的焊料引入部。 在焊锡回流期间，功能元件安装模块被放置在安装基板上，使得功能元件安装模块的焊料引入部分接触焊膏，并且焊料被热熔化。 接收空间内的水因此被排出，并且由于表面张力将焊料引入孔中，并且容纳空间的内部被密封。

公开(公告)号：US20060273421A1

公开(公告)日：2006-12-07

申请号：US11259196

申请日：2005-10-27

申请人： Nami Yasuoka ,  Haruhiko Kuwatsuka ,  Toru Uchida ,  Yoshihiro Yoneda

发明人： Nami Yasuoka ,  Haruhiko Kuwatsuka ,  Toru Uchida ,  Yoshihiro Yoneda

IPC分类号： H01L31/107

CPC分类号： H01L31/1864 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/035281 ,  H01L31/107 ,  H01L31/1075

摘要： In order to improve reliability by preventing an edge breakdown in a semiconductor photodetector having a mesa structure such as a mesa APD, the semiconductor photodetector comprises a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, the mesa structure including a light absorbing layer for absorbing light, an electric field buffer layer for dropping an electric field intensity, an avalanche multiplication layer for causing avalanche multiplication to occur, and a second semiconductor layer of the second conduction type, wherein the thickness of the avalanche multiplication layer at the portion in the vicinity of the side face of the mesa structure is made thinner than the thickness at the central portion of the mesa structure.

摘要翻译： 为了通过防止具有诸如台面APD的台面结构的半导体光电探测器中的边缘击穿来提高可靠性，半导体光电检测器包括形成在形成在半导体衬底上的第一导电类型的第一半导体层上的台面结构，台面 包括用于吸收光的光吸收层的结构，用于降低电场强度的电场缓冲层，用于引起雪崩倍增的雪崩倍增层和第二导电类型的第二半导体层，其中雪崩的厚度 在台面结构的侧面附近的部分的倍增层比台面结构的中央部分的厚度薄。

公开(公告)号：US07105798B2

公开(公告)日：2006-09-12

申请号：US10665259

申请日：2003-09-22

申请人： Gang Wang ,  Yoshihiro Yoneda

发明人： Gang Wang ,  Yoshihiro Yoneda

IPC分类号： H01L31/00

CPC分类号： H01L27/1443 ,  H01L31/02019 ,  H01L31/105 ,  H01L31/107 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light-receiving device includes: a substrate that has a first surface and a second surface facing each other; a first semiconductor layer that is formed on the first surface of the substrate and includes at least one semiconductor layer of a first conductivity type; a light absorption layer that is formed on the first semiconductor layer and generates carriers in accordance with incident light; a second semiconductor layer that is formed on the light absorption layer and includes at least one semiconductor layer of a second conductivity type; a first electrode part that is electrically connected to the first semiconductor layer and applies a first potential thereto; a second electrode part that is electrically connected to the second semiconductor layer and applies a second potential thereto; and a third semiconductor layer of the second conductivity type that is interposed between the first surface of the substrate and the first semiconductor layer.

摘要翻译： 半导体光接收装置包括：具有彼此面对的第一表面和第二表面的基板; 第一半导体层，其形成在所述基板的所述第一表面上，并且包括至少一个第一导电类型的半导体层; 形成在第一半导体层上并根据入射光产生载流子的光吸收层; 第二半导体层，其形成在所述光吸收层上并且包括至少一个第二导电类型的半导体层; 电连接到第一半导体层并向其施加第一电位的第一电极部分; 电连接到第二半导体层并向其施加第二电位的第二电极部分; 以及介于基板的第一表面和第一半导体层之间的第二导电类型的第三半导体层。

