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1533 条记录 (耗时 0.043 秒)

    Electrical and/or electronic device with elastic contact element
    52.
    发明授权
    Electrical and/or electronic device with elastic contact element 有权
    具有弹性接触元件的电气和/或电子设备

    公开(公告)号：US08519531B2

    公开(公告)日：2013-08-27

    申请号：US13514399

    申请日：2010-12-14

    申请人： Eric Pilat ,  Alexandre Vachez

    发明人： Eric Pilat ,  Alexandre Vachez

    IPC分类号： H01L23/043

    CPC分类号： B32B17/10788 ,  B32B17/10018 ,  B32B17/10036 ,  B32B2327/12 ,  B32B2367/00 ,  H01L31/0481 ,  H01L31/0488 ,  Y02E10/50

    摘要： An electrical and/or electronic device including: an electrical and/or electronic component; two layers of material forming front and back faces of the device and between which the electrical and/or electronic component is encapsulated, the component including at least two opposite faces placed facing the two layers of material; an electrical contact element placed in contact with one of the faces of the electrical and/or electronic component; an element based on at least one elastic material placed between one of the two layers of material and the electrical contact element, forming a first layer of elastic material covering the one of the two layers of material; and a second layer based on at least one elastic material with an elastic stiffness less than the stiffness of the elastic material in the first layer, placed in contact with the first layer of elastic material.

    摘要翻译： 一种电气和/或电子设备，包括：电气和/或电子部件; 两层材料形成装置的前表面和后表面，并且电气和/或电子部件被封装在其间，该部件包括面向两层材料的至少两个相对的面; 与所述电气和/或电子部件的一个面接触放置的电接触元件; 基于放置在两层材料之一和电接触元件之间的至少一种弹性材料的元件，形成覆盖两层材料之一的第一弹性材料层; 以及基于弹性刚度小于第一层中的弹性材料的刚度的至少一种弹性材料的第二层，放置成与第一层弹性材料接触。

    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER
    54.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号：US20130118583A1

    公开(公告)日：2013-05-16

    申请号：US13667744

    申请日：2012-11-02

    申请人： Dow Global Technologies LLC

    发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

    IPC分类号： H01L31/048 ,  H01L31/18

    CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

    摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

    Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally Silane
    56.
    发明申请
    Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally Silane 审中-公开
    包含非均相聚烯烃共聚物和任选的硅烷的电子器件模块

    公开(公告)号：US20130087198A1

    公开(公告)日：2013-04-11

    申请号：US13703405

    申请日：2011-06-15

    申请人： John A. Naumovitz ,  Debra H. Niemann ,  Rajen M. Patel ,  Shaofu Wu

    发明人： John A. Naumovitz ,  Debra H. Niemann ,  Rajen M. Patel ,  Shaofu Wu

    IPC分类号： H01L31/0203 ,  H05K1/03

    CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  B32B17/10788 ,  C08L23/0815 ,  C08L2203/204 ,  H01L31/0481 ,  H05K1/032 ,  Y02E10/50

    摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer characterized as having has an average Mv and a valley temperature between the interpolymer and high crystalline fraction, Thc, such that the average Mv for a fraction above Thc from ATREF divided by average Mv of the whole polymer from ATREF (Mhc/Mp) is less than about 1.95 and wherein the copolymer has a CDBI of less than 60%, (2) optionally, a vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (4) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.

    摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）聚烯烃共聚物， 具有在互聚物和高结晶部分Thc之间具有平均Mv和谷值温度，使得在ATREF之上的Thc以上的分数的平均Mv除以ATREF（Mhc / Mp）之外的整个聚合物的平均Mv小于 约1.95，并且其中所述共聚物的CDBI小于60％，（2）任选的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％ 共聚物，和（4）任选地，基于共聚物的重量，至少约0.05重量％的助剂。