公开(公告)号：US06717069B2

公开(公告)日：2004-04-06

申请号：US09820470

申请日：2001-03-29

申请人： Yoshihiro Yoneda

发明人： Yoshihiro Yoneda

IPC分类号： H05K111

CPC分类号： H01L24/16 ,  H01L23/49822 ,  H01L2224/10175 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/3841 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0023 ,  H05K3/184 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/09781 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A surface-mounting substrate, for mounting thereon a part such as a semiconductor device, which comprises a core substrate, a plurality of layers of patterned wiring lines, which are separated from each other by an insulation layer interposed therebetween, vias piercing through the insulation layer to connect the wiring lines at the adjacent layers to each other, and a layer of connecting terminals to mount a part on the surface-mounting substrate, each of the connecting terminals connecting with the wiring line at the outermost layer of wiring lines, wherein the connecting terminal is filled in an outermost insulation layer provided at the surface of the surface-mounting substrate, and has a surface exposed at substantially the same level as the level of the surface of the outermost insulation layer. A structure comprising a surface-mounting substrate and a part mounted thereon, which comprises, as the substrate used, the surface-mounting substrate of the invention, is also disclosed.

摘要翻译： 表面安装基板，用于在其上安装诸如半导体器件的部件，其包括芯基板，多层图案化布线，它们之间通过绝缘层彼此分离，通孔穿过绝缘体 层，将相邻层的布线彼此连接，以及一层连接端子，以在表面安装基板上安装部件，每个连接端子与布线的最外层的布线连接，其中 连接端子填充在设置在表面安装基板的表面的最外层绝缘层，并且具有以与最外层绝缘层的表面水平基本相同的水平露出的表面。 还公开了一种包括表面安装基板和安装在其上的部件的结构，其包括作为所使用的基板的本发明的表面安装基板。

公开(公告)号：US06700208B1

公开(公告)日：2004-03-02

申请号：US09691327

申请日：2000-10-18

申请人： Yoshihiro Yoneda

发明人： Yoshihiro Yoneda

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/4943 ,  H01L2224/81385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A surface mounting substrate is configured to surface mount a semiconductor element thereon, the semiconductor element having a plurality of protruding electrodes arranged in a staggered arrangement of two rows. A plurality of bonding pads formed on a substrate are arranged in a staggered arrangement corresponding to the staggered arrangement of the protruding electrodes of the semiconductor element. Each of the bonding pads includes a pad portion having a substantially uniform width and an end portion extending from the pad portion toward the other row of the bonding pads. The end portion of each of the bonding pads lacks a portion extending beyond a boundary between the end portion and the pad portion of the bonding pads arranged in the other row. Accordingly, a reliable mounting can be achieved even if the protruding electrodes are offset from bonding pads.

摘要翻译： 表面安装基板被配置为在其上表面安装半导体元件，所述半导体元件具有以两列交错布置的布置的多个突起电极。 形成在基板上的多个接合焊盘以对应于半导体元件的突出电极的交错布置的交错布置布置。 每个接合焊盘包括具有基本均匀宽度的焊盘部分和从焊盘部分朝向焊盘的另一排延伸的端部。 每个接合焊盘的端部缺少延伸超过布置在另一排中的接合焊盘的端部和焊盘部分之间的边界的部分。 因此，即使突出电极偏离接合焊盘，也可以实现可靠的安装。

公开(公告)号：US4970042A

公开(公告)日：1990-11-13

申请号：US393051

申请日：1989-08-08

申请人： Hiroshi Kakiuchi ,  Setsuo Fukuhara ,  Michinobu Fujiwara ,  Hiroshi Maeda ,  Yutaka Shirakashi ,  Osamu Asakura ,  Yoshihiro Yoneda ,  Tetsuo Noda ,  Naoyuki Fujita

发明人： Hiroshi Kakiuchi ,  Setsuo Fukuhara ,  Michinobu Fujiwara ,  Hiroshi Maeda ,  Yutaka Shirakashi ,  Osamu Asakura ,  Yoshihiro Yoneda ,  Tetsuo Noda ,  Naoyuki Fujita

IPC分类号： A41G3/00 ,  D01D5/088 ,  D01D5/253 ,  D01F1/10 ,  D01F6/60

CPC分类号： A41G3/0083 ,  D01D5/0885 ,  D01D5/253 ,  D01F1/10 ,  D01F6/60 ,  Y10T428/2927 ,  Y10T428/2973 ,  Y10T428/2978

摘要： A synthetic fiber having an uneven surface structure consisting of wrinkles having ridges and recesses of the surface of the fiber and not presenting specular luster, which may be used, for example, as artificial hair for wigs, can be produced easily and stably by melt-spinning a starting synthetic resin such as nylon and passing the spun monofilament through a cooling bath at a temperature not lower than 30.degree. C. for a period of time sufficient for developing wrinkles in its surface. Inclusion of a pigment such as carbon black in an appropriate amount in the starting material is effective in providing dense distribution of wrinkles.

公开(公告)号：US08964809B2

公开(公告)日：2015-02-24

申请号：US13597375

申请日：2012-08-29

申请人： Yoshihiro Yoneda ,  Masaki Yanagisawa ,  Kenji Koyama ,  Hirohiko Kobayashi ,  Kenji Hiratsuka

发明人： Yoshihiro Yoneda ,  Masaki Yanagisawa ,  Kenji Koyama ,  Hirohiko Kobayashi ,  Kenji Hiratsuka

IPC分类号： H01S5/00 ,  H01S5/024 ,  H01S5/026 ,  H01S5/06 ,  H01S5/227 ,  H01S5/042 ,  H01S5/0625 ,  H01S5/343 ,  H01S5/20

CPC分类号： H01S5/02461 ,  B82Y20/00 ,  H01S5/0261 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/209 ,  H01S5/2275 ,  H01S5/3434

摘要： A semiconductor optical integrated device includes a substrate having a main surface with a first and second regions arranged along a waveguiding direction; a gain region including a first cladding layer, an active layer, and a second cladding layer arranged on the first region of the main surface; and a wavelength control region including a third cladding layer, an optical waveguide layer, and a fourth cladding layer arranged on the second region of the main surface and including a heater arranged along the optical waveguide layer. The substrate includes a through hole extending from a back surface of the substrate in the thickness direction and reaching the first region. A metal member is arranged in the through hole. The metal member extends from the back surface of the substrate in the thickness direction and is in contact with the first cladding layer.

摘要翻译： 半导体光学集成器件包括具有沿着波导方向布置的具有第一和第二区域的主表面的衬底; 包括布置在所述主表面的第一区域上的第一包层，有源层和第二包层的增益区域; 以及包括布置在主表面的第二区域上的第三包层，光波导层和第四包层的波长控制区域，并且包括沿着光波导层布置的加热器。 基板包括从基板的厚度方向的背面延伸并到达第一区域的通孔。 金属构件布置在通孔中。 金属部件在厚度方向上从基板的背面延伸并与第一包覆层接触。

公开(公告)号：US08565131B2

公开(公告)日：2013-10-22

申请号：US13101825

申请日：2011-05-05

申请人： Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Kazuo Takada ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Masahiro Sueyoshi

发明人： Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Kazuo Takada ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Masahiro Sueyoshi

IPC分类号： H04B7/00

CPC分类号： H04L63/18 ,  H04L63/0492 ,  H04L63/08 ,  H04W4/21 ,  H04W12/06 ,  H04W92/18

摘要： A communication device has a first communication section that supports a first communication mode having a low communication rate and a second communication section that supports a second communication mode having a higher communication rate than the first communication mode. The communication device includes a packet generation section and a communication control section. The packet generation section generates a first portion containing authentication information used for connection authentication for the second communication mode and a second portion other than the first portion. The communication control section performs control to cause the first communication section to transmit the first portion and to cause the second communication section to transmit the second portion after the connection authentication succeeds using the authentication information contained in the first portion.

摘要翻译： 通信装置具有支持具有低通信速率的第一通信模式的第一通信部分和支持具有比第一通信模式更高通信速率的第二通信模式的第二通信部分。 通信设备包括分组产生部分和通信控制部分。 分组产生部分生成包含用于第二通信模式的连接认证的认证信息的第一部分和除了第一部分之外的第二部分。 通信控制部进行控制，使得第一通信部发送第一部分，并且在使用包含在第一部分中的认证信息进行连接认证成功之后使第二通信部发送第二部分。

公开(公告)号：US08301124B2

公开(公告)日：2012-10-30

申请号：US12365379

申请日：2009-02-04

申请人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa

发明人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa

IPC分类号： H04M3/42

CPC分类号： H04M1/7253 ,  H04M1/72558 ,  H04M2250/02 ,  H04M2250/06 ,  H04W84/18

摘要： An information processing apparatus for communicating with a different information processing apparatus, includes: a first connection establishment block configured to control a first communication section, which carries out nearby wireless communication for delivering and accepting information to and from the different information processing apparatus positioned near to the information processing apparatus, to establish a connection for the nearby wireless communication; an acquisition block configured to acquire setting information for short range wireless communication which exhibits a wire communication range than the nearby wireless communication and capability information regarding the capacity of the different information processing apparatus from the different information processing apparatus through the nearby wireless communication; and a second connection establishment block configured to control a second communication section, which carries out the short range wireless communication, based on the setting information and the capability information to establish a connection for the short range wireless communication.

摘要翻译： 一种用于与不同的信息处理装置进行通信的信息处理装置，包括：第一连接建立块，被配置为控制第一通信部分，其执行附近的无线通信，用于向位于附近的不同信息处理装置传送和接收信息; 信息处理装置，用于建立附近无线通信的连接; 获取块，被配置为从不同的信息处理设备通过附近的无线通信获取与不同的信息处理设备的容量相关的与附近的无线通信相关的有线通信范围的短距离无线通信的设置信息和能力信息; 以及第二连接建立块，其被配置为基于所述设置信息和能力信息来控制执行所述短距离无线通信的第二通信部分，以建立所述短距离无线通信的连接。

公开(公告)号：US08135343B2

公开(公告)日：2012-03-13

申请号：US12480295

申请日：2009-06-08

申请人： Seiji Kuroda ,  Isao Soma ,  Yasuharu Ishikawa ,  Kazuo Takada ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

发明人： Seiji Kuroda ,  Isao Soma ,  Yasuharu Ishikawa ,  Kazuo Takada ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

IPC分类号： H04B5/00

CPC分类号： G06Q10/06 ,  G06Q10/10 ,  H04L67/14 ,  H04L67/147 ,  H04W8/02 ,  H04W84/18

摘要： An information management apparatus includes a communication unit configured to receive, from a plurality of communication processing apparatuses, a plurality of pieces of communication history data of near-field communication performed in the plurality of communication processing apparatuses; a data comparison unit configured to perform comparison of the plurality of pieces of communication history data received by the communication unit; and a data registration unit configured to register a plurality of pieces of user information associated with the plurality of communication processing apparatuses as a group in a database on condition that it is verified by the data comparison unit, in accordance with the plurality of pieces of communication history data of the near-field communication, that near-field communication has been performed between the plurality of communication processing apparatuses.

摘要翻译： 信息管理装置包括：通信单元，被配置为从多个通信处理装置接收在所述多个通信处理装置中执行的近场通信的多条通信历史数据; 数据比较单元，被配置为执行由所述通信单元接收的所述多条通信历史数据的比较; 以及数据登记单元，被配置为在数据比较单元验证的条件下，根据多条通信信息，将与多个通信处理装置相关联的多条用户信息作为一组登记在数据库中 近场通信的历史数据，在多个通信处理装置之间进行了近场通信。